JPS6291578A - Adhesive resin composition - Google Patents

Abstract

PURPOSE:To obtain the titled composition having good adhesiveness to an olefin resin and a styrene resin and excellent heat resistance, by mixing a propylene polymer, an ethylene-vinyl acetate copolymer, and a specified hydrogenated block copolymer. CONSTITUTION:1-20wt% at least one propylene polymer (A) having an MFR of 0.01-100g/10min, selected from among a propylene homopolymer, a random copolymer of propylene with ethylene or an alpha-olefin containing 20wt% or less ethylene or alpha-olefin, and a block copolymer of propylene with ethylene or an alpha-olefin is melt-compounded at 160-300 deg.C with 55-98wt% ethylene-vinyl acetate copolymer (B) having a vinyl acetate content of 5-35wt% and an MFR of 0.5-40g/10min, and 1-25wt% hydrogenated block copolymer (C) of a vinyl aromatic compound with a conjugated diene having a vinyl aromatic compound content of 5-85wt%, an MI of 20g/10min or less, and a degree of hydrogenation of 70% or more.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an adhesive resin composition having good adhesion to both olefin resins (especially propylene resins) and styrene resins. More specifically,
(A) at least one propylene polymer selected from the group consisting of a propylene homopolymer, a random copolymer of propylene and ethylene or an α-olefin, and a block copolymer of propylene and ethylene or an α-olefin; It relates to an adhesive resin composition consisting of a hydrogenated product of (B) a copolymer of ethylene and vinyl acetate and (C) a block copolymer of a vinyl aromatic compound and a conjugated diene, and includes an olefin resin and styrene. It has good adhesion to both resins and molded products of these (e.g.

The purpose of this invention is to provide a resin composition that has good adhesion to (films, sheets, foams).

Synthetic resins, which are widely used as packaging materials, have recently become more diversified in packaging applications, and in order to satisfy all of the performance requirements, the performance of individual resins has been combined. Multilayer structures are being studied and are increasingly being used in the market.

Films, sheets, and foams obtained by molding styrenic resins have the advantage of being relatively low cost, in addition to the good rigidity inherent to styrene resins and the molding process. Currently, it is widely used as containers for various types of fruits and vegetables.

It has the disadvantage of poor heat resistance and oil resistance.

On the other hand, as is well known, olefin resins have relatively good oil resistance, and among these olefin resins, high-density polyethylene and propylene resins in particular have better heat resistance than styrene resins. However, there is a problem that it is inferior to styrene resin in terms of rigidity.

For these reasons, various multilayer structures of olefin resins and styrene resins have been proposed in order to improve the oil resistance and heat resistance of various molded products made of styrene resins.

Originally, olefin resins and styrene resins.

To obtain these multilayer structures, an adhesive layer is essential between them, since their mutual adhesion is very poor. Conventionally, this adhesive layer is mainly made of hot melt copolymer of ethylene and vinyl acetate (hereinafter referred to as REVAJ),
Alternatively, using a solution type adhesive mainly based on the EVA system, for example, polypropylene film (hereinafter referred to as rCPP) can be used.
Generally, EVA shows good adhesion with olefin resins (especially ethylene polymers), but it is difficult to obtain good adhesion with styrene resins. The content of vinyl acetate in the EVA must be about 35% by weight or more, and such EVA
not only has a strong vinyl acetate odor, but also has poor thermal stability and problems with extrusion stability.

In order to improve these problems, for example, a butadiene-styrene copolymer (for example, JP-A-49-33973, JP-A-55-12) is used as the adhesive layer of the multilayer structure.
8449), styrene-inprene block copolymer (JP-A-55-14209), ethylene-acrylic acid alkyl ester copolymer (JP-A-55-85751), vinyl aromatic compound-conjugated diene compound A graft modification of a block copolymer (for example, a block copolymer of styrene and butadiene or isoprene) with an unsaturated carboxylic acid has been proposed (Japanese Patent Application Laid-open No. 87551/1983). However, although these adhesive layers exhibit fairly good adhesion with styrene resins, their adhesion with olefin resins (especially propylene resins) is insufficient, especially when the total thickness is 0. .2mm or less,
In addition, when the molding speed of composite is high, the adhesion with propylene resin and styrene resin is not necessarily satisfactory, and the value of the lower of the adhesion is at most 1.
00 to 130 g/15 mm, which is insufficient from a practical point of view. With this level of adhesion, it is possible to fill a variety of containers molded with multilayered structures obtained using these adhesive layers with, for example, food and subject them to high-temperature heat treatment at a temperature of 100 to 130°C for several minutes. In this case, a peeling phenomenon of the adhesive layer is observed, and the functionality and commercial value are significantly reduced.

A method has also been proposed in which a film coated with an EVA adhesive is bonded to a polypropylene film. However, when this film is thermally laminated to a styrene resin sheet or foam, the adhesive strength is approximately 1.
00 g / 15 mm, which is insufficient in adhesion, and not only is there uneven adhesion, but the heat resistance is also poor, and the cost of the film itself coated with the adhesive is high, making it disadvantageous from an economic point of view. It is.

Based on these facts, some of the present inventors conducted various searches to solve the above problems, and found that (A) a propylene polymer, (B) EVA, and (C) a vinyl aromatic compound conjugated with An adhesive composition consisting of a block copolymer with a diene can be used with styrene resins and olefin resins (
In particular, the adhesive composition not only has good adhesion to both olefin resins (especially propylene resins) or styrene resin moldings, A sheet or film of two types and two layers, or a sheet or film of three types and three layers, with the adhesive resin composition as an intermediate layer and molded products of olefin resin (especially propylene resin) and styrene resin as outer layers, respectively. A multilayer structure can also be produced by thermally bonding the film, sheet or foam made of styrene resin or molded product made of olefin resin (hereinafter referred to as "substrate") under certain conditions. It was previously proposed that it exhibits oil resistance and good performance even when heated in a microwave oven.

This adhesive composition not only exhibits sufficient adhesion to both styrene resins and olefin resins, but also has excellent heat resistance. When manufacturing a two-layer film or sheet with a resin or a three-layer film or sheet with an olefin resin and a styrene resin with the adhesive composition as an intermediate layer, the adhesive composition is molded. It was found that there were considerable difficulties in terms of processability.

That is, even if a multilayer film is produced by a simultaneous coextrusion method, or a two-layer film is produced by extrusion lamination of an adhesive composition onto a CPP film or sheet, a styrene resin film and a CPP film may be produced. Even when producing films or sheets of three types and three layers by the so-called sandwich lamination method (polysand method) in which the adhesive composition is melt-extruded and thermally bonded during the melt extrusion process, unevenness in ejection of the adhesive composition is significant; It was found that the behavior is extremely unstable, causing thickness unevenness in the adhesive composition layer, making it difficult to obtain a laminated film with little thickness unevenness and good appearance.

The cause of this is currently under investigation, but the conjugated diene portion of the block copolymer of the vinyl aromatic compound and conjugated diene in the adhesive composition is unstable to heat, so It is presumed that this is due to structural changes occurring at high speeds.

Naturally, uneven thickness of the adhesive composition, which is the adhesive layer, causes uneven adhesive strength with the adherend and uneven tension during lamination, resulting in wrinkled multilayer structures. There is a risk that the product will be damaged, and the overall product value will decrease.

But −. 8 From the above, 1. the present invention does not have these drawbacks (problems), that is, it not only has excellent heat resistance, but also styrene resin molded products (e.g. foams, sheets), olefin resin. It not only has well-balanced and practical adhesion (at least 150 g / 155 m, preferably 200 g / 15 m or more) for molded products, and does not exhibit thermal peeling phenomenon when heat treated at high temperatures. The objective is to obtain a resin composition with good molding stability (discharge unevenness, thickness unevenness, etc.).

. According to the present invention, these problems are solved by (A) propylene homopolymers, random copolymers of propylene and ethylene or α-olefins, and block copolymers of propylene and ethylene or α-olefins. At least one propylene polymer selected from the group consisting of polymers.

(B) The vinyl acetate content is 5 to 35% by weight, and the melt flow rate (measured under conditions 4 according to JIS K8730, hereinafter referred to as rMFRJ) is 0.
．． Copolymer of ethylene and vinyl acetate (hereinafter referred to as "ethylene-vinyl acetate copolymer")
) and (C) a hydrogenated block copolymer of a vinyl aromatic compound and a conjugated diene, and the proportion of the propylene polymer in the composition is 1 to 20% by weight. An adhesive resin composition wherein the composition ratio of a hydrogenated block copolymer of a vinyl aromatic compound and a conjugated diene is 1 to 25% by weight, and the remainder is an ethylene-vinyl acetate copolymer.

It can be solved by The present invention will be explained in detail below.

(A) Propylene polymer The propylene polymer used in the present invention includes a propylene homopolymer, a random copolymer of propylene and "ethylene or α-olefin" (hereinafter referred to as "comonomer"), and a copolymer of propylene and a comonomer. selected from block copolymers of The copolymerization ratio of the comonomer, whether random copolymer or block copolymer, is usually at most 20% by weight, preferably 15% by weight or less, and the number of carbon atoms in the comonomer is generally at most 20% by weight. 1
Typical examples include ethylene, butene-1, hexene-1,4-methylpentene-1, and ethylene is particularly preferred.The melt flow rate of the propylene polymer (measured according to JIS K13758,
(hereinafter referred to as r MFRJ) is usually 0.01 to 100g
/10 minutes, preferably 0.05 to 80 g/10 minutes, particularly preferably 0.1 to 50 g/10 minutes. MFR of propylene polymer is 0.01 g/1
If the time is less than 0 minutes, not only will crosstalk be poor when producing the composition of the present invention, but it will also be difficult to obtain a uniform composition, resulting in variations in adhesive properties. on the other hand,
If a propylene polymer exceeding 100 g/10 minutes is used, not only the thermal stability of the resulting composition will be poor, but also the extrusion process stability will be poor.

(B) Ethylene-vinyl acetate copolymer The vinyl acetate content (copolymerization ratio) of the ethylene-vinyl acetate copolymer used in the present invention is 5 to 3.
5% by weight, preferably 10-30% by weight, especially 1
5 to 25% by weight is preferred. If the copolymerization ratio of vinyl acetate in the ethylene-vinyl acetate copolymer is less than 5% by weight, the adhesion to propylene polymers and styrene polymers will be poor. on the other hand.

If an ethylene-vinyl acetate copolymer with a copolymerization ratio exceeding 35% by weight is used, the odor of vinyl acetate will be significant as described above, and thermal stability and extrusion processing stability will be lacking.

MFR of this ethylene-vinyl acetate copolymer (JIS
Measured according to K8730) is 0.5-40g/1
0 minutes, preferably 1-30 g/10 minutes,
Particularly suitable is 2 to 25 g/10 minutes. MFR of ethylene-vinyl acetate copolymer is 0.5 g/
In less than 10 minutes.

Poor crosstalk with propylene-based polymers and hydrogenated block copolymers of styrene and conjugated diene;
It is difficult to obtain a composition with a uniform composition, resulting in variations in adhesive properties. On the other hand, when an ethylene-vinyl acetate copolymer having an MFR of more than 40 g and 710 minutes is used, the resulting composition has a high melt flow rate and poor molding stability.

(C) Hydrogenated product of a block copolymer of a vinyl aromatic compound and a conjugated diene Further, for producing a hydrogenated product of a block copolymer of a vinyl aromatic compound and a conjugated diene used in the present invention The block copolymers used are conjugated diene compounds such as habtadiene and isoprene, and vinyl aromatic compounds such as styrene, α-methylstyrene, and vinyltoluene (
Among them, styrene is preferred).

The form of the block is single block copolymer,
Teleblock copolymers, radial teleblock copolymers, multi-block copolymers, etc. may be used, and any of these block copolymers may be used. The polymerization ratio is usually 5~
85% by weight, preferably 5 to 80% by weight, particularly preferably 10 to 80% by weight. If the copolymerization ratio of the vinyl aromatic compound is less than 5% by weight, the adhesion to the styrene resin will be poor. On the other hand, if it exceeds 85% by weight, the adhesiveness of the propylene polymer will be poor.

By highly hydrogenating the conjugated diene moiety in the above block copolymer, part or all of the two types of bonds in the main chain are saturated.

The proportion of the main addition of the hydrogenated block copolymer of the present invention is usually 70% or more, preferably 90% or more, and particularly preferably 95% or more. If the hydrogenation rate is less than 70%, the molding of the resulting composition will lack stability.

In addition, the melt index of the hydrogenated block copolymer (according to ASTM 01238, one condition is G
Measured at rM, 1. J) is 20g 7
It is 10 minutes or less, preferably 15 g/10 minutes or less.

If a block copolymer with (i) exceeding 20 g/10 minutes is used, the resulting composition will have a high melt flow rate and poor molding stability.

(D) Composition ratio The composition ratio of the propylene polymer in the composition obtained by the present invention is 1 to 20% by weight, and 2 to 20% by weight.
If the proportion of the propylene polymer in the composition is preferably less than 1% by weight, the resulting composition will have poor adhesion to the olefin resin. Not only that, but the heat resistance of the composition is not good.
On the other hand, if it exceeds 20% by weight, the adhesiveness of the resulting composition to the styrene resin will decrease. That is, the purpose of blending the propylene polymer in the above composition range in the present invention is to provide adhesiveness with the olefin resin and further improve heat resistance.

Further, the composition ratio of the hydrogenated block copolymer of a vinyl aromatic compound and a conjugated diene is 1 to 25% by weight,
2 to 25% by weight is desirable, especially 5 to 25% by weight.
Even when the composition ratio of the block copolymer in the monomorphic composition is less than 1% by weight or more than 25% by weight, the adhesion strength, especially with styrene resins, is poor.

From the above, it can be seen that ethylene-
The composition ratio of the vinyl acetate copolymer is 55 to 88% by weight, preferably 55 to 88% by weight, and particularly preferably 55 to 90% by weight. In the present invention, the ethylene-vinyl acetate copolymer is The reason for blending within the composition ratio range is to simultaneously improve the adhesion between the olefin resin and styrene resin; if the upper limit is exceeded or below the lower limit, the adhesion with these resins will not be good. .

(E) Composition production, molding method, etc. In producing the composition of the present invention, the above-mentioned propylene polymer, ethylene-vinyl acetate copolymer, vinyl aromatic compound, and block copolymer with a conjugated diene are used. The hydrogenated product may be uniformly mixed within the above composition ratio range, and at this time, stabilizers against heat or oxygen may be added within a range that does not essentially lose the properties of the composition of the present invention. , lubricant, plasticizer, filler, antistatic agent, flame retardant,
Additives such as pigments (colorants) and adhesion agents may also be included.

As a mixing method, tri-blending may be performed using mixers such as a Henschel mixer, a ribbon mixer, and a tumbler, which are widely used in the field of thermoplastic resins. The mixture may be melt-kneaded using a mixer such as a mill. Among these, the latter method of melt mixing is more preferable as a means of obtaining a more uniform composition, and from an economical point of view, mixing using a single-screw extruder is preferably employed. In addition, if necessary, two screw extruders can be installed.
You may pass it more than once.

Whether the composition of the present invention is melt-kneaded or molded from the composition, the propylene polymer, ethylene-vinyl acetate copolymer, and vinyl aromatic components that are the constituent components of the composition are It is necessary to conduct the test at a temperature at which the hydrogenated block copolymer of the group compound and the conjugated diene melts.

However, these components must be carried out at a temperature at which they do not undergo thermal decomposition. Therefore, the above treatments (melt kneading, molding, etc.) must be carried out at a temperature of 160 to 300°C (preferably 160 to 250°C). It must be implemented within the scope.

Next, regarding the method of obtaining a laminate with a styrene resin and/or olefin resin using the adhesive resin composition of the present invention, the adhesive resin composition (film or sheet) of the present invention, styrenic resin A method in which a layer (film or sheet, hereinafter the same) and an olefin resin layer (film or sheet, the same hereinafter) are manufactured separately in advance and a desired laminate is obtained by thermal lamination, a styrene resin layer or an olefin resin layer A method of extrusion laminating the adhesive resin composition of the present invention, a simultaneous coextrusion method of two types and two layers of a styrene resin or olefin resin and the adhesive resin composition of the present invention, or the adhesive resin composition Although there is a simultaneous co-extrusion method of three types and three layers in which a styrene resin and an olefin resin are used as an intermediate layer and an inner and outer layer of a styrene resin and an olefin resin, the coextrusion method is preferably adopted from an economical viewpoint.

The laminate obtained by the following may be a two-layered product consisting of a layer of the composition of the present invention and a styrene resin layer or an olefin resin layer, or a layer of the composition of the present invention, a styrene resin layer, and an olefin resin layer. It may be composed of three or more layers each having at least one layer (in this case, it is necessary to interpose the composition of the present invention between the styrene resin layer and the olefin resin layer).

The total thickness of the laminate thus obtained is not particularly limited, but is usually 20 microns or more, and from the viewpoint of practical oil resistance and heat resistance, the olefin resin layer is preferably 20 microns or more.

The laminate made of the adhesive resin composition of the present invention obtained as described above has excellent adhesion to both olefin resins and styrene resins, and therefore, as described later, it is preferable to use either of these resins. It may be laminated with the base material,
The laminate and the base material may be laminated with the adhesive resin composition of the present invention interposed between them.Furthermore, these base materials include film-like materials and sheet-like materials,
Foam may also be used.

When laminating a laminate using the adhesive resin composition of the present invention and a molded body of styrene resin and/or olefin resin as a base material as described below, heat bonding or sandwich lamination is performed at a temperature of 180°C or higher. However, it may be carried out at a temperature of 300''O or less.

Methods for producing a multilayer structure of a laminate made of the adhesive resin composition of the present invention and other laminate components (substrates) include commonly used thermal adhesion methods and sandwich lamination methods.

The thermal bonding method uses generally known heat supply methods such as high-pressure steam, electric heat, or a heated roll method that circulates heating oil, as well as a method that uses an oven equipped with an ordinary infrared heater, far-infrared heater, or electric heater. etc.

As an economical method, thermal bonding using a roll is preferred. Other adhesive methods include, for example, a two-layer laminate (film or sheet) of the adhesive resin composition of the present invention and an olefin resin on a styrene resin base material, or a laminate (film or sheet) of the adhesive resin composition of the present invention and the olefin resin, or a styrene resin base material of the present invention. A method of laminating a laminate (film or sheet) of three types and three layers consisting of an adhesive resin composition and an olefin resin using a thermal bonding method or a sandwich lamination method, or a molded body of a styrene resin base material and an olefin resin. (
For example, a method (sandwich lamination) in which the adhesive resin composition of the present invention is melt-extruded from a T-die between the adhesive resin composition (film, sheet), an olefin resin, an adhesive resin composition of the present invention, etc. There is a method of co-extrusion lamination of and a styrene-based resin onto respective base materials, or a method of sequential extrusion lamination.

In any of the above methods, it is necessary to carry out the process at a temperature of 180°C or higher, and if the temperature is lower than 160°C, the adhesion becomes poor and is practically insufficient. Among these methods, there is no need to specify an upper limit temperature for the thermal bonding method, but if conditions are adopted in which the propylene polymer that forms the surface layer is completely melted or partially melted, the appearance or It is desirable to conduct the process at a temperature of 200°C or lower (preferably 190'0°C or lower), as this will result in poor commercial value. However, since the bonding process is usually continuous, the line speed may be affected, or the total The optimum conditions are determined by the thickness.

The multilayer structure obtained as described above may be used in the form of a sheet, but it may also be formed into a desired container depending on the intended use.

The multilayer structure obtained in this way has not only good heat resistance but also excellent oil resistance when the surface layer is an olefin resin layer (especially a propylene resin layer). .

In addition, when the surface layer is made of styrene resin, it not only has high gloss but also has excellent hardness, and can be used in many ways as a base material for packaging.

The present invention will now be explained in more detail with reference to Examples.

In the Examples and Comparative Examples, the adhesive strength was measured using a Tensilon type tensile tester, and the peeling speed was 100+++s.
The resistance value was determined by peeling in a direction of 180 degrees at a speed of 180°/min.

In addition, for the oil resistance test, a tray container was made as a molded product, 1/2 water was poured into the container, 115 cooking oil was added on top of the container, and the container was heated to 130°C for 3 minutes. was determined.

Furthermore, as for molding stability, extrusion unevenness (variation in film thickness) is observed and the results are evaluated using the following four ranks.

■ Very good (thickness variation within ±10%) O good (
Thickness variation ±lO~20%) Δ Fairly bad (thickness variation ±20~50%) × Bad (thickness variation ±50%)
(above) In the Examples and Comparative Examples, the propylene polymer was an ethylene-propylene random copolymer with an ethylene content of 3.3% by weight (MFR8,5
710 minutes, hereafter referred to as "rPP") was used. In addition, as an ethylene-vinyl acetate copolymer, an ethylene-vinyl acetate copolymer (M
FR4.0g/10min.

Hereinafter referred to as rEVAJ) was used. Furthermore, as a hydrogenated product of a block copolymer of styrene and conjugated diene, the hydrogenated product is 89% or more, and the styrene content is 14%.
A hydrogenated product of styrene-ethylene-butylene-styrene block copolymer (M, 1.9 g/10 min, hereinafter referred to as "hydrogenated 5BSJ") was used.For comparison, the styrene content was Styrene-butadiene copolymer rubber (hereinafter referred to as r5BRJ) with a styrene content of 25% by weight, styrene-butadiene-styrene block copolymer rubber with a styrene content of 3911i (31%) (MFR2,3g/
1G (hereinafter referred to as r5BSJ) and ethyl acrylate content of 20% by weight, and a melt flow index (ASTM 01238 method) of 20g.
An ethylene-ethyl acrylate copolymer (hereinafter referred to as rEEAJ) having a temperature of 710 minutes was used.

Examples 1-6. Comparative Examples 1 to 9 PP, EVA, and hydrogenated products or SBS whose blending amounts are shown in Table 1 were triblended in advance for 5 minutes using a Henschel mixer.

Compositions (pellets) were produced by melt-kneading each of the obtained mixtures using an extruder at a temperature of 200 ° C. In order to examine the adhesion of the above compositions to styrene resin and propylene polymer. Using an extruder equipped with three types and three layers of T-dies, the outer layer had an MFR of 2.5 mm under conditions of a molding temperature of 220°C and a line speed of 12 m/min.
8 g/lo of styrene homopolymer (CP), as intermediate layer the above composition or SBR (comparative example) or EE
A (comparative example) and MFR as inner layer is 8.5g
A film (laminate) of three types and three layers with a total thickness of 100 microns (constituent ratio 1:1:2) was produced using propylene homopolymer (pp) of 710 minutes. The thus obtained film was peeled off between the outer layer (ps) and the middle layer, and between the middle layer and the inner layer, and the adhesive strength was measured. The results are shown in Table 1.

(Left below) Example 7 and 15. Comparative Example 10 Composition manufactured in Example 2 [hereinafter referred to as r(I)J]
, the composition produced in Example 4 [hereinafter referred to as r (II) J] or the EEA used in Comparative Example 9 (hereinafter referred to as r (
m) A coextruded film of two types and two layers consisting of a film (thickness: 30 microns) and a propylene homopolymer film (thickness: 80 microns) with an MFR of 8.5 g and 710 minutes, and melt flow index. (measured according to JIS K8870) is 2
．． 8 g/10 min polystyrene film (thickness 30 microns, as outer layer).

A film (thickness: 20 microns, as an intermediate layer) of the composition [hereinafter referred to as r (IV) J] produced in Example 5
and a film of the propylene homopolymer (thickness 5
A coextruded film of three types and three layers was produced, consisting of three layers (0 micron, as the inner layer). A polystyrene sheet (hereinafter referred to as rPSSJ) and a foam (hereinafter referred to as rPSSJ) each having a thickness of 0.2 mm were added to the coextruded film thus obtained.
(referred to as PStPJ) were bonded together using a hot roll and molded into a tray shape under the molding temperature conditions shown in Table 2. The adhesive strength of PSS and PSp of the obtained tray was measured.

The results obtained are shown in Table 2, and the obtained trays were also tested for oil resistance. No change was observed in any of the trays obtained in Examples 7 to 15. On the other hand, the tray obtained in Comparative Example 10 peeled off at the adhesive surface. Further, in the tray obtained in Comparative Example 10, partial peeling occurred between the zoropyrene homopolymer film and the adhesive layer.

(Left below) From the results of the Examples and Comparative Examples above, it is clear that the adhesive resin composition obtained by the present invention has good adhesion to both olefin resins and styrene resins. A laminate product obtained by interposing a molded product of the composition of the present invention between these molded products (film, sheet, etc.) has a bond strength at the interface of these laminated components that is lower than that of other materials. It is clear that it can be used in a wide range of fields because it not only has extremely high oil resistance but also good molding stability (no uneven thickness, no uneven extrusion, etc.).

The adhesive resin composition of the present invention and the laminate or multilayer structure using the composition exhibit the following effects (characteristics) including their manufacturing process.

(1) The composition has good adhesion to both olefin resins and styrene resins.

(2) Like ethylene-vinyl acetate copolymer, it does not contain odor-producing compounds or resins such as vinyl acetate, so it not only has almost no odor, but also has good thermal stability and extrusion stability. It's also excellent.

(3) Not only is the composition easy to manufacture, but also a laminate can be easily manufactured by coextruding the composition with a styrene resin and/or an olefin resin.

(4) Molding stability (no uneven extrusion or thickness)
is good.

Because the adhesive resin composition of the present invention exhibits the above-mentioned effects, it can be used in a wide variety of fields, such as in the form of multilayer structures as described above.Typical uses include various trays and cups. Examples include various containers such as porcelain and knotweed.

Claims (1)

[Scope of Claims] (A) At least one member selected from the group consisting of a propylene homopolymer, a random copolymer of propylene and ethylene or an α-olefin, and a block copolymer of propylene and ethylene or an α-olefin. propylene-based polymer, the content of (B) vinyl acetate is 5 to 35% by weight, and the melt flow rate is 0.5 to 40 g
/10 minutes, and (C) a hydrogenated product of a block copolymer of a vinyl aromatic compound and a conjugated diene. The composition ratio of the polymer is 1 to 20% by weight, and the composition ratio of the hydrogenated block copolymer of a vinyl aromatic compound and a conjugated diene is 1 to 25% by weight, with the remainder being ethylene and vinyl acetate. An adhesive resin composition that is a copolymer with.