JPS6291445U - - Google Patents

Info

Publication number

JPS6291445U

JPS6291445U JP18234785U JP18234785U JPS6291445U JP S6291445 U JPS6291445 U JP S6291445U JP 18234785 U JP18234785 U JP 18234785U JP 18234785 U JP18234785 U JP 18234785U JP S6291445 U JPS6291445 U JP S6291445U

Authority

JP

Japan

Prior art keywords

lead frame

heat dissipation

dissipation section

resin

heat

Prior art date

1985-11-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011347 resin Substances 0.000 claims description 3
• 229920005989 resin Polymers 0.000 claims description 3
• 239000004065 semiconductor Substances 0.000 claims description 3
• 238000007789 sealing Methods 0.000 claims description 2
• 230000017525 heat dissipation Effects 0.000 claims 3
• 238000000465 moulding Methods 0.000 description 1