JPS629055Y2 - - Google Patents

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Publication number
JPS629055Y2
JPS629055Y2 JP1978131572U JP13157278U JPS629055Y2 JP S629055 Y2 JPS629055 Y2 JP S629055Y2 JP 1978131572 U JP1978131572 U JP 1978131572U JP 13157278 U JP13157278 U JP 13157278U JP S629055 Y2 JPS629055 Y2 JP S629055Y2
Authority
JP
Japan
Prior art keywords
injection
temperature
raw material
heater
injection plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1978131572U
Other languages
Japanese (ja)
Other versions
JPS5546598U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978131572U priority Critical patent/JPS629055Y2/ja
Publication of JPS5546598U publication Critical patent/JPS5546598U/ja
Application granted granted Critical
Publication of JPS629055Y2 publication Critical patent/JPS629055Y2/ja
Expired legal-status Critical Current

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  • Processes Of Treating Macromolecular Substances (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Glanulating (AREA)
  • Nozzles (AREA)

Description

【考案の詳細な説明】 本考案は、造粒装置の原料噴射板に関するもの
である。
[Detailed Description of the Invention] The present invention relates to a raw material injection plate for a granulator.

造粒装置の1つとして気体の対向流による冷却
効果を利用したものである。この種の造粒装置は
垂直な塔を有し、この塔の上方から合成樹脂、ロ
ウ、或いは薬品の原料等を溶融した状態で各種の
噴射ノズルにて噴射し、塔中を落下させ、塔の下
方から空気或いは窒素等の気体を冷却媒体として
送り込み、前記の噴射された粒状の材料と接触さ
せ、冷却し所定の大きさの粒子として取出すもの
である。
This is one type of granulation device that utilizes the cooling effect of counterflow of gas. This type of granulation equipment has a vertical tower, and from above the tower, synthetic resin, wax, raw materials for chemicals, etc. are injected in a molten state through various injection nozzles and dropped down the tower. A gas such as air or nitrogen is sent from below as a cooling medium, brought into contact with the injected granular material, cooled, and taken out as particles of a predetermined size.

ところで粒子の大きさ、形状の良し悪しは、原
料の噴射温度は適切であるかどうかにかかわり、
つまり原料の粘度が適当であるかどうかに左右さ
れ、また原料の噴射速度、噴射孔の正常な開孔な
ど噴射装置の機能が適確に発揮できるかどうかに
左右されるものである。
By the way, the size and shape of the particles are related to whether the injection temperature of the raw material is appropriate.
In other words, it depends on whether the viscosity of the raw material is appropriate, and it also depends on whether the functions of the injection device can be properly performed, such as the injection speed of the raw material and the normal opening of the injection hole.

第1図は従来使用されたこの種の噴射装置の代
表的なもので、図に於いて1は噴射装置本体で、
その上端には溶融原料が図示せぬ配管を経て送り
込まれる原料流入口2が設けられており、噴射装
置本体1はジヤケツト3により蒸気などで加熱さ
れるようになつている。この熱はごく一部だけパ
ツキング10を経て噴射板4に伝わる。噴射板4
には適当な形状、個数、配列、ピツチなどを有す
る噴射孔5が開口されている。
Figure 1 shows a typical injection device of this type that has been used in the past. In the figure, 1 is the main body of the injection device;
A raw material inlet 2 is provided at its upper end, through which molten raw material is fed through a pipe (not shown), and the injection device main body 1 is heated by a jacket 3 with steam or the like. Only a small portion of this heat is transmitted to the injection plate 4 through the packing 10. Spray plate 4
Injection holes 5 having a suitable shape, number, arrangement, pitch, etc. are opened in the hole.

かかる構造の噴射装置では、運転中に噴射板4
の下面に、塔を上昇する空気との接触により、原
料釜のバッチ運転の場合の溶融原料がフラツシン
グされる際、噴射装置本体1から噴射孔5を通過
して外部へ噴出する圧縮空気などの為に、噴射板
4が冷却されていた。尚ジヤケツト3からの熱が
パツキング10を伝わつて噴射板4へ移動する熱
量はメタルパツキンを使用してもあまり期待でき
ず、噴射板4の直径が大きくなるにつれてますま
すその傾向が大きくなる。従つて溶融原料が噴射
板4の下面に固化附着し、これらが運転中再融解
して大きな滴となつて落下し、塔下部ホツパに附
着、固化したり、製品粒子より遥かに大きい粒子
が混入したりした。また噴射板4の噴射孔5の中
で溶融原料が固化し、噴射孔5の形状が保たれな
くなつて粒子径が揃わなくなるなどの欠点があつ
た。
In an injection device having such a structure, the injection plate 4 is
On the bottom surface, when the molten raw material is flushed in the case of batch operation of the raw material pot, due to contact with the air rising up the tower, compressed air, etc., is jetted out from the injection device main body 1 through the injection hole 5. Therefore, the injection plate 4 was cooled. It should be noted that the amount of heat transferred from the jacket 3 to the injection plate 4 through the packing 10 cannot be expected much even if a metal packing is used, and as the diameter of the injection plate 4 increases, this tendency increases. Therefore, the molten raw material solidifies and adheres to the lower surface of the injection plate 4, and during operation, these re-melt and fall as large droplets, which adhere to and solidify to the hopper at the bottom of the tower, or particles much larger than the product particles are mixed in. I did it. Further, there was a drawback that the molten raw material solidified in the injection holes 5 of the injection plate 4, and the shape of the injection holes 5 could no longer be maintained, resulting in uneven particle diameters.

これらは使用物質の融点に関係があり、特に融
点の高い物質の場合に顕著にあらわれる現象であ
る。
These phenomena are related to the melting point of the substance used, and are particularly noticeable in the case of substances with high melting points.

さらに、起動時に噴射板4のウオーミングアツ
プに長時間を要し、冬季には特に不便を感じてい
た。
Furthermore, it takes a long time for the spray plate 4 to warm up at startup, which is particularly inconvenient in winter.

そこで上記のような欠点を解消するものとし
て、第2図に示す如く噴射板4の下面に平行し
て、シーズドヒータ9を噴射板4からやや離して
取付けた構造のものが提示されたが、このものは
噴射板4の冷えるのを防止できてもシーズドヒー
タ9が噴射板4の下面側にある為溶融液がたれて
附着し、またシーズドヒータ9の温度調節装置が
無い為噴射板4の温度が上り過ぎ、溶融液がこげ
つくなどの欠点があつた。
Therefore, as a solution to the above-mentioned drawbacks, a structure has been proposed in which the seeded heater 9 is mounted parallel to the lower surface of the injection plate 4 and slightly apart from the injection plate 4, as shown in FIG. Even if it is possible to prevent the spray plate 4 from cooling down, since the sheathed heater 9 is located on the bottom side of the spray plate 4, the melt may drip and adhere to the spray plate 4, and since there is no temperature control device for the seeded heater 9, the temperature of the spray plate 4 increases. There were drawbacks such as overheating and scorching of the molten liquid.

本考案はかかる欠点を解消すべくなされたもの
であり、シーズドヒータを噴射板の中に埋設し
て、シーズドヒータの熱が直接噴射板に伝導され
るようにして、噴射板の温度を、自動的に噴射造
粒に最適な溶融原料液温度に略等しく保持するよ
うにした造粒装置の原料噴射板を提供せんとする
ものである。
The present invention has been made to eliminate such drawbacks, and by embedding the seeded heater in the injection plate so that the heat of the seeded heater is directly conducted to the injection plate, the temperature of the injection plate can be automatically adjusted. It is an object of the present invention to provide a raw material injection plate for a granulation device that maintains the temperature of the molten raw material liquid substantially equal to the optimum temperature for injection granulation.

以下本考案による造粒装置の原料噴射板の詳細
を図面に示す実施例に基いて説明すると、第3図
はその一実施例で、図中第1図と同一部分には同
一符号を付してある。この実施例にあつては、噴
射板4の内部に上下面に平行して且つ第5図に示
す如く噴射孔5の近傍を通してシーズドヒータ挿
入孔6を穿孔し、この孔6にシーズドヒータ9を
挿入すると共に噴射板4の適当個所に温度検出端
を取付けて自動温度調節装置を装備している。
The details of the raw material injection plate of the granulator according to the present invention will be explained below based on the embodiment shown in the drawings. Fig. 3 shows one embodiment, and the same parts as in Fig. 1 are designated by the same reference numerals. There is. In this embodiment, a seeded heater insertion hole 6 is bored inside the injection plate 4 parallel to the upper and lower surfaces and through the vicinity of the injection hole 5 as shown in FIG. 5, and a seeded heater 9 is inserted into this hole 6. At the same time, a temperature detection end is attached to an appropriate location on the spray plate 4 to provide an automatic temperature control device.

自動温度調節装置は、第6図に示す如く噴射板
4の適当個所に取付けた温度検出端11と、該温
度検出端11が接続された温度制御器12と、シ
ーズドヒータ9の電源回路13と、温度制御器1
2に予め設定した噴射造粒に最適な溶融原料液温
度と温度検出端11にて検出した噴射板4の温度
との温度差の有無によつて前記電源回路13を接
続、切断するスイツチ14とより成るものであ
る。
The automatic temperature control device includes, as shown in FIG. 6, a temperature detection end 11 attached to an appropriate location on the injection plate 4, a temperature controller 12 to which the temperature detection end 11 is connected, and a power supply circuit 13 for the sheathed heater 9. Temperature controller 1
a switch 14 that connects or disconnects the power supply circuit 13 depending on the presence or absence of a temperature difference between the molten raw material liquid temperature optimal for injection granulation, which is set in advance in step 2, and the temperature of the injection plate 4 detected by the temperature detection end 11; It consists of:

第4図は他の実施例であつて、これは噴射板4
が大型になると、第3図のようなキリ穴であるシ
ーズドヒータ挿入孔6を長く平行に穿孔すること
が困難となる為、第4図に示されるような形状の
シーズドヒータ挿入用溝7を噴射板4の下面に切
削し、溝押え蓋8を噴射板4の下面より一枚或い
は分割して当てがい、取外し可能な構造として孔
開けの加工性を改善したもので、その他の構成は
前記実施例と同一である。
FIG. 4 shows another embodiment, in which the injection plate 4
As the size increases, it becomes difficult to drill the seeded heater insertion holes 6, which are drilled holes as shown in Fig. 3, long and parallel. 4, and the groove holding lid 8 is attached to the bottom surface of the injection plate 4 as a single piece or divided into pieces, and has a removable structure to improve the workability of drilling holes.The other configuration is the same as that of the above embodiment. is the same as

本考案による造粒装置の原料噴射板は、上述の
如く構成されているので、噴射板4に埋設されて
いるシーズドヒータ9の熱は、直接噴射板4に伝
導される。この直接的な熱伝導によつて、噴射板
4の温度は、シーズドヒータ9の調節により敏捷
に追従し調節される。特に噴射孔5の近傍にシー
ズドヒータ9を設け、噴射孔5部分の温度制御性
を向上している。以下第6図をもとに温度制御の
実際について述べる。先ず、噴射板4の温度が常
時温度検出端11にて検出され、その検出温度は
温度制御器12にて予め設定しておいた噴射造粒
に最適な溶融原料液温度と比較され、温度差があ
るとスイツチ14がONとなつてシーズドヒータ
9の電源回路13が接続され、シーズドヒータ9
が発熱する。その結果噴射板4は次第に加熱さ
れ、やがてその温度が噴射造粒に最適な溶融原料
液温度に達すると、温度制御器12に設定した温
度との温度差が無くなり、スイツチ14がOFF
となつてシーズドヒータ9の電源回路13が切断
され、シーズドヒータ9は噴射板4を噴射造粒に
最適な溶融原料液温度以上に加熱することがな
い。そして噴射板4が温度低下すると、温度制御
器12に設定した温度との間に温度差が生じ、ス
イツチ14がONとなつてシーズドヒータ9の電
源回路13が接続され、シーズドヒータ9が発熱
し、再び噴射板4が加熱される。
Since the raw material injection plate of the granulator according to the present invention is constructed as described above, the heat of the seeded heater 9 embedded in the injection plate 4 is directly conducted to the injection plate 4. Due to this direct heat conduction, the temperature of the injection plate 4 can be quickly followed and adjusted by adjusting the sheathed heater 9. In particular, a seeded heater 9 is provided near the injection hole 5 to improve temperature controllability in the injection hole 5 portion. The actual temperature control will be described below based on FIG. First, the temperature of the injection plate 4 is constantly detected by the temperature detection end 11, and the detected temperature is compared with the optimal molten raw material liquid temperature for injection granulation, which has been set in advance by the temperature controller 12, and the temperature difference is determined. When the switch 14 is turned on, the power circuit 13 of the seeded heater 9 is connected, and the seeded heater 9
generates a fever. As a result, the injection plate 4 is gradually heated, and when its temperature eventually reaches the optimal molten raw material liquid temperature for injection granulation, the temperature difference with the temperature set in the temperature controller 12 disappears, and the switch 14 is turned OFF.
As a result, the power supply circuit 13 of the seeded heater 9 is disconnected, and the seeded heater 9 does not heat the injection plate 4 above the temperature of the molten raw material liquid that is optimal for injection granulation. Then, when the temperature of the injection plate 4 decreases, a temperature difference occurs between the temperature set in the temperature controller 12, the switch 14 is turned on, the power supply circuit 13 of the seeded heater 9 is connected, the seeded heater 9 generates heat, and the temperature changes again. The spray plate 4 is heated.

かくして噴射板4の温度は、自動的に常時噴射
造粒に最適な溶融原料液温度と略等しく保持され
ることになる。
In this way, the temperature of the injection plate 4 is automatically maintained substantially equal to the optimum temperature of the molten raw material liquid for injection granulation at all times.

以上詳述した通り本考案の原料噴射板は、シー
ズドヒータを噴射板の中に埋設して、直接加熱す
るようにしたので噴射板の温度調節が敏捷に行な
うことが可能となり、噴射板の下面に溶融原料が
冷却固化して附着することがない。又特にシーズ
ドヒータを噴射孔の近傍にくるように埋設したの
で、噴射孔の中で溶融原料が固化することなく、
噴射孔の形状が保たれて製品粒子径が一定とな
る。
As detailed above, the raw material injection plate of the present invention has a seeded heater embedded in the injection plate to directly heat the injection plate, making it possible to quickly adjust the temperature of the injection plate. The molten raw material will not cool and solidify and stick to the surface. In addition, since the seeded heater is buried near the injection hole, the molten raw material does not solidify inside the injection hole.
The shape of the injection hole is maintained and the product particle size becomes constant.

更に噴射孔近傍を直接的に加熱するので、噴射
板のウオーミングアツプに要する時間が大巾に短
縮されるなど、優れた効果を奏する。
Furthermore, since the vicinity of the injection hole is directly heated, the time required for warming up the injection plate can be greatly shortened, providing excellent effects.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は夫々従来の原料噴射板の縦
断面図、第3図及び第4図は夫々本考案による原
料噴射板の実施例を示す縦断面図、第5図は第
3,4図に示される原料噴射板の下面図、第6図
は本考扱の原料噴射板に装備された自動温度調節
装置の系統図である。 1……噴射装置本体、2……原料流入口、3…
…ジヤケツト、4……噴射板、5……噴射孔、6
……シーズドヒータ挿入孔、7……シーズドヒー
タ挿入用溝、8……溝押え蓋、9……シーズドヒ
ータ、10……パツキング、11……温度検出
端、12……温度制御器、13……シーズドヒー
タの電源回路、14……スイツチ。
1 and 2 are longitudinal sectional views of a conventional raw material injection plate, respectively, FIGS. 3 and 4 are longitudinal sectional views showing an embodiment of a raw material injection plate according to the present invention, and FIG. 5 is a longitudinal sectional view of a conventional raw material injection plate, respectively. FIG. 4 is a bottom view of the raw material injection plate, and FIG. 6 is a system diagram of the automatic temperature control device equipped on the raw material injection plate to be considered herein. 1... Injection device main body, 2... Raw material inlet, 3...
... Jacket, 4 ... Spray plate, 5 ... Spray hole, 6
... Seeded heater insertion hole, 7 ... Seeded heater insertion groove, 8 ... Groove presser lid, 9 ... Seeded heater, 10 ... Packing, 11 ... Temperature detection end, 12 ... Temperature controller, 13 ... Seeded heater Power supply circuit, 14... switch.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 垂直な塔を有し、この塔の上部に溶融した原料
の噴射装置を有し、塔と向流又は平行流に冷却媒
体を導く造粒装置の原料噴射板において、該噴射
板の噴射孔近傍に埋設したヒータと、該ヒータを
埋設した噴射板に取付けた温度検出端と、該温度
検出端からの信号により前記ヒータを制御する制
御装置とから成り、温度制御装置によつて上記埋
設されたヒータを制御することにより直接的に噴
射板の温度を制御するようにしたことを特徴とす
る造粒装置の原料噴射板。
In a raw material injection plate of a granulation device that has a vertical tower, has an injection device for molten raw material at the top of the tower, and guides a cooling medium in a countercurrent or parallel flow to the tower, near the injection hole of the injection plate. It consists of a heater buried in the heater, a temperature detection end attached to the injection plate in which the heater is buried, and a control device that controls the heater based on a signal from the temperature detection end, and the temperature control device controls the temperature detection end of the heater. 1. A raw material injection plate for a granulator, characterized in that the temperature of the injection plate is directly controlled by controlling a heater.
JP1978131572U 1978-09-25 1978-09-25 Expired JPS629055Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978131572U JPS629055Y2 (en) 1978-09-25 1978-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978131572U JPS629055Y2 (en) 1978-09-25 1978-09-25

Publications (2)

Publication Number Publication Date
JPS5546598U JPS5546598U (en) 1980-03-26
JPS629055Y2 true JPS629055Y2 (en) 1987-03-03

Family

ID=29098273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978131572U Expired JPS629055Y2 (en) 1978-09-25 1978-09-25

Country Status (1)

Country Link
JP (1) JPS629055Y2 (en)

Also Published As

Publication number Publication date
JPS5546598U (en) 1980-03-26

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