JPS6289249A - Structure of photodetector attached to plane part and its assembling method - Google Patents
Structure of photodetector attached to plane part and its assembling methodInfo
- Publication number
- JPS6289249A JPS6289249A JP23043985A JP23043985A JPS6289249A JP S6289249 A JPS6289249 A JP S6289249A JP 23043985 A JP23043985 A JP 23043985A JP 23043985 A JP23043985 A JP 23043985A JP S6289249 A JPS6289249 A JP S6289249A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- light receiving
- parts
- connecting thin
- photodetector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Optical Head (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は光学的に情報が記録された媒体から、該情報を
検出する光学式ピックアップ装置等において、偏光プリ
ズム等の平面部に取付けるフォトディテクタ（光検出器
）の構造に関する。Detailed Description of the Invention "Industrial Application Field" The present invention relates to a photodetector ( Regarding the structure of photodetectors).
まず、光学式ピックアップ装置について第５図に示す縦
断面図で説明する６
上記の図面において、１は光学的に情報が記録された光
ディスク、２は該光ディスク１の記録情報を読取るため
のレーザ光を発生する光源本体で、該光源本体２には半
導体レーザチップ３が取付けられている。First, the optical pickup device will be explained with reference to the vertical cross-sectional view shown in FIG. A semiconductor laser chip 3 is attached to the light source body 2.
光源本体２の先端には、後述する光学系４を構成する偏
光プリズム５の後面が固定されている。A rear surface of a polarizing prism 5 constituting an optical system 4, which will be described later, is fixed to the tip of the light source body 2.
この偏光プリズム５は光ディスク１からの反射光を分離
するもので、偏光プリズム５の前面には、１／４波長板
６が接着されている。更に、１／４波長板６の前にはス
ペーサ７を介して光デイスク１ヒに集束するマイクロフ
レネルレンズ（対物レンズ）８が配置されている。 ９
は上記の偏光プリズム５の右側面に直接、接着された１
／４波長板で、このｌ／４波長板９の下半分には薄膜の
ナイフェツジ兼反射膜（以後ナイフェツジと略記する）
１０が形成されている。また、１／４波長板９の右側に
は、トラッキング用フォトディテクタ１１が配Ｉａされ
ている。This polarizing prism 5 separates reflected light from the optical disk 1, and a quarter wavelength plate 6 is adhered to the front surface of the polarizing prism 5. Further, in front of the quarter-wave plate 6, a micro Fresnel lens (objective lens) 8 is arranged via a spacer 7 to focus the light onto the optical disk 1. 9
1 is directly glued to the right side of the polarizing prism 5 above.
/4 wavelength plate, and the lower half of this 1/4 wavelength plate 9 has a thin knife/reflection film (hereinafter abbreviated as knife).
10 are formed. Further, on the right side of the quarter-wave plate 9, a tracking photodetector 11 is arranged Ia.
一フ〒、偏光プリズム５の左側には、フォーカシング用
フォトディテクタ１２が配置されている。On the left side of the polarizing prism 5, a focusing photodetector 12 is arranged.
次に、上記の光学式ピックアップ装置の作用について説
明する。Next, the operation of the above optical pickup device will be explained.
まず、光源本体２の半導体レーザチップ３から発射され
たＰ偏光の光は、偏光プリズム５の偏光膜を通過し、ｌ
／４波長板６によって直線偏光から円偏光に変えられる
。この円偏光は対物レンズ８によって光ディスク１の情
報記録面に集束される。First, P-polarized light emitted from the semiconductor laser chip 3 of the light source body 2 passes through the polarizing film of the polarizing prism 5, and
The /4 wavelength plate 6 converts the linearly polarized light into circularly polarized light. This circularly polarized light is focused onto the information recording surface of the optical disc 1 by the objective lens 8.
次いで、光ディスク１の情報記録面で反射された反射光
は、入射時とは逆回転方向の円偏光に変換される。そし
て、この円偏光は再び、１ 、／ ４波長板６を通過す
ることによって、今度は９０’偏光方向の回転した直線
偏光（Ｓ偏光）の光となり、偏光プリズム５の偏光膜で
右方向に光路を変更される。Next, the reflected light reflected by the information recording surface of the optical disc 1 is converted into circularly polarized light with a direction of rotation opposite to that at the time of incidence. Then, this circularly polarized light passes through the 1,/4 wavelength plate 6 again, and becomes linearly polarized light (S-polarized light) with a 90' polarization direction rotated, and is turned to the right by the polarizing film of the polarizing prism 5. The optical path is changed.
そして、１／４波長板９を通過することにより、再び円
偏光に変換され、該１／４波反板９の１−半分を通過し
た光は、トラッキング用フォトディテクタ１１に到達し
、トラッキングエラが検出される。一方、ナイフェツジ
１０により反射されて光路を折り曲げられた光は、入射
時とは逆回転の円偏光となり、再び１／４波長板９を通
過することにより、入射時と９０＠だけ偏光方向が回転
した（直線偏光）Ｐ偏光の光となり、偏光プリズム５の
偏光膜を透過することにより、フォーカシング用フォト
ディテクタ１２に到達し、フォーカシングエラが検出さ
れる。Then, by passing through the quarter-wave plate 9, the light is converted into circularly polarized light again, and the light that has passed through one-half of the quarter-wave plate 9 reaches the tracking photodetector 11, and the tracking error is eliminated. Detected. On the other hand, the light whose optical path is bent by being reflected by the knife 10 becomes circularly polarized light with a rotation opposite to that at the time of incidence, and by passing through the quarter-wave plate 9 again, the polarization direction is rotated by 90@ compared to the time of incidence. The P-polarized light (linearly polarized light) passes through the polarizing film of the polarizing prism 5 and reaches the focusing photodetector 12, where a focusing error is detected.
「発明がｆｖｉ訣しようとする問題点」に記の光学式ピ
ー、クアップ装置において、偏光プリズム５の右側面に
は、１／４波長板９を介して２個の受光素子から成るト
ラ−２キング用フオトデイテクタ１１が配置されている
。また、偏光プリズム５の左側には、２個の受光素子か
ら成るフォーカシング用フォトディテクタ１２が配置さ
れている。In the optical peak-up device described in "Problems to be solved by the invention," a polarizing prism 5 is provided with a polarizing prism 5 on its right side through a quarter-wave plate 9. A king photodetector 11 is arranged. Further, on the left side of the polarizing prism 5, a focusing photodetector 12 consisting of two light receiving elements is arranged.
そして、上記のトラッキング用フォトディテクタ１１及
びフォーカシング用フォトディテクタ１２の受光面は、
偏光プリズム５及び１／４波長板９の平面部に対して、
平行に取付ける必要がある。The light-receiving surfaces of the tracking photodetector 11 and focusing photodetector 12 are as follows:
With respect to the flat parts of the polarizing prism 5 and the quarter-wave plate 9,
Must be installed in parallel.
しかし、−上記の両フォトディテクタ１１及び１２を構
成する２個の受光素子からは、半田付けによりリード線
を引出す必要があるが、この半田付けのためフォトディ
テクタ１１及び１２の受光面は凹凸となり、偏光プリズ
ム５及び１／４波長板９への取付けが困難となる。また
、取付けたとしても、２個の受光素子を偏光プリズム５
及び１／４波侵板９の面と平行に取付けることはできな
いという欠点があった。However, - lead wires must be drawn out by soldering from the two light-receiving elements constituting both photodetectors 11 and 12, but this soldering makes the light-receiving surfaces of photodetectors 11 and 12 uneven, resulting in polarized light. Attachment to the prism 5 and the quarter-wave plate 9 becomes difficult. In addition, even if it is installed, the two light receiving elements can be connected to the polarizing prism 5.
Another drawback is that it cannot be installed parallel to the surface of the quarter wave plate 9.
「問題点を解決するための手段」
本発明は上記のような欠点を解決するために成されたも
ので、受光本体とアダプタ部とから構成され、受光本体
には半導体基板と、この半導体基板に形成された受光素
子と、この受光素子に接続された第１の接続用＊ ＮＩ
Ｊ ｍとを設け、アダプタ部には表面と所定の平面部に
取付ける裏面とが平行なガラス基板と、該ガラス基板の
表面に形成され、上記の第１の接続用薄膜部と接続可能
な第２の接続用薄膜部及び第２の接続用薄膜部に接続さ
れたリード線を接続するための端子用薄膜部とを設けた
平面部に取付けるフォトディテクタの構造及びその組立
方法を提供するのが目的である。"Means for Solving the Problems" The present invention has been made to solve the above-mentioned drawbacks, and is composed of a light receiving body and an adapter part, and the light receiving body includes a semiconductor substrate and the semiconductor substrate. A light-receiving element formed in the NI
The adapter part includes a glass substrate whose front surface is parallel to the back surface to be attached to a predetermined flat surface, and a glass substrate formed on the surface of the glass substrate and connectable to the first connecting thin film part. It is an object of the present invention to provide a structure of a photodetector that is attached to a flat part provided with a second connecting thin film part and a terminal thin film part for connecting a lead wire connected to the second connecting thin film part, and a method for assembling the same. It is.
「発明の構成」
以下、本発明を図面の実施例に基づいて説明する。第１
図は本発明に係る平面部に取付けるフォトディテクタ構
造の分解状態の斜視図、第２図は同組立て状態の斜視図
、第３図の（イ）、（ロ）、（ハ）、（ニ）はフォトデ
ィテクタ構造の構成部品の製造工程図、第４図の（イ）
、（ロ）、（ハ）はフォトディテクタ構造の組立工程図
である。"Structure of the Invention" The present invention will be described below based on embodiments of the drawings. 1st
The figure is an exploded perspective view of the photodetector structure attached to a flat surface according to the present invention, FIG. Manufacturing process diagram of the component parts of the photodetector structure, Figure 4 (a)
, (b) and (c) are assembly process diagrams of the photodetector structure.
ｌ−記の図面において、２１は受光本体で、２２は該受
光本体２１を構成する直方体形状の半導体フ、（坂、２
３ａ、２３ｂは該半導体基板２２の表面（受光面）の中
央部に形成された２個の受光素子で、隣接状態で配置さ
れている。また、半導体基板２２の表面において、受光
素子２３ａ、２３ｂの上部と下部には、それぞれ、導電
性を有する直方体形状の第１の接続用薄膜部２４ａ、２
４ｂ及び２５ａ、２５ｂが形成されており、一方の第１
・の接続用薄膜部２４ａと２４ｂは受光素子２３ａ、２
３ｂのカソードに接続され、他方の第１の接続用薄膜部
２５ａと２５ｂは受光素子２３ａ、２３ｂのアノードに
接続されている。ここで、上記の接続用薄膜部２４ａ、
２４ｂ及び２５ａ、２５ｂは、Ａ見の薄膜を蒸着または
スパッタリング法で形成する。1-, 21 is a light-receiving body, and 22 is a rectangular parallelepiped-shaped semiconductor plane that constitutes the light-receiving body 21;
Reference numerals 3a and 23b are two light receiving elements formed at the center of the surface (light receiving surface) of the semiconductor substrate 22, and are arranged adjacent to each other. Further, on the surface of the semiconductor substrate 22, conductive rectangular parallelepiped-shaped first connecting thin film portions 24a and 2 are provided above and below the light receiving elements 23a and 23b, respectively.
4b, 25a and 25b are formed, and one of the first
The connecting thin film parts 24a and 24b are connected to the light receiving elements 23a and 2.
3b, and the other first connecting thin film portions 25a and 25b are connected to the anodes of the light receiving elements 23a and 23b. Here, the above connection thin film part 24a,
24b, 25a, and 25b are formed by depositing or sputtering thin films as shown in A.
２６はアダプタ部で、２７は上記の半導体基板２２より
大形な直方体形状のガラス基板で、その表面と裏面は平
行に形成されている。そして、ガラス基板２７の表面の
Ｌ部には、上記の第１の接続用薄膜部ｇ部２４ａ、２４
ｂを短絡する第２の接続用薄１１１２部２８が形成され
、その両側には該第２の接続用−ａｎＩＪ部２８に接続
された第３の端子用薄膜部２９ａ、２９ｂが形成されて
いる。また、ガラス基板２７の表面の下部には、上記の
第１の接続用薄膜部２５ａと２５ｂと各別に接続される
第２の接続用薄膜部３０ａ、３０ｂが形成され、該薄膜
部３０ａと３０ｂの外側には、それぞれ第２の接続用薄
膜部３０ａ、３０ｂに接続された第３の端子用薄膜部３
Ｌａ、３１ｂが形成されている。26 is an adapter section, and 27 is a rectangular parallelepiped glass substrate larger than the semiconductor substrate 22, the front and back surfaces of which are parallel to each other. Then, on the L portion of the surface of the glass substrate 27, the first connecting thin film portion g portion 24a, 24 is provided.
A second connection thin film part 28 is formed to short-circuit the terminal b, and third terminal thin film parts 29a and 29b connected to the second connection -anIJ part 28 are formed on both sides of the second connection thin film part 28. . Furthermore, second connecting thin film parts 30a and 30b are formed at the lower part of the surface of the glass substrate 27, and are connected to the first connecting thin film parts 25a and 25b, respectively. On the outside, there is a third terminal thin film part 3 connected to the second connecting thin film part 30a, 30b, respectively.
La, 31b are formed.
３２はガラス基板２７の表面に形成されたポリイミド樹
脂等の保護膜で、この保護膜３２の中央は、４−記の受
光素子２３ａ、２３ｂと同大の大きさで剥離され、該受
光素子２３ａ、２３ｂが侵入する受光用窓３３が形成さ
れている。また、保護膜３２は接続用薄膜部２８、端子
用薄膜部２９ａ、２９ｂ、接続用薄膜部３０ａ、３０
ｂ、端子用薄膜部３１ａ、３１ｂとは接触せず、その外
周に間隙が形成されている。Reference numeral 32 denotes a protective film made of polyimide resin or the like formed on the surface of the glass substrate 27, and the center of this protective film 32 is peeled off to the same size as the light receiving elements 23a and 23b described in 4-. , 23b is formed. Further, the protective film 32 includes a thin film portion for connection 28, thin film portions for terminals 29a and 29b, and thin film portions for connection 30a and 30.
b. It does not contact the thin film parts 31a and 31b for terminals, and a gap is formed around the outer periphery thereof.
ここで、上記のアダプタ部２６の製造法について第３図
の（イ）、（ロ）、（ハ）、（ニ）により説明する。Here, a method of manufacturing the above-mentioned adapter portion 26 will be explained with reference to (a), (b), (c), and (d) of FIG. 3.
まず、第３図の（イ）で示すように、ガラス基板２７の
表面において、接続用薄膜部２８、端子用薄膜部２９ａ
、２９ｂ、接続用薄膜部３０ａ。First, as shown in FIG.
, 29b, connection thin film part 30a.
３０ｂ、端子用薄膜部３１ａ、３１ｂのパターン以外の
部分にレジスト３４を塗布する。30b, a resist 34 is applied to portions other than the pattern of the terminal thin film portions 31a and 31b.
次いで、同図の（ロ）で示すように、ガラス基板２７の
表面の全体に、下層にＣｒ、上層にＡｕまたは下層にＣ
ｒ、上層にＡｇの薄膜３５を蒸着またはスパッタリング
法で形成した後、リフトオフ法等により北記のレジスト
３４を除去すれば、第３図（ハ）で示すように、接続用
薄膜部２８、端子用薄膜部２９ａ、２９ｂ、接続用薄膜
部３０ａ、３０ｂ、端子用薄膜部３１ａ、３１ｂ等が形
成される。Next, as shown in FIG.
r. After forming the Ag thin film 35 on the upper layer by vapor deposition or sputtering method, if the resist 34 described above is removed by lift-off method etc., as shown in FIG. Thin film parts 29a, 29b for connection, thin film parts 30a, 30b for connection, thin film parts 31a, 31b for terminals, etc. are formed.
次いで、第３図の（ニ）で示すように、接続用薄膜部２
８、端子用薄膜部２９ａ、２９ ｂ等及び受光用窓３３
を除くガラス基板２７の表面に保護膜３２を形成して完
成である。Next, as shown in (d) in FIG.
8. Terminal thin film parts 29a, 29b, etc. and light receiving window 33
A protective film 32 is formed on the surface of the glass substrate 27 except for the surface, and the process is completed.
「発明の作用」
次に、上記の実施例の組立て及び作用について第４図の
（イ）、（ロ）、（）＼）を参照して説明する。"Operation of the Invention" Next, the assembly and operation of the above embodiment will be explained with reference to (a), (b), and ()\) of FIG. 4.
まず、第４図の（イ）で示すように、アダプタ部２６の
端子用薄膜部２９ａ、２９ｂ、及び３１ａ、３１ｂに、
夫々、リード線３６をワイヤーポンディング、半田付は
等により接続する。また、接続用薄膜部２８及び３０ａ
、３０ｂの上に、エポキシ系、ポリイミド系等の熱硬化
性樹脂の導電性接着剤（クリームハンダ）３７を塗布す
る。First, as shown in (a) of FIG.
The lead wires 36 are connected by wire bonding, soldering, etc., respectively. In addition, the connecting thin film portions 28 and 30a
, 30b, a conductive adhesive (cream solder) 37 made of thermosetting resin such as epoxy or polyimide is applied.
次いで、第４図の（ロ）で示すように、アダプタ部２６
の表面に対して、受光本体２１の受光部（表面）を対向
させると共に、接続用薄膜部２８に接続用薄膜部２４ａ
、２４ｂを対面させ、また、接続用薄膜部３０ａ、３０
ｂに接続ｍ薄膜部２５ａ、２５ｂを対面させて、受光本
体２１にアダプタ部２６を接合する。そして、ホットプ
レートあるいはオーブンで加熱して上記の導電性接着剤
３７を硬化させ、接続…薄膜部２８と接続用Ｍｎｑ部２
４ａ、２４ｂ乃び接続用薄膜部３０ａ。Next, as shown in (b) of FIG.
The light-receiving part (surface) of the light-receiving main body 21 is opposed to the surface of
, 24b facing each other, and the connecting thin film parts 30a, 30
The adapter part 26 is joined to the light receiving main body 21 with the thin film parts 25a and 25b facing each other. Then, the conductive adhesive 37 is cured by heating with a hot plate or an oven, and the connection...the thin film part 28 and the connection Mnq part 2 are made.
4a, 24b and the connecting thin film portion 30a.
３０ｂと接続用薄膜部２５ａ、２５ｂを電気的に接続し
、受光用窓３３に受光素子２３ａ、２３ｂを配置する。30b and the connecting thin film parts 25a, 25b are electrically connected, and the light receiving elements 23a, 23b are arranged in the light receiving window 33.
これによって、受光素子２３ａ、２３ｂのカソードは、
接続用薄膜部２８で接続されると共に、リード線３６と
接続され、受光素子２３ａ、２３ｂの各アノードは、夫
々、リード線３６と接続される。As a result, the cathodes of the light receiving elements 23a and 23b are
The light-receiving elements 23a and 23b are connected by the connecting thin film portion 28 and also connected to the lead wire 36, and the anodes of the light receiving elements 23a and 23b are connected to the lead wire 36, respectively.
ここで、受光本体２１とアダプタ部２６との間には空間
部３８が形成され、ガラス基板２７と空間部３８で屈曲
率変化が生じるので、これを防止するため等の理由によ
り、空間部３８及びリード線３６の接続部上に、ガラス
基板２７と同一の屈折率を有する例えば、ポリエステル
樹脂等の樹脂３９を注入あるいは塗布して硬化させるこ
とが望ましい。Here, a space 38 is formed between the light-receiving body 21 and the adapter part 26, and since a change in curvature occurs between the glass substrate 27 and the space 38, in order to prevent this, the space 38 is It is desirable to inject or apply a resin 39, such as polyester resin, having the same refractive index as the glass substrate 27 onto the connecting portion of the lead wire 36 and harden it.
以トのようにして組立てが完了したならば、アダプタ部
２６の裏面を図示しない偏光プリズムあるいは波長板の
所定の位置に取付けるのである。Once the assembly is completed as described above, the back surface of the adapter section 26 is attached to a predetermined position on a polarizing prism or wave plate (not shown).
「発明の効果」
本発明は斜上のように、受光本体２１とアダプタ部２６
とから構成され、受光本体２１には、半導体基板２２と
、この半導体基板２２に形成された受光素子２３ａ、２
３ｂと、この受光素子２３ａ、２３ｂに接続された第１
の接続用薄膜部２４ａ、２４ｂ、２５ａ、２５ｂとを設
け、アダプタ部２６には表面と所定の平面部に取付ける
裏面とが平行なガラス基板２７と、該ガラス基板２７の
表面に形成され、上記の第１の接続用薄膜部２４ａ、２
４ｂ、２５ａ、２５ｂと接続可能な第２の接続用薄膜部
２８．３０ａ、３０ｂ及びこの接続用薄膜部２８，３０
ａ、３０ｂに接続されたリード線３６を接続するための
端子用薄膜部２９ａ、２９ｂ、３１ａ、３１ｂとを設け
たで、受光本体２１の受光面の状態に関係なく、アダプ
タ部２６のガラス基板２７の裏面により、所定の平面部
に平行に、かつ確実に取付けることができる。"Effects of the Invention" As shown diagonally above, the present invention includes the light receiving body 21 and the adapter part 26.
The light receiving body 21 includes a semiconductor substrate 22 and light receiving elements 23a and 2 formed on the semiconductor substrate 22.
3b, and a first light receiving element connected to the light receiving elements 23a and 23b.
The adapter part 26 is provided with a glass substrate 27 whose front surface and a back surface to be attached to a predetermined flat surface are parallel, and a glass substrate 27 formed on the surface of the glass substrate 27. The first connecting thin film portion 24a, 2
4b, 25a, 25b and the second connecting thin film parts 28, 30a, 30b and the connecting thin film parts 28, 30
Since the thin film parts 29a, 29b, 31a, and 31b for terminals are provided for connecting the lead wires 36 connected to the leads 36a and 30b, the glass substrate of the adapter part 26 can be The back surface of 27 allows it to be mounted parallel to a predetermined flat surface and reliably.
また、アダプタ部２６の端子用薄膜部２９ａ。Further, the terminal thin film portion 29a of the adapter portion 26.
２９ｂ、３１ａ、３１ｂにリード線３６を接続すると共
に、第２の接続用薄膜部２８．３０ａ、３０ｂに熱硬化
性樹脂の導電性接着剤３７を塗布する第１の工程と、ア
ダプタ部２６の第２の接続用薄膜部２８．３０ａ、３０
ｂに対して受光本体２１の第１の接続用薄膜部２４ａ、
２４ｂ、２５ａ、２５ｂを対向して接合した後、加熱に
より上記の導電性接着剤３７を硬化させて、受光本体２
１とアダプタ部２６とを接続する第２の工程とから構成
したので、組立工程が簡単となる。29b, 31a, 31b, and a first step of applying a thermosetting resin conductive adhesive 37 to the second connecting thin film portions 28, 30a, 30b; Second connecting thin film portion 28.30a, 30
b, the first connecting thin film portion 24a of the light receiving body 21,
After joining 24b, 25a, and 25b facing each other, the conductive adhesive 37 is cured by heating, and the light receiving body 2 is bonded.
1 and the second step of connecting the adapter part 26, the assembly process is simplified.
第１図は本発明に係る平面部に取付けるフォトディテク
タ構造の分解状態の斜視図、第２図は同組立て状態の斜
視図、第３図の（イ）、（ロ）、（ハ）、（ニ）はフォ
トディテクタ構造の構成部品の製造Ｔ程図、第４図の（
イ）、（ロ）、（ハ）はフォトディテクタ構造の組立Ｔ
程図、第５図は光学式ピックアップ装置の縦断面図であ
る。
２１・・・受光本体。
２２・・・半導体基板、
２３ ａ 、 ２３ ｂ ・・・受光素子、２４ａ、２
４ｂ、２５ａ、２５ｂ
・・・第１の接続用薄膜部、
２７・・・ガラス基板、
２８．３０ａ、３０ｂ
・・・第２の接続用薄膜部、
２９ａ、２９ｂ、３１ａ、３１ｂ
・・・端子用薄膜部、
３２・・・保護膜部、
３６・・・リード線、
３７・・・導電性接着剤。
３８・・・空間部、
３９・・・樹脂。
第３図 第４図
ｔｒ
３９ ３０ｂ第５゛図Fig. 1 is an exploded perspective view of a photodetector structure attached to a flat surface according to the present invention, Fig. 2 is an assembled perspective view of the same, and Figs. ) is the manufacturing process diagram of the component parts of the photodetector structure, and (
A), (B), and (C) are photodetector structure assembly T.
FIG. 5 is a longitudinal sectional view of the optical pickup device. 21... Light receiving body. 22... Semiconductor substrate, 23 a, 23 b... Light receiving element, 24a, 2
4b, 25a, 25b...First connection thin film part, 27...Glass substrate, 28.30a, 30b...Second connection thin film part, 29a, 29b, 31a, 31b...Terminal 32... Protective film part, 36... Lead wire, 37... Conductive adhesive. 38...Space part, 39...Resin. Figure 3 Figure 4 tr
39 30b Figure 5
Claims (3)
には半導体基板と、この半導体基板に形成された受光素
子と、この受光素子に接続された第１の接続用薄膜部と
を設け、アダプタ部には表面と所定の平面部に取付ける
裏面とが平行なガラス基板と、該ガラス基板の表面に形
成され、上記の第１の接続用薄膜部と接続可能な第２の
接続用薄膜部及び第２の接続用薄膜部に接続されたリー
ド線を接続するための端子用薄膜部とを設けたことを特
徴とする平面部に取付けるフォトディテクタの構造。(1) It is composed of a light receiving body and an adapter part, and the light receiving body is provided with a semiconductor substrate, a light receiving element formed on this semiconductor substrate, and a first connecting thin film part connected to this light receiving element, The adapter part includes a glass substrate whose front surface is parallel to a back surface to be attached to a predetermined flat surface, and a second connecting thin film part formed on the front surface of the glass substrate and connectable to the first connecting thin film part. and a terminal thin film portion for connecting a lead wire connected to the second connecting thin film portion.
たことを特徴とする特許請求の範囲第１項記載の平面部
に取付けるフォトディテクタの構造。(2) A structure of a photodetector attached to a flat surface according to claim 1, characterized in that a space between the light receiving body and the adapter part is filled with resin.
と共に、第２の接続用薄膜部に熱硬化性樹脂の導電性接
着剤を塗布する第１の工程と、アダプタ部の第２の接続
用薄膜部に対して受光本体の第１の接続用薄膜部を対向
して接合した後、加熱により上記の導電性接着剤を硬化
させて、受光本体とアダプタ部とを接続する第２の工程
とから構成したことを特徴とする平面部に取付けるフォ
トディテクタの組立方法。(3) A first step of connecting the lead wire to the terminal thin film part of the adapter part and applying a thermosetting resin conductive adhesive to the second connecting thin film part; After bonding the first connecting thin film part of the light receiving body to the connecting thin film part, the conductive adhesive is cured by heating to form a second connecting thin film part that connects the light receiving body and the adapter part. 1. A method for assembling a photodetector to be attached to a flat surface, characterized by comprising the steps of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23043985A JPS6289249A (en) | 1985-10-16 | 1985-10-16 | Structure of photodetector attached to plane part and its assembling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23043985A JPS6289249A (en) | 1985-10-16 | 1985-10-16 | Structure of photodetector attached to plane part and its assembling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6289249A true JPS6289249A (en) | 1987-04-23 |
| JPH0465460B2 JPH0465460B2 (en) | 1992-10-20 |
Family
ID=16907917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23043985A Granted JPS6289249A (en) | 1985-10-16 | 1985-10-16 | Structure of photodetector attached to plane part and its assembling method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289249A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01145530A (en) * | 1987-12-02 | 1989-06-07 | Hitachi Medical Corp | Light detection element |
| US6741407B2 (en) | 2001-05-15 | 2004-05-25 | Funai Electric Co., Ltd. | Optical pickup and method of fixing a plate with an electronic component |
-
1985
- 1985-10-16 JP JP23043985A patent/JPS6289249A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01145530A (en) * | 1987-12-02 | 1989-06-07 | Hitachi Medical Corp | Light detection element |
| US6741407B2 (en) | 2001-05-15 | 2004-05-25 | Funai Electric Co., Ltd. | Optical pickup and method of fixing a plate with an electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0465460B2 (en) | 1992-10-20 |
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