JPS6289185U - - Google Patents
Info
- Publication number
- JPS6289185U JPS6289185U JP18121785U JP18121785U JPS6289185U JP S6289185 U JPS6289185 U JP S6289185U JP 18121785 U JP18121785 U JP 18121785U JP 18121785 U JP18121785 U JP 18121785U JP S6289185 U JPS6289185 U JP S6289185U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- wiring board
- multilayer wiring
- circuit pattern
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 239000011889 copper foil Substances 0.000 claims 4
- 238000007747 plating Methods 0.000 claims 3
- 238000005259 measurement Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18121785U JPS6289185U (lv) | 1985-11-25 | 1985-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18121785U JPS6289185U (lv) | 1985-11-25 | 1985-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289185U true JPS6289185U (lv) | 1987-06-08 |
Family
ID=31125883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18121785U Pending JPS6289185U (lv) | 1985-11-25 | 1985-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289185U (lv) |
-
1985
- 1985-11-25 JP JP18121785U patent/JPS6289185U/ja active Pending