JPS6289177U - - Google Patents
Info
- Publication number
- JPS6289177U JPS6289177U JP1985180159U JP18015985U JPS6289177U JP S6289177 U JPS6289177 U JP S6289177U JP 1985180159 U JP1985180159 U JP 1985180159U JP 18015985 U JP18015985 U JP 18015985U JP S6289177 U JPS6289177 U JP S6289177U
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal display
- driving
- glass substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Liquid Crystal (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985180159U JPS6289177U (US20070167544A1-20070719-C00007.png) | 1985-11-22 | 1985-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985180159U JPS6289177U (US20070167544A1-20070719-C00007.png) | 1985-11-22 | 1985-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289177U true JPS6289177U (US20070167544A1-20070719-C00007.png) | 1987-06-08 |
Family
ID=31123861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985180159U Pending JPS6289177U (US20070167544A1-20070719-C00007.png) | 1985-11-22 | 1985-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289177U (US20070167544A1-20070719-C00007.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01232735A (ja) * | 1988-03-11 | 1989-09-18 | Matsushita Electric Ind Co Ltd | 半導体装置の実装体 |
| JPH0344945A (ja) * | 1989-07-12 | 1991-02-26 | Matsushita Electric Ind Co Ltd | 半導体装置の実装体およびその実装方法 |
| JPH07201921A (ja) * | 1993-11-25 | 1995-08-04 | Nec Corp | 半導体装置 |
-
1985
- 1985-11-22 JP JP1985180159U patent/JPS6289177U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01232735A (ja) * | 1988-03-11 | 1989-09-18 | Matsushita Electric Ind Co Ltd | 半導体装置の実装体 |
| JPH0344945A (ja) * | 1989-07-12 | 1991-02-26 | Matsushita Electric Ind Co Ltd | 半導体装置の実装体およびその実装方法 |
| JPH07201921A (ja) * | 1993-11-25 | 1995-08-04 | Nec Corp | 半導体装置 |
