JPS6287465U - - Google Patents

Info

Publication number
JPS6287465U
JPS6287465U JP1985178065U JP17806585U JPS6287465U JP S6287465 U JPS6287465 U JP S6287465U JP 1985178065 U JP1985178065 U JP 1985178065U JP 17806585 U JP17806585 U JP 17806585U JP S6287465 U JPS6287465 U JP S6287465U
Authority
JP
Japan
Prior art keywords
comb
conductive
mounting hole
mounting
protruding teeth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985178065U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416457Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985178065U priority Critical patent/JPH0416457Y2/ja
Publication of JPS6287465U publication Critical patent/JPS6287465U/ja
Application granted granted Critical
Publication of JPH0416457Y2 publication Critical patent/JPH0416457Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structure Of Printed Boards (AREA)
JP1985178065U 1985-11-19 1985-11-19 Expired JPH0416457Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985178065U JPH0416457Y2 (https=) 1985-11-19 1985-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985178065U JPH0416457Y2 (https=) 1985-11-19 1985-11-19

Publications (2)

Publication Number Publication Date
JPS6287465U true JPS6287465U (https=) 1987-06-04
JPH0416457Y2 JPH0416457Y2 (https=) 1992-04-13

Family

ID=31119849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985178065U Expired JPH0416457Y2 (https=) 1985-11-19 1985-11-19

Country Status (1)

Country Link
JP (1) JPH0416457Y2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009059966A (ja) * 2007-08-31 2009-03-19 Panasonic Corp 実装用基板及び発光モジュール
JP2018503984A (ja) * 2015-05-27 2018-02-08 深▲セン▼市華星光電技術有限公司 発光素子組立構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009059966A (ja) * 2007-08-31 2009-03-19 Panasonic Corp 実装用基板及び発光モジュール
JP2018503984A (ja) * 2015-05-27 2018-02-08 深▲セン▼市華星光電技術有限公司 発光素子組立構造

Also Published As

Publication number Publication date
JPH0416457Y2 (https=) 1992-04-13

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