JPS6286851A - Laser trimming apparatus - Google Patents

Abstract

PURPOSE:To prevent the insulation of an element to be trimmed from deteriorating by removing a laser light of a laser of power more than required by a shutter, and then operating a pulse light of normal power onto a substrate to trim it. CONSTITUTION:A laser trimming apparatus has a laser oscillator 1, a shutter 4 for shielding the pulse light 2 of a laser provided in the midway of a laser light passage to a beam positioner, a shutter controller 5 for telescoping the shutter 4 on the pulse optical axis of the laser, and a laser controller 6. When trimming, the shutter 4 mounted in the controller 5 is controlled by a control signal from the controller 6, the pulse light 2 of the laser from the oscillator 1 is shielded at the order counted several pulses from the initial pulse light from the start of emitting to a substrate 7 first in the state that the shutter 4 is closed, the shutter 4 is opened by a control signal from the controller 6, and the light 2 is emitted onto the substrate 7 for trimming.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a laser tribulation device for conditioning hybrid integrated circuits.

[Conventional technology]

Conventionally, when trimming with a laser beam, the beam positioner 3 is moved as shown in Fig.
The resistor and the like on the substrate 7 are trimmed by irradiating the substrate with pulsed laser light 2 generated from a laser oscillator 1 using a switch for each Q-switch pulse. 8 and 9 are reflecting mirrors, 10 is a condensing lens, and 11 is a laser control section.

[Problem that the invention seeks to solve]

In the conventional laser IJ trimming device described above, when trimming is performed by irradiating laser pulse light for each pulse, the first pulse light of the laser during trimming is applied to the object to be trimmed by the laser light. Since it is irradiated with a power several times higher than the power required for cutting, it gives a large thermal shock to the object to be trimmed.For example, if the object to be trimmed is formed on a silicon substrate, the single pulse light described above is applied. When irradiated, the laser beam penetrates through the silicon insulating layer and creates a hole in the underlying silicon layer, which has the disadvantage of deteriorating the insulation properties.The present invention solves the above problem. The present invention provides a trimming device that performs trimming after temporarily blocking pulsed light having a power greater than the required power.

[Means for solving problems]

The laser trimming device of the present invention includes a laser oscillator,
A shutter is installed in the laser optical path leading to the beam positioner to block the laser pulsed light, a shutter control unit that moves the shutter in and out of the laser pulsed optical axis, and several pulses from the first pulsed light irradiated onto the object to be trimmed. The apparatus is characterized in that it includes a laser control section that opens the shutter to perform trimming after the pulsed light is blocked by a closed shutter.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, the device of the present invention includes a laser oscillator 1, a shutter 4 provided in the middle of the laser optical path leading to the beam positioner to block the laser pulse light 2, and a shutter control for moving the shutter 4 in and out of the laser pulse optical axis. 5, and a shutter 4 that is closed to emit several pulsed lights counting from the first pulsed light irradiated onto the object to be trimmed.
The laser control section 6 has a laser control section 6 that opens the shutter 4 after blocking the light and executes trimming. 8 and 9 are reflecting mirrors, and 10 is a condenser lens.

In the embodiment, when trimming is performed, the shutter 4 attached to the shutter control unit 5 is controlled by a control signal from the laser control unit 6, and the laser pulse from the laser oscillator 1 is first applied while the shutter 4 is closed. After blocking several pulsed lights of the light 2 counting from the first pulsed light at the start of irradiation to the substrate 7, the shutter control unit 5 is controlled by a control signal from the laser control unit 6 to open the shutter 4, Trimming is performed by irradiating the substrate 7 with pulsed laser light 2 .

〔Effect of the invention〕

As explained above, the present invention uses a shutter to remove the pulsed laser beam with more power than necessary, and then applies the pulsed beam with normal power to the substrate for trimming. The effect is that there is no need to apply a thermal shock, and even if the object to be trimmed is formed on a silicon substrate, the insulation properties will not deteriorate because the laser pulse light irradiation will not break through the silicon insulation layer. It has the following.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing an embodiment of the present invention, and FIG. 2 is a schematic diagram of a conventional laser trimming device.

Claims (1)

[Claims] (1) A laser oscillator, a shutter installed in the laser optical path leading to the beam positioner to block the laser pulse light, a shutter control unit that moves the shutter into and out of the optical axis of the laser pulse light, and irradiates the object to be trimmed. 1. A laser trimming device comprising: a laser control unit that blocks several pulsed lights from the first pulsed light by a closed shutter, and then opens the shutter to perform trimming.