JPH07124766A - Method for controlling eximer laser machining - Google Patents

Method for controlling eximer laser machining

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Publication number
JPH07124766A
JPH07124766A JP27510593A JP27510593A JPH07124766A JP H07124766 A JPH07124766 A JP H07124766A JP 27510593 A JP27510593 A JP 27510593A JP 27510593 A JP27510593 A JP 27510593A JP H07124766 A JPH07124766 A JP H07124766A
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Patent type
Prior art keywords
laser
beam
machining
strength
controller
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Pending
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JP27510593A
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Japanese (ja)
Inventor
Kenichi Inoue
Kaoru Katayama
Takaaki Kitahara
憲一 井上
孝晃 北原
薫 片山
Original Assignee
Hitachi Computer Electron Co Ltd
Hitachi Ltd
株式会社日立コンピュータエレクトロニクス
株式会社日立製作所
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Abstract

PURPOSE:To minimize the effect of an eximer laser to a substrate of organic material. CONSTITUTION:Emitting strength of a plume generated when the substrate is machined is detected and the emitting strength is transmitted to a finish detection controller 10 by a beam receiving part 9 provided on the side wall of a machining chamber 5. When a specific emitting strength is detected, a signal by which laser beam emission is stopped is transmitted from the finish detection controller 10 to a machining process controller 11 and laser beam emission by a laser beam oscillator 1 is stopped.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、エキシマレーザで有機材料を除去、加工するエキシマレーザ加工制御方法に関する。 The present invention relates to the removal of organic materials with an excimer laser, to excimer laser machining control method for processing.

【0002】 [0002]

【従来の技術】エキシマレーザで有機材料を除去、加工する場合、加工対象の厚さなどを考慮して、エネルギー密度や重ね照射数等の加工条件が決められるが、一般的には、加工対象の有機材料の厚さのバラツキを考慮して、多少オーバーエッチとなる加工条件になる。 BACKGROUND ART removing organic material with an excimer laser, when processing, in consideration of thickness of the processing target, the energy density and overlapping processing conditions of illumination such as the number is determined, in general, the processing object in consideration of the thickness variation of the organic material, the processing conditions more or less the over-etching.

【0003】また、このようなオーバーエッチとなる加工条件において、加工対象の有機材料の下地に対してエキシマレーザによる影響(例えば、溶融、クラックなどのダメージ等)が生じる場合には、エネルギー密度をエキシマレーザによる影響のない低エネルギーの加工条件とするなどの対策が採られる。 [0003] Further, in the processing conditions to be such overetching, the influence of the excimer laser with respect to the underlying organic materials to be processed (e.g., melting, damage such as cracks) if occurs, the energy density measures such as the low-energy processing conditions not affected by the excimer laser is employed.

【0004】なお、この種の関連する技術として、例えば、装置を小型化したレーザ加工機(特開昭63−27 [0004] As a related technology of this kind, for example, a laser processing machine miniaturized device (JP 63-27
3581号公報を参照)が挙げられる。 See 3581 JP) and the like.

【0005】 [0005]

【発明が解決しようとする課題】上記したように、従来、エキシマレーザで有機材料を加工する場合に、オーバーエッチとなる加工条件を採っているので、加工対象となる有機材料の下地に対して、エキシマレーザによる影響が生じるという問題がある。 As described above [0008] Conventionally, when processing the organic material with an excimer laser, is adopted processing conditions to be over-etched, with respect to the underlying organic material to be processed , there is a problem that the effect of the excimer laser is generated. そして、これを回避するためには、加工条件を種々設定しなければならず、加工装置に大きな負担がかかり、また、ダメージが生じない有機材料を選択しなければならない。 Then, in order to avoid this, the processing conditions must be variously set, a large burden is applied to the processing device, it must also select the organic material that does not cause damage.

【0006】本発明の目的は、有機材料の下地に対するエキシマレーザの影響を最小限に抑えたエキシマレーザ加工制御方法を提供することにある。 An object of the present invention is to provide an excimer laser processing control method to minimize the effects of excimer laser for the underlying organic materials.

【0007】 [0007]

【課題を解決するための手段】前記目的を達成するために、請求項1記載の発明では、エキシマレーザで有機材料を除去、加工する加工制御方法において、エキシマレーザで有機材料を除去、加工するときに発生するプルームの発光強度を検出することにより、前記加工の終了検出を行うことを特徴としている。 To SUMMARY OF THE INVENTION To achieve the above object, in the first aspect of the present invention, removal of the organic material with an excimer laser, the machining control method for processing, removal of the organic material with an excimer laser, is processed by detecting the emission intensity of the plume that occurs when, is characterized by the termination detection of the processing.

【0008】請求項2記載の発明では、エキシマレーザで有機材料を除去、加工する加工制御方法において、エキシマレーザで有機材料を除去、加工するときに発生するプルームの発光強度を検出し、該発光強度が所定の閾値以下となったとき前記加工の終了と判定し、エキシマレーザを停止制御することを特徴としている。 [0008] In the second aspect of the present invention, removal of the organic material with an excimer laser, the machining control method for processing, removal of the organic material with an excimer laser, to detect the emission intensity of plume generated when machining, the light emitting strength is determined that the termination of the processing when it becomes less than a predetermined threshold value, and characterized in that the stop control an excimer laser.

【0009】 [0009]

【作用】エキシマレーザで有機材料を除去、加工する際に発生するプルームの発光強度を検知することにより、 [Action] removing the organic material with an excimer laser, by detecting the emission intensity of the plume generated during the machining,
有機材料の残量の有無を判定し、加工の終了検出を行う。 Determining whether the remaining amount of organic material, the termination detection processing. 加工対象である有機材料が加工により消滅したことを検出すると、エキシマレーザを停止し、有機材料の下地に対するエキシマレーザの影響を最小限に抑える。 When the organic material is a processing target is detected to be extinguished by the machining, an excimer laser is stopped, to minimize the effects of excimer laser for the underlying organic materials.

【0010】 [0010]

【実施例】以下、本発明の一実施例を図面を用いて具体的に説明する。 EXAMPLES Hereinafter, will be specifically described with reference to an embodiment of the present invention with reference to the accompanying drawings. 図1は、本発明の一実施例の装置構成図である。 Figure 1 is an apparatus configuration diagram of an embodiment of the present invention. 図において、1はエキシマレーザ発振器、2はエキシマレーザ光路、3はレーザ光を反射して加工対象に照射するためのミラー、4はレンズなどからなる加工光学系、5は加工室、6は有機材料(例えば、ポリイミド系樹脂の有機絶縁膜など)、7は基板(例えば、セラミック基板など)、8は加工対象を所定位置に移動させる加工ステージ、9はプルームを検知する受光部、10 In the figure, 1 is an excimer laser oscillator, 2 excimer laser beam path, the mirror for irradiating the processing object reflects the laser beam 3, machining optical system consisting of a lens 4, 5 machining chamber, 6 an organic material (e.g., an organic insulating film of polyimide resin), 7 denotes a substrate (e.g., a ceramic substrate), the processing stage 8 for moving the processing target in the predetermined position, 9 light receiving portion for detecting a plume, 10
は加工対象の終了を検出する終了検出コントローラ、1 End detection controller that detects the end of the processing target is 1
1はエキシマレーザ発振器1にレーザ照射の停止信号を送出する加工プロセスコントローラである。 1 is a machining process controller for sending a stop signal of the laser irradiation in the excimer laser oscillator 1.

【0011】ところで、エキシマレーザで有機材料を除去、加工する際に、プルーム(Plume)と呼ばれる現象が発生する(プルームとは「水中の原子爆発による水煙柱」の意味で発光を伴う)。 [0011] By the way, remove the organic material with an excimer laser, at the time of processing, (with an emission in the sense of "hookah posts by underwater atomic explosion," the plume) phenomenon called plume (Plume) occurs. このプルームは、加工対象である有機材料の加工が進んで有機材料がなくなると消滅する。 This plume is extinguished and the organic material is eliminated in progress processing of organic material is a processing object.

【0012】そこで、本発明ではこのプルームの発光強度を検知することにより、加工の終点検出を行うとともに、エキシマレーザの停止をコントロールする。 [0012] Therefore, in the present invention by detecting the emission intensity of the plume, and performs end point detection processing, to control the stopping of the excimer laser.

【0013】図2は、プルームの発光強度変化の一例と、オン/オフ制御されるレーザ発振信号を示す。 [0013] Figure 2 shows a an example of a change in emission intensity of the plume, the laser oscillation signal is on / off controlled. すなわち、12は、プルームの発光強度の変化曲線であり、 That is, 12 is the change curve of the emission intensity of the plume,
該曲線上で、加工が進み有機材料がなくなる発光強度が13の値であるとき、時間14の時点でレーザ光の照射を停止することを表している。 In the curved line, when the emission intensity of the organic material processing advances is eliminated is the value of 13, indicates that the stopping irradiation of the laser beam at the point of time 14.

【0014】以下、本発明の動作を説明すると、基板7 [0014] Explaining the operation of the present invention, the substrate 7
上の有機材料6を、エキシマレーザで除去、加工するとき(例えば、セラミック基板上の有機材料にレーザ光を照射して穴を開ける加工処理)、本実施例では、加工室5の側壁に設けられた受光部9は、有機材料6を加工する際に発生するプルームの発光強度を検知する。 The organic material 6 above, removed with an excimer laser, when machining (e.g., drilling processing by irradiating a laser beam to the organic material on the ceramic substrate), in this embodiment, side wall of the processing chamber 5 receiving portion 9 which is detects the luminous intensity of the plume generated during the processing of organic material 6.

【0015】受光部9で検知された発光強度は、信号として終了検出コントローラ10に伝送される。 [0015] luminous intensity detected by the light receiving portion 9 is transmitted to the end detection controller 10 as a signal. そして、 And,
発光強度と加工終了との相関関係に基づいて、特定の発光強度(図2の13)になると、終了検出コントローラ10は、有機材料がなくなり加工が終了したことを検出し、加工プロセスコントローラ11に対してレーザ照射停止の信号を伝送し、これにより加工プロセスコントローラ11は、エキシマレーザ発振器1を停止させる。 Based on the correlation between the luminous intensity and the machining end, at a predetermined light emission intensity (13 in FIG. 2), end detection controller 10 detects that the processing eliminates the organic material is completed, the processing process controller 11 It transmits a signal to stop the laser irradiation for, thereby machining process controller 11 stops the excimer laser oscillator 1.

【0016】図2に示すプルーム発光強度変化曲線12 The plume emission intensity change curve 12 shown in FIG. 2
は、予め実験などにより求めておき、レーザ照射停止すべき時点の発光強度13を、終了検出コントローラ10 Is previously found through an experiment or the like in advance, the light emission intensity 13 of when to stop the laser irradiation, end detection controller 10
に設定しておく。 It is set to. 例えば、材料毎にあるいは製品(例えば、半導体チップなど)毎にプルーム発光強度変化曲線を求め、そのレーザ照射停止すべき時点の発光強度を終了検出コントローラ10内のテーブルに設定しておく。 For example, the material or for each product (e.g., a semiconductor chip, etc.) determine the plume emission intensity variation curve for each, setting the emission intensity of the time to stop the laser irradiation in the table of end detection controller 10.
そして、終了検出コントローラ10は、受光部9で検知された発光強度が設定された発光強度13以下になったことを検出すると、加工プロセスコントローラ11に対してレーザ照射停止の信号を送り、加工プロセスコントローラ11はエキシマレーザ発振器1を停止させる。 The end detection controller 10 detects that the emission intensity detected by the light receiving portion 9 is equal to or less than the light emission intensity 13 that is set, sends a signal to stop the laser irradiation with respect to machining process controller 11, the processing process the controller 11 stops the excimer laser oscillator 1.

【0017】 [0017]

【発明の効果】以上、説明したように、請求項1記載の発明によれば、プルームの発光強度を検出することにより加工の終了を検出しているので、加工対象物の加工の程度が直接把握され、有機材料の下地に対するエキシマレーザの影響を最小限に抑えることができ、これにより下地材料の選択性がより拡大する。 Effect of the Invention] As described above, according to the first aspect of the invention, since detecting the end of machining by detecting the emission intensity of the plume, the degree of machining of the workpiece is directly grasped, it is possible to minimize the effects of excimer laser for the underlying organic material, thereby selectivity of the underlying material is further expanded.

【0018】請求項2記載の発明によれば、加工の終了を判定する所定の閾値を、有機材料、製品などに応じて任意に設定できるので、加工に要するエキシマレーザの重ね照射数についても最小限に抑えることができ、これにより加工装置の処理能力や経済性も格段に向上する。 According to the second aspect of the present invention, the predetermined threshold value determining the end of processing, organic materials, it is possible to arbitrarily set depending on the products, a minimum also superimposed irradiation number of the excimer laser necessary for processing It can be suppressed to limit, thereby also significantly improved throughput and economics of processing equipment.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の一実施例の装置構成図である。 1 is a system configuration diagram of an embodiment of the present invention.

【図2】プルームの発光強度変化の一例と、オン/オフ制御されるレーザ発振信号を示す。 2 shows a an example of a change in emission intensity of the plume, the laser oscillation signal is on / off controlled.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 エキシマレーザ発振器 2 エキシマレーザ光路 3 ミラー 4 加工光学系 5 加工室 6 有機材料 7 基板 8 加工ステージ 9 受光部 10 終了検出コントローラ 11 加工プロセスコントローラ 1 an excimer laser oscillator 2 excimer laser beam path 3 mirror 4 machining optical system 5 working chamber 6 organic material 7 substrate 8 working stages 9 light receiving portion 10 terminates detection controller 11 processing process controller

フロントページの続き (72)発明者 片山 薫 神奈川県秦野市堀山下1番地 株式会社日 立製作所汎用コンピュータ事業部内 (72)発明者 井上 憲一 神奈川県秦野市堀山下1番地 株式会社日 立製作所汎用コンピュータ事業部内 Of the front page Continued (72) inventor Kaoru Katayama Kanagawa Prefecture Hadano Horiyamashita one address, Inc. Date falling Mfg general purpose computer business unit (72) inventor Inoue, Kenichi Kanagawa Prefecture Hadano Horiyamashita one address, Inc. Date falling Mfg general purpose computer in the Division

Claims (2)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 エキシマレーザで有機材料を除去、加工する加工制御方法において、エキシマレーザで有機材料を除去、加工するときに発生するプルームの発光強度を検出することにより、前記加工の終了検出を行うことを特徴とするエキシマレーザ加工制御方法。 1. A removal of the organic material with an excimer laser, the machining control method for processing, removal of the organic material with an excimer laser, by detecting the emission intensity of plume generated when machining, the end detection of the processing excimer laser processing control method and performing.
  2. 【請求項2】 エキシマレーザで有機材料を除去、加工する加工制御方法において、エキシマレーザで有機材料を除去、加工するときに発生するプルームの発光強度を検出し、該発光強度が所定の閾値以下となったとき前記加工の終了と判定し、エキシマレーザを停止制御することを特徴とするエキシマレーザ加工制御方法。 2. A removal of the organic material with an excimer laser, the machining control method for processing, removal of the organic material with an excimer laser, to detect the emission intensity of plume generated when machining, the light emitting intensity is below a predetermined threshold value determining the end of the processing time became, excimer laser machining control method characterized by stopping controlling excimer laser.
JP27510593A 1993-11-04 1993-11-04 Method for controlling eximer laser machining Pending JPH07124766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27510593A JPH07124766A (en) 1993-11-04 1993-11-04 Method for controlling eximer laser machining

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27510593A JPH07124766A (en) 1993-11-04 1993-11-04 Method for controlling eximer laser machining

Publications (1)

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JPH07124766A true true JPH07124766A (en) 1995-05-16

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8435437B2 (en) 2009-09-04 2013-05-07 Abbott Cardiovascular Systems Inc. Setting laser power for laser machining stents from polymer tubing
US8679394B2 (en) 2010-06-10 2014-03-25 Abbott Cardiovascular Systems Inc. Laser system and processing conditions for manufacturing bioabsorbable stents
US9038260B2 (en) 2006-05-26 2015-05-26 Abbott Cardiovascular Systems Inc. Stent with radiopaque markers
US9198785B2 (en) 2010-01-30 2015-12-01 Abbott Cardiovascular Systems Inc. Crush recoverable polymer scaffolds
US9532888B2 (en) 2006-01-04 2017-01-03 Abbott Cardiovascular Systems Inc. Stents with radiopaque markers
US9827119B2 (en) 2010-01-30 2017-11-28 Abbott Cardiovascular Systems Inc. Polymer scaffolds having a low crossing profile

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9532888B2 (en) 2006-01-04 2017-01-03 Abbott Cardiovascular Systems Inc. Stents with radiopaque markers
US9694116B2 (en) 2006-05-26 2017-07-04 Abbott Cardiovascular Systems Inc. Stents with radiopaque markers
US9038260B2 (en) 2006-05-26 2015-05-26 Abbott Cardiovascular Systems Inc. Stent with radiopaque markers
US9358325B2 (en) 2006-05-26 2016-06-07 Abbott Cardiovascular Systems Inc. Stents with radiopaque markers
US8435437B2 (en) 2009-09-04 2013-05-07 Abbott Cardiovascular Systems Inc. Setting laser power for laser machining stents from polymer tubing
US9198785B2 (en) 2010-01-30 2015-12-01 Abbott Cardiovascular Systems Inc. Crush recoverable polymer scaffolds
US9763818B2 (en) 2010-01-30 2017-09-19 Abbott Cardiovascular Systems Inc. Method of crimping stent on catheter delivery assembly
US9770351B2 (en) 2010-01-30 2017-09-26 Abbott Cardiovascular Systems Inc. Crush recoverable polymer scaffolds
US9827119B2 (en) 2010-01-30 2017-11-28 Abbott Cardiovascular Systems Inc. Polymer scaffolds having a low crossing profile
US9867728B2 (en) 2010-01-30 2018-01-16 Abbott Cardiovascular Systems Inc. Method of making a stent
US8679394B2 (en) 2010-06-10 2014-03-25 Abbott Cardiovascular Systems Inc. Laser system and processing conditions for manufacturing bioabsorbable stents
US9744625B2 (en) 2010-06-10 2017-08-29 Abbott Cardiovascular Systems Inc. Laser system and processing conditions for manufacturing bioabsorbable stents

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