JPS6286811A - Sealing plate of capacitor and manufacture of the same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a sealing plate for sealing the opening of a container of a capacitor such as a chemical capacitor, and a method for manufacturing the n-port plate.

[Background Art] As shown in FIGS. 6(a) and 6(b), the sealing plate A' of a conventional capacitor mainly consists of a substrate 1' made of 7-enol resin and an elastic plate 2' made of rubber. is formed, the elastic plate 2' is stacked on one side of the substrate 1', the positioning protrusion a of the substrate 1' is aligned with the positioning hole, and the rivet (d) is connected via the terminal C to the elastic plate 2' and the substrate 1'. I then inserted the washer e into the tip of the rivet (d) and assembled it. This sealing plate A' is used to seal the end face of the capacitor container r, and is used to swage the end of the container to airtightly attach the terminal C, like the end face on the 10 pole side of a dry battery.
An elastic plate 2' is required to airtightly mount it.

However, in the conventional sealing plate A', the substrate 1
′, the elastic @2′ must be brought into contact with the terminal C, and the rib d must be tightened and integrated with the washer e, which has the drawback that assembly is complicated and requires a lot of man-hours, as well as the number of parts increases. There was a drawback.

[Object of the Invention] The present invention has been made in view of the points described above, and an object of the present invention is to easily manufacture parts,
It is an object of the present invention to provide a sealing plate for a capacitor that can reduce the α number and a method for manufacturing the same.

DISCLOSURE OF THE INVENTION 1 The present invention solves the drawbacks of the conventional example by embedding and integrating a substrate on one side of a substrate made of hard resin. In other words, by integrally forming the gasket on the board, there is no need for assembling, unlike in the United States, and there is no need for parts to be fastened, making it possible to reduce the number of parts.

The present invention will be explained in detail below with reference to Examples.

N-hole plate A of the capacitor is shown in PIS diagram 1, diagrams 2 (a) and (b).
) As shown in (e), a terminal hole 3 is bored in the center of a disk-shaped substrate 1 made of hard resin such as phenolic resin, and a filling recess 41 provided on one side of the base 1 is filled with rubber. In this embodiment, the filling recess 4 provided on one side of the substrate 1 is an annular recess 4a along the periphery of the substrate 1. and an 11M-shaped recess 4b surrounding the terminal hole 3, and the entire filling recess 4 is filled with an elastic resin packing 2.

This sealing plate A is manufactured as follows. - The large mold B is composed of an upper mold 5 and a lower mold 6, as shown in FIG. , the upper mold 5 is filled with the concave molding protrusion 1
5 is provided, and four small convex molded portions 13 are provided around the periphery of the four filled molded protrusions 915. The upper mold 5 and lower mold 6 of this large mold B are aligned, and 7
The substrate 1 is molded by injecting a hard resin such as enol resin. After molding the substrate 1, the upper mold 5 is released and the mold is opened.
A filling recess 4 is formed on one side of the thus formed substrate 1 from which the substrate 1 is taken out, and a micro protrusion 14 is formed at the periphery of the filling recess 4 by a micro protrusion forming recess 13 . The secondary molding mold C is composed of an upper mold 9 and a lower mold 10 as shown in FIGS. It is a protruding structure. The substrate 1 is placed in the cavity 20 of the lower mold 10 of this secondary mold C.
is inserted. At this time, the upper part of the minute protrusion 14 slightly protrudes from the upper surface of the lower mold 10, as shown in FIG. #S4 (, ). With the substrate 1 set in the lower mold 10, the upper mold 9 is clamped, and as shown in PIS 3 (c), the lower surface of the upper mold 9 is brought into contact with the minute protrusions 14, and in this state, the rubber The filling recess 4 is filled with an elastic resin as shown in Figure 4 (b).
The packing 2 is molded as shown in FIG. At this time, since the mold surface of the lower surface of the upper mold 9 is in contact with the minute protrusions 14, the peripheral edge of the packing 2 does not protrude suddenly. The mold 9 is opened upward and the molded sealing plate A is taken out.

In the above embodiment, the lower mold 6 of the primary mold B and the lower mold 10 of the secondary mold C are separate, but they may be used together.

The sealing plate A formed in this manner is used for sealing a capacitor container. That is, the sealing plate A is arranged at the opening at the end of the container, the annular gasket 2 on the periphery is brought into elastic contact with the opening edge of the container, and the terminal body protruding from the main body inside the container is inserted into the terminal hole 3. , a sealing plate A is fixed to the container.

In addition, FIGS. 5(a), 5(b), and 5(c) show other embodiments of the sealing plate A. In this embodiment, a plurality of positioning legs 16 are protruded from the surface of the substrate 1 on the side where the gasket 2 is buried. board 1
A separator 17 that partitions the pair of terminal holes 3 is protruded on the opposite surface of the packing 2, and a step 18 is provided on the periphery of this surface.
There is a periphery. The presence of the positioning legs 16 in this way makes it easy to position and attach the capacitor to the container, and the presence of the separator 17 provides electrical insulation.

Although the present invention has described the sealing plate of a capacitor,
The manufacturing method of the present invention can be widely used for manufacturing parts molded with two types of glue.

[Effects of the Invention] As described above, the present invention integrates an elastic resin puffkin by embedding it in a filling recess provided on one side of a substrate made of hard resin. It is not necessary to assemble the substrate and the elastic plate to be fastened together, so it can be manufactured easily, and the number of parts can be reduced as there is no need for fastening parts as in the past. In addition, the combined invention of the present invention is to mold a hard resin substrate using a primary mold, form minute protrusions on the periphery of a filling recess provided on one side of the substrate, and then mold the substrate into a secondary mold. At the same time as setting, an elastic resin packing is embedded into the filling recess of the substrate with the mold surface of the secondary molding mold in contact with the above-mentioned micro protrusion, so that the micro protrusion on the periphery of the filling recess of the substrate is molded. When molding an elastic resin packing, a part of the packing does not protrude and a product with a good appearance can be obtained. This method does not require any additional work, can be done at low cost, and is free from the risk of being scratched by post-finishing to remove the edges.

[Brief explanation of drawings]

FIG. 1 is a plan view of an embodiment of the sealing plate of the capacitor of the present invention, FIG.
) is a sectional view taken along Y-Yfi in Fig. 1, 2 (e) is a sectional view taken along line 2-2 in Fig. 1, and Figs. 3 (a), (b), and (c) are cross sections showing the same manufacturing method. Figure 4 (II) is Figure 3 (b)
4(b) is an enlarged sectional view of the essential part of FIG. 3(c), and FIG. 5(a), (b), and (c) are other embodiments of the same sealing plate. Top view, front view and bottom view, Figure 16 (a
) is an exploded perspective view of the conventional example, and Fig. 6(b) is Fig. 6(,)
is a perspective view of the assembled state, 1 is a substrate, 2 is a packing, 4 is a filling recess, 14 is a minute protrusion, A is a sealing plate, B
C is a primary mold, and C is a secondary mold. Agent Patent Attorney Ishi 1) Ai 7 Figure 6 (G) 1) 0 Drawing Medium Temperature 3 Figures (a) (b) (e) and Figure 4 (,
) (b) Procedural amendment (voluntary) January 31, 1985

Claims (1)

[Scope of Claims] [1] A sealing plate for a capacitor, characterized in that it is formed by integrating an elastic resin packing embedded in a filling recess provided on one side of a substrate made of hard resin. [2] A hard resin substrate is molded using a primary molding die, and minute protrusions are formed on the periphery of a filling recess formed on one side of the substrate.
The substrate is set in a secondary molding mold, and an elastic resin packing is embedded into the filling recess of the substrate while the mold surface of the secondary molding mold is in contact with the minute protrusions. A method for manufacturing a sealing plate for a capacitor.