JPS5838561Y2 - Electronic component package structure - Google Patents

Description

[Detailed description of the invention] This invention relates to a package structure for electronic components, and in particular, to enable electronic components such as positive temperature coefficient thermistors and semiconductor elements to be easily assembled and stored in a storage member made of a material such as a thermosetting resin. related to the package structure of electronic components.

Generally, when electronic components are housed in a case, a thermoplastic resin is used, and the case and the lid are fitted together by welding or ultrasonic bonding.

However, since thermoplastic resins are generally inferior to thermosetting resins in terms of heat resistance, arc resistance, etc., it is desirable to use thermosetting resins for the structure of packages that house electronic components.

However, thermosetting resins cannot be bonded using melting materials or ultrasonic waves, making assembly and bonding difficult.

FIG. 1 shows a cross-sectional view of an example of a conventional electronic component package structure.

In the figure, an electronic component 110 such as a positive temperature resistor or a semiconductor element has electrodes formed on both sides thereof, and is housed in a case 13 made of a material such as a thermosetting resin.

At this time, in order to store and hold the electronic component 11 in the case 13, it is sandwiched from both sides by a plate-shaped terminal 12 whose tip (one end) is bent into an arched shape and is formed to have elastic force. Retained.

The other end of the terminal plate 12 extends downward along the inner wall of the case 13, and is led out through a through hole formed in the bottom of the case 13 to serve as an external lead terminal for the electronic component.

After housing the terminal board 12 and the electronic component 11, the case 13 is covered with a lid member 14 and sealed with an aluminum member 15.

However, the structure of the electronic component package as shown in FIG. 1 has the problem that it is sealed with an aluminum plate 15, which requires a lot of work to manufacture and is expensive.

In addition, since the terminal board 12 bent into an arch shape holds the electronic component between both sides, and the other end of the terminal board 12 is simply exposed from the case 13, the terminal board 12 is likely to shift, and the electronic component There are also problems such as insufficient electrical contact with 11.

FIG. 2 is a cross-sectional view of the other side of the conventional electronic component package structure.

In the figure, a conventional electronic component package structure 20&-
J The electronic component 21 is electrically connected to the terminal 22 formed integrally with the base 24 on which the printed circuit board is formed, and the electronic component 21 is press-fitted into a cylindrical case 23 having a spring member 25 formed therein. and configured.

However, the package structure shown in FIG. 2 has a problem in that the base 24 on which the printed circuit board is formed is likely to come off when an external force is applied to the case 23 from the lateral direction after it is mounted on the printed circuit board.

Furthermore, a cylindrical case requires a larger area of a flat surface for housing the electronic component 11 than a prismatic case.

Therefore, the main purpose of this invention is to provide a package structure for electronic components that is easy to assemble, provides excellent electrical contact with electronic components, and is inexpensive, which can solve the above-mentioned problems.

The above objects and other objects and features of the present invention will become more apparent from the following detailed description with reference to the drawings.

FIG. 3 is an exploded view of this invention, FIG. 3a is an exploded view, and FIG.

FIG. 4 shows a cross-sectional view of an assembled electronic component package structure according to an embodiment of the present invention.

Next, with reference to FIGS. 3 and 4, the structure of the electronic component package structure 30 of this invention will be explained in the order of assembly.

In the figure, electrodes are formed on both sides of an electronic component 31.

On the other hand, a conductive terminal board (hereinafter referred to as a terminal board) 3 for holding the electronic component 31 and leading the output of the electronic component to the outside.
2 is made of a single conductive metal plate, and protruding pieces 32a and 32b are formed by stamping and molding.

As is clear from FIG. 3B, the terminal plate 32 in which the protruding pieces 32 a t 32 b are formed by punching has a frame portion consisting of four surrounding sides.

The four sides of this frame are in surface contact with one corner of the inner wall of the case.
It functions to stabilize the storage condition of the terminal board.

Preferably, the protruding pieces 32a and 32b are formed so that the top portions that contact the electrode surface of the electronic component 31 are on the same surface and are in contact with the contact surface with a step difference between the upper and lower sides.

Further, a protrusion 3 for preventing removal is provided below the terminal plate 32.
2c is formed by stamping.

Electronic component 3 held between both sides by the terminal board 32
1 (hereinafter referred to as a case) 3
3 is made of thermosetting resin, for example, and is formed into a prismatic shape with an open top and a bottom surface.

Furthermore, a fitting recess 33c is provided on the inner wall of the upper part of the opening of the case 33, into which a cover member 34, which will be described later, is press-fitted.
is formed.

Further, a protrusion 33b for fixing the terminal plate 32 in the horizontal direction is formed along the vertical direction at the corner of the inner wall of the case 33, and a projection 33b for fixing the terminal plate 32 in the horizontal direction is formed on the bottom surface of the case 33. A through hole 33a having a correlated width is formed.

A lid member 34a for sealing this case 33
A protrusion 34a whose shape is selected to fit into the fitting recess 33c of the east case 33 is formed on the side surface of the case 33.

Next, the case of assembling the electronic component package structure 30 of this embodiment will be explained.

One terminal plate 32 is brought into contact with the side wall of the case 33, and the terminal plate 32 is inserted into the through hole 33a formed on the bottom surface of the case 33.
One terminal plate 32 is housed in the case 33 by inserting the lower terminal portion 32d.

Further, the terminal plate 32 is brought into contact with the side wall of the facing case 33, and the lower terminal portion 32d of the terminal plate is inserted into the through hole 33a.

In this way, the two terminal boards 32 are assembled inside the case 33 so that the protruding pieces 32a and 32b face each other, and the electronic component 31, which has electrodes formed on both sides, is inserted from the upper opening of the case 33.

At this time, the protrusions 32a and 32 of the left and right terminal plates 32
At b, the electronic component 31 is held from both sides, but since the four sides of the frame of the terminal board 32 are in surface contact with the inner wall surface of the case 33, the terminal board 32 is stored stably, and therefore the electronic component 31 is held in place on each terminal board. It is held stably by 32.

Thereafter, the lid member 34 is press-fitted from the upper part of the opening of the case 33, and the fitting recess 33c of the case and the fitting protrusion 34a of the lid member 34 are fitted, thereby sealing the electronic component.

At this time, the protrusion 32 provided below the terminal plate 32
c becomes caught on the back side of the bottom of the case 33 in a direction opposite to the press-fitting direction, and the terminal board is prevented from coming off.

As described above, this embodiment provides the following unique effects.

That is, since the protrusion that contacts the electrode of the terminal plate 32 and holds the electronic component is formed by stamping,
Molding of the terminal board becomes extremely easy.

Furthermore, since the terminal plate 32 has a frame portion, it can be stably housed within the case, and therefore it is possible to hold electronic components extremely stably.

In addition, a fitting recess is provided on the upper side wall of the case opening,
The electronic components are sealed by providing a fitting protrusion on the lid member and press-fitting the lid member, so even if the case is made of materials such as thermosetting resin, the joining method is It becomes easy.

Furthermore, since the protrusion is provided on the lower exposed portion of the terminal board, detachment of the terminal board can be prevented.

FIG. 5 is an illustrative view of another example of the conductive terminal plate 32.

In FIG. 5a, two protruding pieces are formed on the inside of the terminal plate 32 by stamping and molding so that the contact surfaces with the electrode surfaces are the same.

Figure 5 shows a terminal plate with one protruding piece stamped and molded inside the terminal plate.

In FIG. 5C, two H-shaped projecting pieces are provided on the inside of the terminal plate by stamping and molding.

In FIG. 5d, the lower end of the terminal plate for leading out to the outside is formed into a stepped shape.

FIG. 6 shows a sectional view of an electronic component package structure according to another embodiment of the invention.

This embodiment differs from FIG. 4 in that the terminal 6 is provided in the middle of the electronic component 31.

The rest of the structure is the same as that in FIG. 4, so the same parts are designated by the same reference numerals and the explanation thereof will be omitted.

As described above, according to this invention, it is possible to obtain a package structure for electronic components that is easy to assemble, provides excellent electrical contact between electronic components, and is inexpensive.

In addition, since the terminal is provided with a frame having four sides,
It is also possible to achieve a package structure for electronic components in which the terminals are stably housed in the housing member, and therefore the electronic components can be held extremely stably.

[Brief explanation of the drawing]

1 and 2 are cross-sectional views of conventional electronic component package structures. FIG. 3 is an illustrative assembly diagram of an electronic component package structure according to an embodiment of this invention. FIG. 4 shows a cross-sectional view of the assembled electronic component package structure of this invention. FIG. 5 is an illustrative view of another example of the terminal board. Figure M6 shows a sectional view of a package structure for an electronic component according to another embodiment of this invention. In the figure, 10 and 20 are conventional electronic component package structures, 30 is an electronic component package structure of this invention, 31 is an electronic component such as a thermistor or a semiconductor element, 32 is a conductive terminal board, and 33 is a case (storage member). , 34 indicates a lid member.

Claims (5)

[Scope of utility model registration request] (1) An electronic component in which electrodes are formed on both sides, and a fitting recess is formed in the circumferential surface of the open inner wall of the upper part, and a plurality of holes are formed in the bottom surface along the inner wall of the lower part. a storage member for storing the storage member; a protruding portion formed by stamping to protrude so as to have elastic force; and a frame portion having four sides surrounding the protruding portion and making surface contact with the inner wall of the storage member. two electrically conductive terminal plates, each of which has a protruding portion that presses the electronic component from both sides to hold it in the storage member, and includes a terminal that is exposed to the outside through a hole in the storage member. A package structure for electronic components, comprising a lid member having a protrusion on a side surface that fits into a fitting recess of the storage member, and seals the storage member by being press-fitted from above the storage member. (2) The projecting portions of the conductive terminal plate are formed in two by stamping molding, and the heights of the projecting tops of both projecting portions are selected to be the same height. Package structure of the electronic component described in (1). (3) A request for registration of a utility model characterized in that the protruding tops of both protruding portions of the conductive terminal plate are selected to have a shape that makes contact with the electrode surface of the electronic component while maintaining a vertical level difference. The package structure of the electronic component described in scope item (2). (4) Utility model registration claims 1 through 1, characterized in that a projection for preventing removal is formed on a portion of the conductive terminal board exposed to the outside from the hole of the storage member. (3) A package structure of an electronic component according to any one of paragraphs. (5) The electronic component package structure according to any one of claims (1) to (4), wherein the electronic component is a positive temperature coefficient thermistor.