JPS6284986U - - Google Patents

Info

Publication number

JPS6284986U

JPS6284986U JP17484385U JP17484385U JPS6284986U JP S6284986 U JPS6284986 U JP S6284986U JP 17484385 U JP17484385 U JP 17484385U JP 17484385 U JP17484385 U JP 17484385U JP S6284986 U JPS6284986 U JP S6284986U

Authority

JP

Japan

Prior art keywords

electronic component

wiring pattern

lower case

component assembly

conductive adhesive

Prior art date

1985-11-15

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000853 adhesive Substances 0.000 claims description 2
• 230000001070 adhesive effect Effects 0.000 claims description 2
• 229920005992 thermoplastic resin Polymers 0.000 claims 1
• 239000003990 capacitor Substances 0.000 description 1

Cited By (1)