JPS6284934U - - Google Patents
Info
- Publication number
- JPS6284934U JPS6284934U JP17597285U JP17597285U JPS6284934U JP S6284934 U JPS6284934 U JP S6284934U JP 17597285 U JP17597285 U JP 17597285U JP 17597285 U JP17597285 U JP 17597285U JP S6284934 U JPS6284934 U JP S6284934U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- semiconductor
- stud
- gasket
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000000498 cooling water Substances 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims 1
- 239000000428 dust Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案による半導体冷却装置の一実施
例を示す要部側断面図、第２図は従来の半導体冷
却装置の構成を示す要部側断面図である。
図中、１はスタツド、２は冷却フイン、３は半
導体素子、４は冷却体、５は冷却水、６は冷却風
、７はコンパウンド、８はコンパウンド貯蔵部、
１０はガスケツト、１２は冷却機構、１５は塵埃
、２０は基板をそれぞれ示す。
FIG. 1 is a sectional side view of a main part showing an embodiment of a semiconductor cooling device according to the present invention, and FIG. 2 is a sectional side view of a main part showing the configuration of a conventional semiconductor cooling device. In the figure, 1 is a stud, 2 is a cooling fin, 3 is a semiconductor element, 4 is a cooling body, 5 is a cooling water, 6 is a cooling air, 7 is a compound, 8 is a compound storage part,
10 is a gasket, 12 is a cooling mechanism, 15 is dust, and 20 is a substrate.
Claims (1)
機構１２を備えた半導体素子３を、冷却水５と冷
却風６とによつて冷却する半導体冷却装置であつ
て、 該半導体冷却装置は、前記スタツド１と冷媒通
路を有する冷却体４とを接合する前記コンパウン
ド７を貯蔵するためのコンパウンド貯蔵部８と、
該コンパウンド貯蔵部８の開口側に配設されたガ
スケツト１０とを具備し、 該ガスケツト１０は、前記冷却体４と前記冷却
機構１２とによつて挾持押圧されるよう構成され
てなることを特徴とする半導体冷却装置。[Claims for Utility Model Registration] A semiconductor cooling device that cools a semiconductor device 3 equipped with a cooling mechanism 12 composed of a stud 1 and a cooling fin 2 using cooling water 5 and cooling air 6, The semiconductor cooling device includes a compound storage section 8 for storing the compound 7 for joining the stud 1 and the cooling body 4 having a refrigerant passage;
A gasket 10 is provided on the opening side of the compound storage section 8, and the gasket 10 is configured to be held and pressed by the cooling body 4 and the cooling mechanism 12. Semiconductor cooling equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17597285U JPS6284934U (en) | 1985-11-14 | 1985-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17597285U JPS6284934U (en) | 1985-11-14 | 1985-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284934U true JPS6284934U (en) | 1987-05-30 |
Family
ID=31115785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17597285U Pending JPS6284934U (en) | 1985-11-14 | 1985-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284934U (en) |
-
1985
- 1985-11-14 JP JP17597285U patent/JPS6284934U/ja active Pending
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