JPS6284930U - - Google Patents
Info
- Publication number
- JPS6284930U JPS6284930U JP17701485U JP17701485U JPS6284930U JP S6284930 U JPS6284930 U JP S6284930U JP 17701485 U JP17701485 U JP 17701485U JP 17701485 U JP17701485 U JP 17701485U JP S6284930 U JPS6284930 U JP S6284930U
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- pellet
- semiconductor
- island
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図イ及びロはそれぞれ本発明を説明するた
めの平面図、断面図、第２図は従来例を説明する
ための断面図である。
図番の説明、１ａ，１ｂは第１、第２の半導体
ペレツト、２はアイランド、３は外部接続リード
、４は内部接続リード、５はモールド樹脂である
。
FIGS. 1A and 1B are a plan view and a sectional view for explaining the present invention, respectively, and FIG. 2 is a sectional view for explaining a conventional example. Explanation of the drawing numbers: 1a and 1b are first and second semiconductor pellets, 2 is an island, 3 is an external connection lead, 4 is an internal connection lead, and 5 is a molded resin.
Claims (1)
導体ペレツトと、該第１、第２のペレツトを載置
するアイランドと、外部接続リードと、前記第１
、第２のペレツトに形成した電極と前記外部リー
ドとを電気的に接続する内部リードと、前記第１
、第２のペレツトを含む主要部を封止したモール
ド樹脂とを備え、前記第１、第２のペレツトは互
いに直交し且つ前記アイランドをはさんで夫々の
一主面が対向するように接着して成ることを特徴
とする半導体装置。 First and second semiconductor pellets each having a memory element formed on one main surface, an island on which the first and second pellets are placed, an external connection lead, and the first semiconductor pellet.
, an internal lead electrically connecting the electrode formed on the second pellet and the external lead;
and a mold resin that seals the main part including the second pellet, and the first and second pellets are glued so that they are perpendicular to each other and face each other with the island in between. A semiconductor device characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17701485U JPS6284930U (en) | 1985-11-18 | 1985-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17701485U JPS6284930U (en) | 1985-11-18 | 1985-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284930U true JPS6284930U (en) | 1987-05-30 |
Family
ID=31117813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17701485U Pending JPS6284930U (en) | 1985-11-18 | 1985-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284930U (en) |
-
1985
- 1985-11-18 JP JP17701485U patent/JPS6284930U/ja active Pending
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