JPS6283086A - Apparatus for recovering grinding waste water - Google Patents

Apparatus for recovering grinding waste water

Info

Publication number
JPS6283086A
JPS6283086A JP60222952A JP22295285A JPS6283086A JP S6283086 A JPS6283086 A JP S6283086A JP 60222952 A JP60222952 A JP 60222952A JP 22295285 A JP22295285 A JP 22295285A JP S6283086 A JPS6283086 A JP S6283086A
Authority
JP
Japan
Prior art keywords
membrane
tank
line
water
waste water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60222952A
Other languages
Japanese (ja)
Inventor
Kazunori Tagami
田上　和徳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP60222952A priority Critical patent/JPS6283086A/en
Publication of JPS6283086A publication Critical patent/JPS6283086A/en
Pending legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)

Abstract

PURPOSE:To enhance the recovery efficiency of waste water and to attain to prolong the life of an UF membrane by the use of a heat resistant UF membrane, by performing the recovery/concn. treatment of waste water generated at the time of the grinding processing of silicon wafer over two stages respectively using the UF membrane and the heat resistant UF membrane. CONSTITUTION:Grinding waste water L1 is recirculated through a tank 1, a pump 4, a prefilter 2, an UF membrane 3 and a line L2 and concentrated by the UF membrane and transmitted water is recovered in a tank 11 through a line L3 while conc. liquid is withdrawn from the line L2 to be introduced into a tank 7 through a line L4. The conc. liquid in the tank 7 is recirculated between a heat resistant membrane 9 and the tank 7 through a line L5 to be subjected to second stage concn. The transmitted water through said UF membrane 9 is returned to the tank 11 through a line L6 and the conc. liquid is recovered in a tank 13. By this method, an expected purpose is achieved and, because the whole is treated with the UF membranes, no public nuisance is generated because all of the processes is executed without using chemicals.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体製造工程において、シリコンウェハーの
研削後の排水を回収する装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for recovering waste water after grinding a silicon wafer in a semiconductor manufacturing process.

〔従来の技術〕[Conventional technology]

め 従来、シリコン研削時に生ずる排水口１１２装置はＵＦ
膜の濾過回収と凝集沈殿回収とを併用していた。すなわ
ち、第２図に示すように排水を集積するタンク２０と、
プレフィルタ−２１と、ＵＦ膜２２とに排水を一ンプ２
３によシ循環させ、ＵＦ膜２２により透過水と濃縮水と
に分離し、透過水を回収する。次にプレフィルタ−２１
を通過した排水の一部を３連のタンク２４ａ　＃　２４
ｂ　ｒ　２４ｃに送シ込み、各タンク２４ａ。Conventionally, the drainage port 112 device that occurs during silicon grinding is UF.
Membrane filtration collection and coagulation sedimentation collection were used together. That is, as shown in FIG. 2, a tank 20 for collecting waste water;
Pump 2 of waste water into the pre-filter 21 and the UF membrane 22
3, the water is separated into permeated water and concentrated water by the UF membrane 22, and the permeated water is recovered. Next, pre-filter 21
A part of the wastewater that has passed through is transferred to three tanks 24a #24.
br 24c, each tank 24a.

２４ｂ　、　２４ｃ内にポンプ２５ａ　＊　２５ｂ　、
　２５ｃでタンク２６ａ。Pumps 25a * 25b in 24b and 24c,
25c and tank 26a.

２６ｂ＊２６ｃ内の無機凝集剤を添加し、スラッジと透
過水とに分離し、これを回収していた。An inorganic flocculant in 26b*26c was added to separate sludge and permeated water, which were then collected.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の回収技術ではＵＦ膜の回収率を高めると
、ＵＦ膜の寿命が短くなるため、一段回収ではあまシ回
収率を高めることができなかった。In the conventional recovery techniques described above, increasing the recovery rate of the UF membrane shortens the life of the UF membrane, so it has not been possible to increase the recovery rate with one-stage recovery.

又、凝集沈殿による回収技術では、装置の設置面積が大
きくなシ、薬品を使用するため公害源となる可能性が、
あるという欠点があった。In addition, recovery technology using coagulation and sedimentation requires a large installation area and uses chemicals, which can become a source of pollution.
There was a drawback.

本発明は前記問題点を解消し、ＵＦ膜による排水回収率
を向上する回収装置を提供するものである。The present invention solves the above-mentioned problems and provides a recovery device that improves the wastewater recovery rate using a UF membrane.

〔問題点を解消するだめの手段〕[Means to resolve the problem]

本発明はシリコン研削時・−の研削加工時に生ずる排水
をＵＦ膜に通して回収する装置において、排水を循還さ
せてＵＦ膜に通し透過水と濃縮水とに分離する第１の分
離回路と、第１の分離回路の濃縮水をさらに循環させて
耐熱ＵＦ膜に通し透過水と濃縮水とに分離する第２の分
離回路とを備えたことを特徴とする研削排水回収装置で
ある。The present invention provides an apparatus for collecting wastewater generated during silicon grinding by passing it through a UF membrane and collecting the wastewater. This is a grinding wastewater recovery device characterized by comprising a second separation circuit that further circulates the concentrated water in the first separation circuit and passes it through a heat-resistant UF membrane to separate it into permeated water and concentrated water.

〔実施例〕〔Example〕

以下、本発明の一実施例を図によシ説明する。 Hereinafter, one embodiment of the present invention will be explained with reference to the drawings.

第１図において、本発明はＵＦ膜に排水を通し透過水と
濃縮水とに分離する第１の分離回路と、第１の分離回路
の濃縮水をさらに透過水と濃縮水とに分離する第２の分
離回路とを備えている。第１の分離回路は研削排水を集
積するタンク１とプレフィルタ−２と、ＵＦＦ２ａ、排
水を循環させるポンプ４とからなる。５はレベルスイッ
チで、タンク１内の液面高さに応じ循環ポンプを制御さ
せる。In FIG. 1, the present invention includes a first separation circuit that passes wastewater through a UF membrane and separates it into permeate water and concentrated water, and a second separation circuit that further separates the concentrated water in the first separation circuit into permeated water and concentrated water. 2 separation circuits. The first separation circuit includes a tank 1 that collects grinding wastewater, a prefilter 2, a UFF 2a, and a pump 4 that circulates the wastewater. 5 is a level switch that controls the circulation pump according to the level of liquid in the tank 1;

６はレベル指示調節器である。6 is a level indicator adjuster.

第２の分離回路はＵＦＦ２ａシ濃縮水を導びき入れるタ
ンク７と、プレフィルタ−８と、耐熱ＵＦ膜９と、排水
を循環させるポンプ１ｏとからなる。The second separation circuit consists of a tank 7 into which the concentrated water of the UFF 2a is introduced, a pre-filter 8, a heat-resistant UF membrane 9, and a pump 1o that circulates the waste water.

１１は透過水回収タンク、１２ｂは透過水回収用ポンプ
、６′はレベル指示調節器である。１３は廃液回収タン
クである。11 is a permeated water recovery tank, 12b is a permeated water recovery pump, and 6' is a level indicator regulator. 13 is a waste liquid recovery tank.

実施例において、研削排水ラインＬ１に通してタンク１
に研削排水が受けられ、循環ポンプ４によシタンク→プ
レフィルタ−２→ＵＦ　膜３−＋タンク１の間を研削排
水が循環ラインＬ、２　ｉＪ通して循環され、ＵＦＦ２
ａシ透過水ラインＬ３を通じて透過水を透過水タンク１
１に回収しラインＬ７を介して排水しながら、研削排水
を濃縮してゆく。これが１段目の回収・濃縮段である。In the embodiment, the tank 1 is passed through the grinding drainage line L1.
The grinding wastewater is received by the circulation pump 4, and the grinding wastewater is circulated between the tank → prefilter 2 → UF membrane 3- + tank 1 through the circulation lines L, 2iJ, and the UFF2
The permeated water is transferred to the permeated water tank 1 through the permeated water line L3.
The grinding waste water is concentrated while being collected and drained through line L7. This is the first recovery/concentration stage.

１段目の過剰濃縮を防止するため、ラインＬ２よシライ
ンＬ４を通じて濃縮された濃縮水を”タンク７へ入れる
。濃縮水はタンク７→プレフィルタ−８→耐熱ＵＦ膜９
→タンク７の間を循環ラインＬ５に通して循環ポンプ１
０によシ循環され、耐熱ＵＦ膜９にょシラインＬ６を通
じて透過水をタンク１１に戻しながら、２段目の濃縮が
行われる。In order to prevent excessive concentration in the first stage, the concentrated water is poured into tank 7 through line L2 and line L4.
→ Pass the circulation line L5 between the tanks 7 and the circulation pump 1.
The second stage of concentration is performed while the permeated water is returned to the tank 11 through the heat-resistant UF membrane 9 and the filter line L6.

２段目の過剰濃縮を防止するため、タンク７よシライン
Ｌ８ヲ通じてパップ的に廃液回収タンク１３へ排出され
る。プレフィルタ−２，８およヒＵＦ膜３耐熱ＵＦ膜９
は各々エアー、逆洗ポンプ１２ａによって定期的に逆洗
される。In order to prevent excessive concentration in the second stage, the liquid is discharged from the tank 7 to the waste liquid recovery tank 13 via the cylinder line L8. Pre-filter 2, 8 and Hi UF membrane 3 Heat-resistant UF membrane 9
are periodically backwashed by air and a backwash pump 12a, respectively.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明はＵＦ膜と耐熱ＵＦ膜の２段
階回収・濃縮方式にすることによシ、排水の回収率を向
上させ、耐熱ＵＦ膜を２段目に使用することにより、循
環運転での温度上昇に強くなシ、ＵＦ膜の寿命を伸ばす
ことができ、又、すべてＵＦ膜で処理しているので、薬
品を使用せず、無公害であシ、凝集沈殿装置を使用した
場合に比べて設置面積を小さくできるという効果がある
。As explained above, the present invention uses a two-stage recovery/concentration method using a UF membrane and a heat-resistant UF membrane to improve the recovery rate of wastewater, and uses a heat-resistant UF membrane in the second stage to improve circulation. It is resistant to temperature rises during operation and can extend the life of the UF membrane.Also, since all treatment is done with the UF membrane, no chemicals are used, there is no pollution, and a coagulation sedimentation device is used. This has the effect of reducing the installation area compared to the conventional case.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の実施例を示すフローシート図、第２図
は従来装置のフローシート図である。 １．７・・・タンク、２．８・・・プレフィルタ−１３
・・・ＵＦ膜、９・・・耐熱ＵＦ膜。FIG. 1 is a flow sheet diagram showing an embodiment of the present invention, and FIG. 2 is a flow sheet diagram of a conventional device. 1.7...Tank, 2.8...Prefilter-13
...UF membrane, 9...Heat-resistant UF membrane.

Claims (1)

【特許請求の範囲】[Claims] （１）シリコンウェハーの研削加工時に生ずる排水をＵ
Ｆ膜に通して回収する装置において、排水を循還させて
ＵＦ膜に通し透過水と濃縮水とに分離する第１の分離回
路と、第１の分離回路の濃縮水をさらに循環させて耐熱
ＵＦ膜に通し透過水と濃縮水とに分離する第２の分離回
路とを備えたことを特徴とする研削排水回収装置。(1) Remove waste water generated during grinding of silicon wafers
In a device that collects wastewater through an F membrane, there is a first separation circuit that circulates wastewater, passes it through a UF membrane, and separates it into permeate water and concentrated water, and a heat-resistant system that circulates the concentrated water in the first separation circuit. A grinding wastewater recovery device characterized by comprising a second separation circuit that passes through a UF membrane and separates permeated water and concentrated water.
JP60222952A 1985-10-07 1985-10-07 Apparatus for recovering grinding waste water Pending JPS6283086A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60222952A JPS6283086A (en) 1985-10-07 1985-10-07 Apparatus for recovering grinding waste water

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60222952A JPS6283086A (en) 1985-10-07 1985-10-07 Apparatus for recovering grinding waste water

Publications (1)

Publication Number Publication Date
JPS6283086A true JPS6283086A (en) 1987-04-16

Family

ID=16790446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60222952A Pending JPS6283086A (en) 1985-10-07 1985-10-07 Apparatus for recovering grinding waste water

Country Status (1)

Country Link
JP (1) JPS6283086A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998049102A1 (en) * 1997-04-28 1998-11-05 Siemens Aktiengesellschaft Method and device for treating wastewaters from a chemical-mechanical polishing process in chip manufacturing
KR100476322B1 (en) * 1996-10-18 2005-07-18 니혼덴기 가부시기가이샤 Method and apparatus for using abrasive recovery materials
WO2008078498A1 (en) * 2006-12-25 2008-07-03 Ngk Insulators, Ltd. Wastewater treatment system and method of wastewater treatment
JP2009262021A (en) * 2008-04-23 2009-11-12 Nippon Engineer Kk Membrane filtration method and membrane filtration apparatus
JP2011168478A (en) * 2010-02-17 2011-09-01 Woongjin Coway Co Ltd Hydrogen energy production system and method for producing hydrogen energy utilizing silicon wastewater
US8303806B2 (en) 2009-02-09 2012-11-06 Planar Solutions, Llc Fluid processing
CN103894924A (en) * 2012-12-25 2014-07-02 株式会社迪思科 Negative pressure generation device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189987A (en) * 1983-04-11 1984-10-27 Nec Corp Circulative use of waste water used for grinding silicon wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189987A (en) * 1983-04-11 1984-10-27 Nec Corp Circulative use of waste water used for grinding silicon wafer

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100476322B1 (en) * 1996-10-18 2005-07-18 니혼덴기 가부시기가이샤 Method and apparatus for using abrasive recovery materials
WO1998049102A1 (en) * 1997-04-28 1998-11-05 Siemens Aktiengesellschaft Method and device for treating wastewaters from a chemical-mechanical polishing process in chip manufacturing
US6506306B1 (en) 1997-04-28 2003-01-14 Infineon Technologies Ag Method and an apparatus for treating wastewater from a chemical-mechanical polishing process used in chip fabrication
WO2008078498A1 (en) * 2006-12-25 2008-07-03 Ngk Insulators, Ltd. Wastewater treatment system and method of wastewater treatment
US7922915B2 (en) 2006-12-25 2011-04-12 Ngk Insulators, Ltd. Wastewater treatment system and method of wastewater treatment
JP2009262021A (en) * 2008-04-23 2009-11-12 Nippon Engineer Kk Membrane filtration method and membrane filtration apparatus
US8303806B2 (en) 2009-02-09 2012-11-06 Planar Solutions, Llc Fluid processing
US8974677B2 (en) 2009-02-09 2015-03-10 Planar Solutions, Llc Fluid processing
JP2011168478A (en) * 2010-02-17 2011-09-01 Woongjin Coway Co Ltd Hydrogen energy production system and method for producing hydrogen energy utilizing silicon wastewater
CN103894924A (en) * 2012-12-25 2014-07-02 株式会社迪思科 Negative pressure generation device
JP2014124701A (en) * 2012-12-25 2014-07-07 Disco Abrasive Syst Ltd Negative pressure generation device

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