JPS6282748U - - Google Patents
Info
- Publication number
- JPS6282748U JPS6282748U JP17523585U JP17523585U JPS6282748U JP S6282748 U JPS6282748 U JP S6282748U JP 17523585 U JP17523585 U JP 17523585U JP 17523585 U JP17523585 U JP 17523585U JP S6282748 U JPS6282748 U JP S6282748U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor
- inner lead
- island
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17523585U JPS6282748U (xx) | 1985-11-14 | 1985-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17523585U JPS6282748U (xx) | 1985-11-14 | 1985-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282748U true JPS6282748U (xx) | 1987-05-27 |
Family
ID=31114369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17523585U Pending JPS6282748U (xx) | 1985-11-14 | 1985-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282748U (xx) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315169A (ja) * | 1988-06-15 | 1989-12-20 | Hitachi Cable Ltd | 半導体装置用リードフレーム |
| JPH0575009A (ja) * | 1991-09-18 | 1993-03-26 | Oki Electric Ind Co Ltd | リードフレーム及びそれを用いた半導体装置とその製造方法 |
-
1985
- 1985-11-14 JP JP17523585U patent/JPS6282748U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315169A (ja) * | 1988-06-15 | 1989-12-20 | Hitachi Cable Ltd | 半導体装置用リードフレーム |
| JPH0575009A (ja) * | 1991-09-18 | 1993-03-26 | Oki Electric Ind Co Ltd | リードフレーム及びそれを用いた半導体装置とその製造方法 |