JPS6282735U - - Google Patents

Info

Publication number
JPS6282735U
JPS6282735U JP1985173762U JP17376285U JPS6282735U JP S6282735 U JPS6282735 U JP S6282735U JP 1985173762 U JP1985173762 U JP 1985173762U JP 17376285 U JP17376285 U JP 17376285U JP S6282735 U JPS6282735 U JP S6282735U
Authority
JP
Japan
Prior art keywords
tool
shaped chamfer
insertion hole
wire
radius
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985173762U
Other languages
Japanese (ja)
Other versions
JPH0219967Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985173762U priority Critical patent/JPH0219967Y2/ja
Publication of JPS6282735U publication Critical patent/JPS6282735U/ja
Application granted granted Critical
Publication of JPH0219967Y2 publication Critical patent/JPH0219967Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案になるワイヤボンダ用ツールの一実
施例を示す断面図である。 １：ツール、２：ワイヤ挿通用穴、３：Ｒ状の
面取り部。 The figure is a sectional view showing an embodiment of the wire bonder tool according to the present invention. 1: Tool, 2: Wire insertion hole, 3: R-shaped chamfer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤ挿通用穴の先端にＲ状の面取り部が形成
されたワイヤボンダ用ツールにおいて、前記Ｒ状
の面取り部の半径は、０．００５〜０．０５mmに
形成されていることを特徴とするワイヤボンダ用
ツール。 A wire bonder tool having an R-shaped chamfer formed at the tip of a wire insertion hole, wherein the radius of the R-shaped chamfer is 0.005 to 0.05 mm. tool.
JP1985173762U 1985-11-12 1985-11-12 Expired JPH0219967Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985173762U JPH0219967Y2 (en) 1985-11-12 1985-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985173762U JPH0219967Y2 (en) 1985-11-12 1985-11-12

Publications (2)

Publication Number Publication Date
JPS6282735U true JPS6282735U (en) 1987-05-27
JPH0219967Y2 JPH0219967Y2 (en) 1990-05-31

Family

ID=31111525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985173762U Expired JPH0219967Y2 (en) 1985-11-12 1985-11-12

Country Status (1)

Country Link
JP (1) JPH0219967Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313343U (en) * 1976-07-16 1978-02-03
JPS54160168A (en) * 1978-06-09 1979-12-18 Citizen Watch Co Ltd Pressure bonding capillary chip

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313343U (en) * 1976-07-16 1978-02-03
JPS54160168A (en) * 1978-06-09 1979-12-18 Citizen Watch Co Ltd Pressure bonding capillary chip

Also Published As

Publication number Publication date
JPH0219967Y2 (en) 1990-05-31

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