JPS6280376U - - Google Patents
Info
- Publication number
- JPS6280376U JPS6280376U JP17083985U JP17083985U JPS6280376U JP S6280376 U JPS6280376 U JP S6280376U JP 17083985 U JP17083985 U JP 17083985U JP 17083985 U JP17083985 U JP 17083985U JP S6280376 U JPS6280376 U JP S6280376U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- power supply
- board
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000005240 physical vapour deposition Methods 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17083985U JPS6280376U (forum.php) | 1985-11-08 | 1985-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17083985U JPS6280376U (forum.php) | 1985-11-08 | 1985-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6280376U true JPS6280376U (forum.php) | 1987-05-22 |
Family
ID=31105918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17083985U Pending JPS6280376U (forum.php) | 1985-11-08 | 1985-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6280376U (forum.php) |
-
1985
- 1985-11-08 JP JP17083985U patent/JPS6280376U/ja active Pending
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