JPS6280331U - - Google Patents
Info
- Publication number
- JPS6280331U JPS6280331U JP1985172875U JP17287585U JPS6280331U JP S6280331 U JPS6280331 U JP S6280331U JP 1985172875 U JP1985172875 U JP 1985172875U JP 17287585 U JP17287585 U JP 17287585U JP S6280331 U JPS6280331 U JP S6280331U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lead frame
- view
- showing
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985172875U JPS6280331U (enExample) | 1985-11-09 | 1985-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985172875U JPS6280331U (enExample) | 1985-11-09 | 1985-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6280331U true JPS6280331U (enExample) | 1987-05-22 |
Family
ID=31109812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985172875U Pending JPS6280331U (enExample) | 1985-11-09 | 1985-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6280331U (enExample) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57149740A (en) * | 1981-03-11 | 1982-09-16 | Toshiba Corp | Manufacture of resin sealing type semiconductor device |
| JPS59135735A (ja) * | 1983-01-24 | 1984-08-04 | Toshiba Corp | 半導体樹脂封止用金型 |
| JPS6257254A (ja) * | 1985-09-06 | 1987-03-12 | Hitachi Ltd | 半導体装置 |
-
1985
- 1985-11-09 JP JP1985172875U patent/JPS6280331U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57149740A (en) * | 1981-03-11 | 1982-09-16 | Toshiba Corp | Manufacture of resin sealing type semiconductor device |
| JPS59135735A (ja) * | 1983-01-24 | 1984-08-04 | Toshiba Corp | 半導体樹脂封止用金型 |
| JPS6257254A (ja) * | 1985-09-06 | 1987-03-12 | Hitachi Ltd | 半導体装置 |