JPS6280297A - Production of electrode - Google Patents
Production of electrodeInfo
- Publication number
- JPS6280297A JPS6280297A JP21937585A JP21937585A JPS6280297A JP S6280297 A JPS6280297 A JP S6280297A JP 21937585 A JP21937585 A JP 21937585A JP 21937585 A JP21937585 A JP 21937585A JP S6280297 A JPS6280297 A JP S6280297A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- core material
- plated
- plating
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrolytic Production Of Metals (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、主として電気Znめっき浴や電気Snめっき
浴等の不溶性陽極に使用する電極の製造方法に係る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention mainly relates to a method of manufacturing an electrode used for an insoluble anode such as an electrolytic Zn plating bath or an electrolytic Sn plating bath.
(従来の技術)
電気Znめっき浴や電気Sn浴等の不溶性陽極には、従
来無垢のpb電極、P b Oz電極、Ptコーティン
グのTi電極又はCu / T i電極等が用いられて
いた。(Prior Art) Conventionally, solid pb electrodes, PbOz electrodes, Pt-coated Ti electrodes, Cu/Ti electrodes, etc. have been used as insoluble anodes in electrolytic Zn plating baths, electric Sn baths, and the like.
(発明が解決しようとする問題点)
ところで、上記の無垢のPb電極は、厚みがあり、重い
ため作業性が悪く、また消耗すると電解面積が小さくな
り、電気的な品質面が劣下するという問題がある。(Problems to be Solved by the Invention) By the way, the above-mentioned solid Pb electrode is thick and heavy, which makes it difficult to work with, and when it wears out, the electrolytic area becomes smaller and the electrical quality deteriorates. There's a problem.
また、上記のpbo□電極は、製作上高価値なめっき設
備を必要とするという問題がある。Furthermore, the above-mentioned pbo□ electrode has a problem in that it requires expensive plating equipment for manufacturing.
さらにptココ−ィングのTi電極又はCu/Ti電極
は、ptココ−ィングの消耗の度毎にptをつけ足すか
、残余のptココ−ィングを全て剥離して、ptをリコ
ーティングしなければならないので、メンテナンス上甚
だ高価となるという問題がある。Furthermore, for Ti electrodes or Cu/Ti electrodes with PT co-coating, it is necessary to add PT each time the PT co-coing is worn out, or to peel off all remaining PT co-coing and recoat with PT. Therefore, there is a problem that maintenance becomes extremely expensive.
そこで本発明は、電解面積が減少せず、電気的な品質面
が向上し、製作上、メンテナンス上の作業が容易で且つ
安価な電極を得ることのできる製造方法を提供しようと
するものである。Therefore, the present invention aims to provide a manufacturing method that does not reduce the electrolytic area, improves electrical quality, facilitates manufacturing and maintenance work, and can obtain an inexpensive electrode. .
(問題点を解決するための手段)
上記問題点を解決するための本発明の電極の製造方法は
、Ti芯材又はTiを外側にクラッドした芯材を前処理
した後、0.1 μ以上の貴金属めっきを施し、次に1
μ以上の半田めっきを施し、次いでPb又はSn若しく
はPb−5nを溶融法でコーティングすることを特徴と
する。(Means for Solving the Problems) In order to solve the above problems, the method for manufacturing an electrode of the present invention is to pre-treat a Ti core material or a core material clad with Ti on the outside, and then Noble metal plating is applied, then 1
It is characterized by applying solder plating of μ or more, and then coating with Pb, Sn, or Pb-5n by a melting method.
(実施例)
本発明による電極の製造方法の一実施例を説明すると、
先ずCuの芯材の外側にTiをクラッドした素材を、表
面を粗面化するサンドブラスト等の物理的処理法と表面
を薬品にて粗面化する化学的処理法にて前処理した後、
電気めっき法でptを0.5μめっきし、次に電気めっ
き法で半田を50μめっきし、次いでPbを溶融法で1
5龍コーテイングして電極を得た。(Example) An example of the method for manufacturing an electrode according to the present invention will be described as follows.
First, a material in which Ti is clad on the outside of a Cu core material is pretreated using a physical treatment method such as sandblasting to roughen the surface and a chemical treatment method to roughen the surface with chemicals.
0.5μ of PT was plated by electroplating method, then 50μ of solder was plated by electroplating method, and then Pb was plated by 1μ by melting method.
Electrodes were obtained by coating 5 dragons.
次に他の実施例を説明すると、Tiのみを芯材とする素
材を、表面を薬品にて粗面化する化学的処理法のみにて
前処理した後、電気めっき法でptを10μめっきし、
次に熔融めっき法で半田を600μめっきし2次いでP
b−3μ5%を溶融法で30龍コーテイングして電極を
得た。Next, to explain another example, a material containing only Ti as a core material was pretreated using only a chemical treatment method to roughen the surface with chemicals, and then plated with 10 μm of PT using an electroplating method. ,
Next, 600 μm of solder was plated using the melt plating method, and then P
An electrode was obtained by coating 5% b-3μ by a melting method.
上記実施例で得られた電極の切断面を観察すると、各め
っき層、コーティング層の密着性が良く接着剤で引張り
強度を調べた処、200 k g / cn1以上あり
、接着剤が剥離する程である。Observing the cut surface of the electrode obtained in the above example, it was found that the adhesion of each plating layer and coating layer was good and when the tensile strength was examined using an adhesive, it was 200 kg/cn1 or more, which was so strong that the adhesive peeled off. It is.
これらの電極を電気Znめっき浴や電気Snめっき浴の
不溶性陽極として使用した処、表面のPbやpb−3μ
5%が消耗してもその下に半田、ptがある為、芯材の
腐食が防止され、またpbやPb−3μ5%が一部失っ
ても半田層を有するのでP、を層は腐食されることがな
い。従って電解面積は常に一定で、電気的な品質面は極
めて良好である。しかも安価なPbやpb−3μ5%は
消耗した際、つけ足せば良いし、下地のptは製作時一
度めっきしただけで良いので、メンテナンス上極めて有
利である。即ち、メンテナンス時、バーナとPb又はS
n若しくはPb−Snの棒材さえあれば、前処理やフラ
ックスを必要とせず、簡単、迅速にコーティングできて
、不純物の混入が無く、密着強度も高く、品質面でも良
好となる。When these electrodes were used as insoluble anodes in electrolytic Zn plating baths or electrolytic Sn plating baths, Pb and pb-3μ on the surface
Even if 5% is consumed, there is solder and PT underneath, so corrosion of the core material is prevented.Also, even if PB or Pb-3μ5% is partially lost, there is a solder layer, so the P layer will not be corroded. Never. Therefore, the electrolytic area is always constant and the electrical quality is extremely good. In addition, cheap Pb and PB-3μ5% can be added when they are used up, and the underlying PT only needs to be plated once during manufacture, which is extremely advantageous in terms of maintenance. That is, during maintenance, the burner and Pb or S
As long as there is a rod material of n or Pb-Sn, coating can be performed easily and quickly without the need for pretreatment or flux, there is no contamination of impurities, the adhesion strength is high, and the quality is also good.
尚、本発明の電極の製造方法において、素材にめっきす
る貴金属の厚さは0.1μ以上で、上限は規制していな
いが、実際は20μ程度が良く、それ以上めっきしても
高価となるばかりである。また半田めっきの厚さは1μ
以上で、上限を規制していないが、実際には最大限1鰭
あれば十分である。さらにpb又はSn若しくはPb−
Snのコーティング厚を規定していないが、実用上は数
11〜数10龍あれば十分である。In addition, in the electrode manufacturing method of the present invention, the thickness of the noble metal plated on the material is 0.1μ or more, and although there is no upper limit limit, in reality, about 20μ is good, and plating more than that will only become expensive. It is. Also, the thickness of the solder plating is 1μ
The above does not limit the upper limit, but in reality, a maximum of one fin is sufficient. Further pb or Sn or Pb-
Although the coating thickness of Sn is not specified, a thickness of several 11 to several tens is sufficient in practice.
上記実施例で素材にめっきする貴金属はptとなってい
るが、Au、、Ag、pct、 Rh、Irでも良い。In the above embodiments, the noble metal plated on the material is PT, but it may also be Au, Ag, PCT, Rh, or Ir.
(発明の効果)
以上の説明で判るように本発明の電極の製造方法によれ
ば、電解面積が常に一定で、電気的な品質面が極めて良
好で、製作上、メンテナンス上の作業が容易で且つ安価
な不溶性陽極に適した電極を得ることができるという優
れた効果がある。(Effects of the Invention) As can be seen from the above explanation, according to the electrode manufacturing method of the present invention, the electrolytic area is always constant, the electrical quality is extremely good, and the manufacturing and maintenance work is easy. Moreover, there is an excellent effect that an electrode suitable for an inexpensive insoluble anode can be obtained.
Claims (1)
た後、0.1μ以上の貴金属めっきを施し、次に1μ以
上の半田めっきを施し、次いでPb又はSn若しくはP
b−Snを溶融法でコーティングすることを特徴とする
電極の製造方法。After pre-treating the Ti core material or the core material clad with Ti on the outside, it is plated with a noble metal of 0.1μ or more, then solder plated with a thickness of 1μ or more, and then Pb, Sn or P.
A method for manufacturing an electrode, comprising coating b-Sn by a melting method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21937585A JPS6280297A (en) | 1985-10-02 | 1985-10-02 | Production of electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21937585A JPS6280297A (en) | 1985-10-02 | 1985-10-02 | Production of electrode |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6280297A true JPS6280297A (en) | 1987-04-13 |
JPH0475320B2 JPH0475320B2 (en) | 1992-11-30 |
Family
ID=16734430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21937585A Granted JPS6280297A (en) | 1985-10-02 | 1985-10-02 | Production of electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6280297A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117646270A (en) * | 2024-01-29 | 2024-03-05 | 宝鸡钛普锐斯钛阳极科技有限公司 | Titanium anode suitable for organic additive application system and manufacturing method thereof |
-
1985
- 1985-10-02 JP JP21937585A patent/JPS6280297A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117646270A (en) * | 2024-01-29 | 2024-03-05 | 宝鸡钛普锐斯钛阳极科技有限公司 | Titanium anode suitable for organic additive application system and manufacturing method thereof |
CN117646270B (en) * | 2024-01-29 | 2024-04-12 | 宝鸡钛普锐斯钛阳极科技有限公司 | Titanium anode suitable for organic additive application system and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH0475320B2 (en) | 1992-11-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100407732B1 (en) | Composite foil containing nodular copper / nickel alloy coating, printed circuit board containing it and method of electrodeposition of nodular copper / nickel alloy coating | |
US3654099A (en) | Cathodic activation of stainless steel | |
US5096522A (en) | Process for producing copper-clad laminate | |
JPH0447038B2 (en) | ||
WO2010093009A1 (en) | Metal foil, method for producing same, insulating substrate, and wiring board | |
JPH0329879B2 (en) | ||
JPH08250865A (en) | Method for improving further reliability of electronic housing by preventing formation of metallic whisker on sheetutilized for manufacture of the electronic housing | |
DE2631904B2 (en) | Process for producing a multilayer metal strip and multilayer metal strip produced according to this process | |
JP2020523486A (en) | Refractory metal or stainless steel having an electroplated layer on the surface, and electroplating process of refractory metal or stainless steel surface | |
US8158269B2 (en) | Composite material for electrical/electronic part and electrical/electronic part using the same | |
JPS63310990A (en) | Electrolytic copper foil and production thereof | |
JPH0819544B2 (en) | Lead steel wire for electronic parts and manufacturing method thereof | |
JPS6280297A (en) | Production of electrode | |
JPS6318677B2 (en) | ||
JPH0368795A (en) | Production of copper foil for printed circuit | |
JPS6340866B2 (en) | ||
JPS5921392B2 (en) | Manufacturing method of copper foil for printed circuits | |
JPS6389698A (en) | Treatment of copper foil | |
JPS58210194A (en) | Production of surface treated steel plate | |
JP4136496B2 (en) | Method for producing electrolytic copper foil | |
JP3213857B2 (en) | Manufacturing method of precious metal plating | |
JPS6340864B2 (en) | ||
US3075894A (en) | Method of electroplating on aluminum surfaces | |
JP4014739B2 (en) | Reflow Sn plating material and terminal, connector, or lead member using the reflow Sn plating material | |
WO1993020264A1 (en) | Method of producing lamellar material or lamellar parts for plain bearings |