JPS6280012A - Molding device - Google Patents

Abstract

PURPOSE:To contrive to complete the automation of molding process, making the attachment of a transferring mechanism to be easy by assembling the molding device with a movable platen into the molding device with the movable platen supported by three struts. CONSTITUTION:When synthetic resin is effectively cooled, a mold-opening and closing cylinder 8 is operated by the controlling part 7 for opening and closing molds, whereby a top force 9 and a bottom force 13 are opened. An alignment jig 27a is transferred onto the bottom force 13 by the rotation of a motor 28a. When the lead frame 25 package-molded by this alignment jig 27a is taken out of the vacuum attracted bottom force 13, it is transferred to a specified position. Here, because a movable platen 12 and upper and lower platens 3, 4 are supported by three struts 2, the struts do not become obstacles when a transferring mechanism 21 is attached, and a sufficient space may be provided for the transferring mechanism 21. Accordingly, the transferring mechanism 21 is not complicated, and then the attachment and the detachment of a molded article (lead frame 25) to and from the bottom force 13 become easy, whereby the automation for molding process may be promoted.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technique that is effective when applied to a molding apparatus, particularly a molding apparatus that molds a resin package for a semiconductor device.

[Background Art] In a molding process, for example, a transfer molding process for resin-sealed semiconductor devices, an alignment jig on which multiple lead frames are mounted is manually placed on a mold, and the process is continued manually even after molding. A so-called bunch process is performed.

In this way, automation in the molding process is lagging behind.
The mold of a molding device is usually surrounded by four or more pillars, and a conveyance mechanism is installed to place the molded object, such as the lead frame mentioned above, on or take it out from the mold. The inventor revealed that this is because there is no space available for this purpose.

An example of a detailed description of the technology of pancaging equipment, which is one type of molding equipment, is given in "Electronic Materials November 1981 Special Edition, Super LSI Manufacturing," published by Kogyo Research Association Co., Ltd., November 10, 1981.・Test equipment guidebook J
, P170 to P175.

[Object of the Invention] An object of the present invention is to provide a molding device that can automate the molding process.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

That is, by changing a molding device that normally has a movable platen to which a mold is attached and supported by four or more columns to a molding device that has a movable platen supported by three columns, This makes it easy to install a conveyance mechanism for the molded product, making it possible to automate the molding process.

[Example] Fig. 1 is a front view showing a transfer molding apparatus according to an embodiment of the present invention, and Fig. 2 is a sectional view taken along the line n-■ in Fig. 1 showing the relationship between the transfer molding apparatus and the conveyance mechanism. It is.

In this embodiment, the transfer molding apparatus 1 includes a pair of platens 3.4 that are vertically opposed to each other by three support columns 2 that are arranged at approximately equal intervals when viewed from the top. 3 is provided with a cylinder 6 whose reciprocating motion is controlled by a control section 5, and the lower platen 4 is provided with a mold opening/closing cylinder 8 whose reciprocating motion is controlled by a mold opening/closing control section 7. An upper mold 9 is fixedly suspended from the upper platen 3 via a support 10, and the upper mold 9 has a plunger 1 of a cylinder 6 in its pot (not shown).
1 is inserted.

Further, a movable platen 12 is horizontally installed between the columns 2 so as to be movable up and down, and a lower mold 13 is mounted on the movable platen 12.
is supported via a support 14.

A plurality of cavities 15 are formed on the mating surfaces of the upper mold 9 and the lower mold 13.
runners 16 are formed on the mating surfaces of the lower die 13, respectively.

On the other hand, it is possible to install a transport mechanism for a lead frame, which is a molded object, in the vicinity of the transfer molding apparatus 1, and the following transport mechanism can be considered, for example.

That is, in this embodiment, as shown in FIG. 2, a pair of transport mechanisms 21 and 21a are provided to sandwich the movable platen 12, and each of the transport mechanisms 21 and 21a accommodates feed screws 22 and 228. Guide 23, 23
an alignment jig 2 which is supported by a guide 23° 23a via an arm 24.24a and has a nozzle 26.26a for vacuum suctioning a lead frame 25 which is a molded object;
7.27a, and this alignment jig 27°27a
is a motor 28 coupled to one end of the feed screw 22, 228;
, 28a, it can be moved in the horizontal direction.

The operation of this embodiment will be explained below.

First, the lead frame 25, which is an object to be sealed, is placed in the alignment jig 2.
7, a predetermined number of the molds are vacuum suctioned and transferred onto the lower mold 13 of the movable platen 12.

Next, when the vacuum suction of the alignment jig 27 is stopped and each lead frame 25 is placed on a predetermined position a2 of the lower mold 13, the alignment jig 27 is separated from the lower mold 13.

Next, the mold opening/closing cylinder 8 is operated under the control of the mold opening/closing control section 7, and when the upper mold 9 and the lower mold 13 are brought together, the cylinder 6 is operated under the control of the control section 5 and the plunger 1
1 is press-fitted into a pot (not shown), whereby a synthetic resin as a molding material is forced in a molten state through the runner 16 and injected into each of the cavities 15.

When the injection of the synthetic resin is completed, the mold opening/closing cylinder 8 is operated under the control of the mold opening/closing control section 7, and the mold clamping force in the upper and lower molds 9.1.3 is increased.

Next, when the synthetic resin is cooled, the mold opening/closing cylinder 8 is operated by the mold opening/closing control unit 7 to open the upper and lower molds 9°13, and the alignment jig 27a is moved to the lower mold 13 by the rotation of the motor 28a.
It's moving up. The lead frame 25 molded into a puff cage is vacuum-adsorbed by the alignment jig 27a and the lower mold 1
3 and then transported to a predetermined position.

In this way, according to this embodiment, the movable platen 12 and the upper and lower platens 3 and 4 are supported by the three pillars 2, so that the transport mechanism 21 can be easily transported without the pillars 2 getting in the way. Sufficient space for the mechanism 21 can be taken.

Therefore, the molded object (lead frame 25) can be easily attached to and removed from the lower mold 13 without complicating the transport mechanism 21, and automation of the molding process can be promoted.

[Effect (1): By using a molding device with a structure in which a movable platen with a mold attached is supported by three pillars, it is easy to install a conveyance mechanism for the molded object, and the molding process can be automated. can be promoted.

+21. By providing a molding device with a structure in which three pillars are attached to positions equidistant from each other, automation of the molding process can be facilitated without reducing the strength of the device.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the conveyance mechanism is not necessarily limited to the structure described in the embodiment, and the alignment jig may be one that holds the molded object by means other than vacuum suction.

[Field of Application] In the above explanation, the invention made by the present inventor was mainly applied to the field of application which is the background thereof, which is a so-called pancage molding apparatus for semiconductor devices, but the present invention is not limited to this. Of course, it is an effective technology that can promote automation even when used in other molding equipment, such as lead frame cutting and molding equipment.

[Brief explanation of drawings]

Fig. 1 is a front view showing a transfer molding device 1 which is an embodiment of the present invention, and Fig. 2 is a sectional view taken along the line ■-■ in Fig. 1 showing the relationship between the transfer molding device and the transport m structure. . 1... Transfer molding device, 2... Support column, 3...
- Upper platen, 4... Lower butylan, 5... Control section, 6... Cylinder, 7... Mold opening/closing control section, 8...
・Mold opening/closing cylinder, 9... Upper mold, 10... Support, 11... Plunger, 1
2... Movable platen, 13... Lower mold, 14... Support, 15... Cavity, 16... Runner, 2
1.21a...Transport mechanism, 22.22a...Feed screw, 23.23a...Guide, 24.24a...Arm, 25...Lead frame, 26.26a...
Vacuum suction nozzle, 27.27a... alignment jig, 28
゜28a...Motor. Figure 1 Figure 2

Claims (1)

[Scope of Claims] 1. A molding device that performs molding using a mold attached to a platen fixed to a support and a mold attached to a movable platen movable between the supports, wherein the movable platen has three movable platens. A molding device characterized in that it is supported by a pillar. 2. The molding apparatus according to claim 1, wherein two or three pillars are mounted at equal intervals from each other. 3. The molding apparatus according to claim 1, wherein the molding machine is a transfer molding machine for resin-sealed semiconductor devices.