JPS6279695A - Printed substrate polishing device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (Industrial Application Field) Does the present invention cover printed circuit boards? The present invention relates to a printed circuit board polishing apparatus that polishes the printed circuit board while conveying MQ.

(Prior Art) The above-mentioned polishing method for removing dirt such as an oxide film on the surface of a printed circuit board and polishing the surface is already known. The printed circuit board is polished on one side while being transported for a long time between the polishing brush roll and the bank unroll disposed on the lid facing it, and the printed circuit board is polished on one side while being conveyed between the polishing brush roll and the bank unroll disposed on the lid facing the polishing brush roll. Both sides are polished while being conveyed between a set of polishing brush rolls arranged in parallel.

Pinch rolls are provided at the inlet and outlet (111j) of the polishing plan roll, and the printed circuit board is conveyed between the polishing brush roll and the backup roll, and between the sets of polishing brush rolls.

In order to properly polish the surface of a printed circuit board, the circumferential gap between the polishing brush roll and the backup roll, and the circumferential gap between a set of 6j-ωl polishing brush rolls must be adjusted to the thickness of the printed circuit board. must be 1, with a predetermined value corresponding to .

Regarding this point, in conventional polishing equipment, the distance between the axes of the rolls mentioned above is fixed at a constant value, and the gap between the circumferential surfaces of the rolls cannot be adjusted.
Also, adjustment was made by manually moving the polishing brush roll or the pick-up roll independently of the pinch roll, changing the distance between the roll axes, and locking the roll at that position.

(Problems to be Solved by the Invention) Among the above-mentioned conventional machines, those using a fixed distance between roll axes can only process printed circuit boards of a certain thickness. This is because if a printed circuit board that is too thick is attempted to be processed, it may not be possible to pass the board or the board may warp, and a printed circuit board that is too thin may not be polished sufficiently.

On the other hand, it is possible to perform proper polishing with a manual variable distance between the roll axes, but it is possible to perform appropriate polishing for printed circuit boards of different thicknesses.
This involves the complicated work of having to make adjustments.Furthermore, in actual work, it would be necessary to produce a large number of printed circuit boards of the same thickness in lots.

In addition, the surface of the polishing brush roll becomes corroded after long-term use, so even if printed circuit boards of the same thickness are processed continuously, the polishing brush roll must be polished for 1 m to compensate for the amount of wear. Unless the brush roll is frequently adjusted to bring it closer to the printed circuit board, uniform polishing cannot be expected. However, in the conventional polishing method described above, it is impossible to adjust the number of layers according to the amount of wear of the brush roll, and furthermore, complicated manual work is required.

Therefore, one aspect of the present invention is to perform a complicated manual one-step process, regardless of the thickness of the printed board being conveyed or the degree of wear on the surface of the polishing brush roll. The purpose is to be able to always coat the printed circuit board uniformly without causing any damage.

(Means for Solving the Problems) A printed circuit board polishing apparatus according to the present invention is provided with first and second brush rolls, which are disposed at positions facing each other across a printed circuit board conveyance path, and at least one of which constitutes a polishing storage brush roll. a second working roll, arranged at the inlet side 1 and the outlet 1IIl of the first and second working rolls, respectively;
An inlet side pinch, each consisting of a pair of rolls arranged in parallel to face each other on the first working swirl side and the second working roll side, sandwiching the Pl'2 feed path of the printed circuit board. roll, an exit side pinch roll, and a fluid pressure cylinder device for pressing the working roll constituting the polishing brush roll among the first and second working rolls against the printed circuit board with a predetermined constant pressure. It will be again.

Of the first and second working rolls, one may be configured as an abrasive brush roll and the other may be configured as a puncture roll, or both the first and second working rolls may each be configured as an abrasive brush roll. The roll may be constructed to have a length of 512''.

(Function) In the uninvented printed circuit board polishing apparatus, the polishing brush roll is located at a position away from the conveyance path of the printed circuit board in the standby state, but when the front end of the printed circuit board approaches, the polishing brush roll The roll is brought close to the conveyance path, and during polishing, the ω-th brush roll is pressed against the printed circuit board with a predetermined constant pressure by a fluid pressure cylinder. The predetermined constant pressure refers to the pressure with which the polishing brush roll should be pressed against the printed circuit board in order to perform good polishing. It will be done.

If the thickness of each printed circuit board to be polished differs depending on the board, or if the polishing brush roll progresses in wear, the axial position of the polishing brush roll during polishing will naturally change. However, since the polishing brush roll is still pressed by the fluid pressure cylinder device against the printed circuit board during polishing with a predetermined constant pressure, the printed circuit board is always polished uniformly.

(Actual KaiHii;'i+) Figures 1 to 4 show the process of polishing a printed circuit board using an embodiment of the uninvented printed circuit board polishing apparatus.

The polishing device includes first and second working rolls 1 and 2, at least one of which constitutes a polishing brush roll, inlet side pinch rolls 3 and 4, and outlet side pinch rolls 5 and 6.
and a fluid pressure cylinder device 7. In this embodiment, the first working roll 1 constitutes an abrasive brush roll, and the second working roll 2 constitutes a bank-up roll.

The polishing brush roll 1 is disposed at a position facing the backup roll 2 across the conveyance path 9 of the printed circuit board 8. The entrance side pinch rolls 3 and 4 consist of a polishing brush roll side roll 3 and a backup roll side roll 4 which are arranged in parallel so as to sandwich the conveyance path 9 of the printed circuit board 8 and face each other. 5 and 6 also consist of a roll 5 on the abrasive brush roll side and a roll 6 on the backup roll side, which are arranged in parallel.

The polishing brush roll 1 is attached to a rod 7α of a hydraulic cylinder device 7 via a bracket 10 that rotatably supports both ends of the roll 1. Therefore, by expanding and contracting the rod 7α of the fluid pressure cylinder device 7, the polishing brush roll 1 can be moved toward and away from the conveyance path 9 of the printed circuit board 8. - o-A/4, the relative axial position of each roll 4, 2 and 6 is determined such that the upper common tangent of the backup roll 2 and roll 6 is parallel to the feeding path 9 of the printed circuit board 8; ing. Further, the rolls 3 and 5 are urged by means such as a fluid pressure cylinder device (not shown) or a spring (not shown) so as to abut against the rolls 4 and 6, respectively.

Reference numerals 11 and 12 indicate sensors, which detect the passage of the front end and rear end of the printed circuit board 8, respectively.
Instructs the operation of the fluid pressure cylinder device 7.

The first abrasive mounting (shown in ¥1) is in a standby state, the hydraulic cylinder device 70 rod 7α is shortened, and the abrasive brush roll 1 is in the upper position.

The printed circuit board 8 is conveyed from the left side of the figure, and when the sensor 11 detects that the front end of the circuit board 8 has passed, the fluid pressure cylinder device e7 is extended, and the polishing brush roll 1 is extended. At this time, as in the illustrated embodiment, the circumferential gap between the polishing brush roll 1 and the backup roll 2 is slightly narrower than the thickness of the flint substrate 8. However, if the substrate 8 is thin, the polishing brush roll 1 may be stopped at this position.
It is necessary to contact the backup roll 2.

The front end of the printed circuit board 8 that has passed the sensor 11 pushes up the roll 3 and enters between the rolls 3 and 4 (FIG. 2).

Subsequently, as shown in FIG. 3, the printed circuit board 8 moves toward the right in the figure by pushing up the polishing brush roll 1 and the roll 5, and its upper surface is polished. During this polishing operation, the printed circuit board 8 is pressed against the polishing brush roll 1 under a predetermined constant pressure by the action of the fluid pressure cylinder device 7. The pressing force of this fluid pressure cylinder W7 is maintained constant regardless of the thickness of the printed circuit board 8 and regardless of the degree of wear of the polishing brush roll l, so that the printed circuit board is always polished uniformly. Ru.

When the rear end of the flint board 8 separates from the polishing brush roll 1'', the polishing brush roll 1 is at the same position as the stop position shown in FIG.
When the sensor 12 detects the passage of the rear end, the rod 7a of the body pressure cylinder device +7t7 is shortened in response, and the sharpening brush roll 1 returns to the standby state shown in FIG.
Get ready for the next printed circuit board polishing.

Even if the next substrate to be transferred and processed has a different thickness from the previous substrate, or even if the polishing brush roll is worn out, the above process is repeated to ensure uniformity. It will be easily understood that some polishing must be carried out.

As an alternative embodiment to the embodiment shown in FIG. 1, the rolls 3 and 5 are positioned above the rolls 4 and 6, respectively, in the standby state, and are lowered with the arrival of the printed circuit board so that the rolls 3 and 5 The printed circuit board may be held between the roll 6 and the roll 6.

Various examples of the present invention can be mentioned below.

For example, to polish the bottom surface of a printed circuit board,
The illustrated configuration may be turned upside down.

In addition, both the upper and lower surfaces of the printed circuit board can be hung simultaneously on the lifting platform (tl), and both the upper and lower working rolls may be polishing brush rolls.
is provided for each polishing brush roll, and the combination of each hydraulic cylinder device and polishing brush roll operates substantially symmetrically with respect to each other.

(Effects of the Invention) According to the printed circuit board polishing apparatus of the present invention, troublesome manual adjustment work can be avoided regardless of the thickness of the printed circuit board being conveyed or regardless of the degree of wear on the surface of the polishing brush roll. Be able to consistently and evenly polish printed circuit boards without having to polish them.

[Brief explanation of drawings]

FIGS. 1 to 4 are diagrams illustrating an embodiment of the present invention.
' These are schematic side views showing the state in which the IJN substrate is being polished. Figure 1 shows the standby state, Figure 2 shows the state just before the start of polishing, Figure 3 shows the polishing process in progress, and Figure 4 shows the polishing state. Indicates the status at the end. 1... First action roll (polishing brush roll) 2...
・Second action roll (backup roll) 3.4・
...Inlet side pinch roll 5.6...Outlet side 1 pinch roll 7...Fluid pressure cylinder device 8...Printed circuit board 9...Transport path 10...Bracket 11. 12... Sensor facing permission % people
Hakuto Co., Ltd. Company Patent Developer Shirokane Kogyo Co., Ltd. (5 people) Figure 1 Figure 2 Figure 3 Figure 4

Claims (3)

[Claims] (1) In a printed circuit board polishing device that polishes a printed circuit board while conveying the circuit board, the devices are arranged at positions facing each other across the conveyance path of the printed circuit board,
The first and second working rolls, at least one of which constitutes a polishing brush roll, are arranged on the inlet side and the exit side of the first and second working rolls, respectively, and the an inlet side pinch roll and an outlet side pinch roll each consisting of a pair of rolls arranged in parallel to face each other on the side of the first working roll and the side of the second working roll; A printed circuit board polishing apparatus comprising a fluid pressure cylinder device for pressing a working roll constituting a polishing brush roll out of two working rolls against a printed circuit board with a predetermined constant pressure. (2) The printed circuit board polishing apparatus according to claim 1, wherein one of the first and second working rolls constitutes a polishing brush roll and the other constitutes a backup roll. . (3) The printed circuit board polishing apparatus according to claim 1, wherein both the first and second working rolls each constitute a polishing brush roll.