JPS6278751U - - Google Patents

Info

Publication number
JPS6278751U
JPS6278751U JP17052585U JP17052585U JPS6278751U JP S6278751 U JPS6278751 U JP S6278751U JP 17052585 U JP17052585 U JP 17052585U JP 17052585 U JP17052585 U JP 17052585U JP S6278751 U JPS6278751 U JP S6278751U
Authority
JP
Japan
Prior art keywords
wire bonding
insulating plate
bonding part
circuit board
back side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17052585U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17052585U priority Critical patent/JPS6278751U/ja
Publication of JPS6278751U publication Critical patent/JPS6278751U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP17052585U 1985-11-06 1985-11-06 Pending JPS6278751U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17052585U JPS6278751U (cg-RX-API-DMAC10.html) 1985-11-06 1985-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17052585U JPS6278751U (cg-RX-API-DMAC10.html) 1985-11-06 1985-11-06

Publications (1)

Publication Number Publication Date
JPS6278751U true JPS6278751U (cg-RX-API-DMAC10.html) 1987-05-20

Family

ID=31105334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17052585U Pending JPS6278751U (cg-RX-API-DMAC10.html) 1985-11-06 1985-11-06

Country Status (1)

Country Link
JP (1) JPS6278751U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04277636A (ja) * 1991-03-05 1992-10-02 Shinko Electric Ind Co Ltd 半導体装置とその製造方法及びこれに用いる接合体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192042A (en) * 1981-05-21 1982-11-26 Stanley Electric Co Ltd Fixing method for semiconductor element
JPS58161352A (ja) * 1982-03-19 1983-09-24 Yamagata Nippon Denki Kk 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192042A (en) * 1981-05-21 1982-11-26 Stanley Electric Co Ltd Fixing method for semiconductor element
JPS58161352A (ja) * 1982-03-19 1983-09-24 Yamagata Nippon Denki Kk 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04277636A (ja) * 1991-03-05 1992-10-02 Shinko Electric Ind Co Ltd 半導体装置とその製造方法及びこれに用いる接合体

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