JPS6276755A - Manufacture of circuit device - Google Patents

Abstract

PURPOSE:To enhance the accuracy and to improve the yield of a circuit device by trimming after packaging, thereby reducing the displacement of regulated value after trimming step. CONSTITUTION:After a circuit element 1 is packaged at 4, the resistor R1 or R2 of an OP amplifier is trimmed by a laser light to regulate on offset voltage. According to this sequence, the displacement of the regulated value is less. Thus, the accuracy can be enhanced and the yield can be improved in this device.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to integrated circuit circuit devices (for example, semiconductor devices,
The present invention relates to a method of manufacturing a resistor module (resistance module, etc.).

[Conventional technology]

Some methods of manufacturing circuit devices include a trimming step of cutting connection lines of the circuit device using laser light and adjusting the parameter f peak. This trimming step is, for example, a step of selectively cutting connection lines of a resistance module formed on a wafer with a laser beam to adjust the resistance value.

Conventionally, there has been a method of manufacturing a circuit device that includes a trimming process, for example, as shown in FIG. 7, in which trimming is performed on a wafer. In this method, a wafer B placed on a trimmer stage S is irradiated with laser light.

Furthermore, as shown in FIG. 8, there is a device that irradiates laser light after assembly.

[Problem that the invention seeks to solve]

However, in the method shown in Fig. 7, deviations occur in the adjustment values in the processes after the trimming process, that is, in the assembly and packaging processes, and in the method shown in Fig. 8, in the packaging process, which is the process after trimming. The adjustment value is off. For this reason, there have been problems in that the accuracy of the device is deteriorated and the yield is reduced.

The present invention has been made in order to eliminate the above-mentioned problems, and it is possible to manufacture a circuit device that has less deviation in adjustment values after the trimming process, can increase the temperature of the circuit device, and can improve water retention. The purpose is to realize the method.

[Means for solving problems]

The present invention relates to a method of manufacturing a circuit device that includes a trimming step of adjusting parameter values of a circuit device of an integrated circuit using laser light, wherein the trimming step is performed after packaging. be.

〔Example〕

The present invention will be explained below using the drawings.

FIG. 1 is a flowchart showing an embodiment of a method for manufacturing a circuit device according to the present invention.

In the figure, a desired circuit is formed on a wafer. The seventh step is to trim after this sea urchin fly process.
This is the manufacturing method shown in the figure.

Next, cuts are made in the wafer in a dicing process.

Then, in the wafer breaking process, the wafer is broken along the cut edges.

In the next die bonding step, the chips, which are split from the wafer, are bonded to the header. The completed state of the circuit device at this stage is shown in FIG. In FIG. 2, l is a chip and 2 is a header.

Furthermore, the wire bonding process performs wiring between the chip and the header. At this stage, the circuit arrangement is as shown in FIG. The manufacturing method shown in FIG. 8 is where trimming is performed after the wire bonding process.

Then, in the packaging process, a package is placed over the chip and a herme check seal is applied.

The state of the circuit device at this stage is shown in FIG. In the figure, 3
is a glass window through which laser light can pass, and is provided at a position facing the chip 1 of the package 4.

In the next trimming step, the chip 1 is irradiated with laser light through the glass window 3, as shown in FIG.

For example, in the trimming process for adjusting the offset voltage of an OP amplifier shown in FIG. 6 as a circuit device, if the offset voltage is positive, the connection line of resistor R1 is cut with a laser beam; Cut the R2 connection wire with a laser beam to increase the resistance value. In FIG. 6, IN+ is a non-inverting input, IN- is an inverting input, OUT is an output, and Vc is a constant voltage.

After that, a shipping inspection is performed and the process ends.

In addition, in the embodiment, the case where the circuit device is an OP amplifier has been described, but the circuit device may be other than this, such as a resistor module, a semiconductor device, etc.

Further, since the characteristics of circuit devices such as a resistance module, a temperature sensor, and a pressure sensor are likely to change depending on incident light, it is necessary to cover the glass window 1 after trimming.

〔effect〕

According to the method according to the present invention, since trimming is performed using a laser beam at the final stage, that is, after the circuit element is packaged, there is little deviation in adjustment values. This makes it possible to improve the precision of the circuit device and improve yield.

[Brief explanation of drawings]

FIG. 1 is a flowchart showing an embodiment of the method for manufacturing a circuit device according to the present invention, FIGS. 2 to 6 are explanatory diagrams of the flowchart in FIG. 1, and FIGS. 1 is a diagram showing a conventional example of a manufacturing method. 1...Glass window, 2...Package. Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] A method for manufacturing a circuit device including a trimming step of adjusting parameter values of a circuit device of an integrated circuit using a laser beam, characterized in that the trimming step is performed after packaging. Method.