JPS6272047U - - Google Patents
Info
- Publication number
- JPS6272047U JPS6272047U JP1985162495U JP16249585U JPS6272047U JP S6272047 U JPS6272047 U JP S6272047U JP 1985162495 U JP1985162495 U JP 1985162495U JP 16249585 U JP16249585 U JP 16249585U JP S6272047 U JPS6272047 U JP S6272047U
- Authority
- JP
- Japan
- Prior art keywords
- carrier plate
- workpiece
- double
- head surface
- surface grinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000006061 abrasive grain Substances 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985162495U JPH0226608Y2 (ro) | 1985-10-23 | 1985-10-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985162495U JPH0226608Y2 (ro) | 1985-10-23 | 1985-10-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6272047U true JPS6272047U (ro) | 1987-05-08 |
JPH0226608Y2 JPH0226608Y2 (ro) | 1990-07-19 |
Family
ID=31089808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985162495U Expired JPH0226608Y2 (ro) | 1985-10-23 | 1985-10-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0226608Y2 (ro) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010283371A (ja) * | 2001-08-30 | 2010-12-16 | Siltronic Ag | 半導体ウェーハの製造方法および半導体ウェーハ |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49137188U (ro) * | 1973-03-08 | 1974-11-26 | ||
JPS60103654U (ja) * | 1983-12-21 | 1985-07-15 | 光洋機械工業株式会社 | 両頭平面研削盤におけるといし車の形直し・目立て装置 |
-
1985
- 1985-10-23 JP JP1985162495U patent/JPH0226608Y2/ja not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49137188U (ro) * | 1973-03-08 | 1974-11-26 | ||
JPS60103654U (ja) * | 1983-12-21 | 1985-07-15 | 光洋機械工業株式会社 | 両頭平面研削盤におけるといし車の形直し・目立て装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010283371A (ja) * | 2001-08-30 | 2010-12-16 | Siltronic Ag | 半導体ウェーハの製造方法および半導体ウェーハ |
Also Published As
Publication number | Publication date |
---|---|
JPH0226608Y2 (ro) | 1990-07-19 |
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