JPS6272047U - - Google Patents
Info
- Publication number
- JPS6272047U JPS6272047U JP1985162495U JP16249585U JPS6272047U JP S6272047 U JPS6272047 U JP S6272047U JP 1985162495 U JP1985162495 U JP 1985162495U JP 16249585 U JP16249585 U JP 16249585U JP S6272047 U JPS6272047 U JP S6272047U
- Authority
- JP
- Japan
- Prior art keywords
- carrier plate
- workpiece
- double
- head surface
- surface grinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000006061 abrasive grain Substances 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
第1図はこの考案の一実施例を示す図面、第2
図はこの考案に用いられるキヤリヤプレートの平
面図、第3図は第2図のA―A線に於ける拡大断
面図、第4図は従来例を示す図面である。
1…フレーム、2,3…クイル、8,9…回転
主軸、12,13…砥石、14…キヤリヤプレー
ト、17,18…ドレツサー砥石。
Figure 1 is a drawing showing an embodiment of this invention;
The figure is a plan view of a carrier plate used in this invention, FIG. 3 is an enlarged sectional view taken along the line AA in FIG. 2, and FIG. 4 is a drawing showing a conventional example. DESCRIPTION OF SYMBOLS 1... Frame, 2, 3... Quill, 8, 9... Rotating main shaft, 12, 13... Grindstone, 14... Carrier plate, 17, 18... Dresser grindstone.
Claims (1)
この両砥石間にキヤリヤプレートによりワークを
搬入して該ワークの両面を同時に上記両砥石で研
削加工する両頭平面研削盤に於いて、上記キヤリ
ヤプレートの上下面外周縁に所定の幅寸法でダイ
ヤモンド砥粒等を電着させて当該部分にドレツサ
ー砥石を形成したことを特徴とする両頭平面研削
盤。 Arrange the grindstones with their grinding surfaces facing each other,
In a double-head surface grinder that carries a workpiece between the two grinding wheels using a carrier plate and simultaneously grinds both sides of the workpiece with the two grinding wheels, a predetermined width dimension is formed on the outer periphery of the upper and lower surfaces of the carrier plate. A double-head surface grinder characterized in that a dresser grindstone is formed on the part by electrodepositing diamond abrasive grains or the like.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985162495U JPH0226608Y2 (en) | 1985-10-23 | 1985-10-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985162495U JPH0226608Y2 (en) | 1985-10-23 | 1985-10-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6272047U true JPS6272047U (en) | 1987-05-08 |
JPH0226608Y2 JPH0226608Y2 (en) | 1990-07-19 |
Family
ID=31089808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985162495U Expired JPH0226608Y2 (en) | 1985-10-23 | 1985-10-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0226608Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010283371A (en) * | 2001-08-30 | 2010-12-16 | Siltronic Ag | Method for producing semiconductor wafer, and semiconductor wafer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49137188U (en) * | 1973-03-08 | 1974-11-26 | ||
JPS60103654U (en) * | 1983-12-21 | 1985-07-15 | 光洋機械工業株式会社 | Shaping and sharpening device for grinding wheel in double-head surface grinder |
-
1985
- 1985-10-23 JP JP1985162495U patent/JPH0226608Y2/ja not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49137188U (en) * | 1973-03-08 | 1974-11-26 | ||
JPS60103654U (en) * | 1983-12-21 | 1985-07-15 | 光洋機械工業株式会社 | Shaping and sharpening device for grinding wheel in double-head surface grinder |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010283371A (en) * | 2001-08-30 | 2010-12-16 | Siltronic Ag | Method for producing semiconductor wafer, and semiconductor wafer |
Also Published As
Publication number | Publication date |
---|---|
JPH0226608Y2 (en) | 1990-07-19 |
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