JPS6268240U - - Google Patents
Info
- Publication number
- JPS6268240U JPS6268240U JP15937585U JP15937585U JPS6268240U JP S6268240 U JPS6268240 U JP S6268240U JP 15937585 U JP15937585 U JP 15937585U JP 15937585 U JP15937585 U JP 15937585U JP S6268240 U JPS6268240 U JP S6268240U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- lead frame
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15937585U JPS6268240U (fr) | 1985-10-17 | 1985-10-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15937585U JPS6268240U (fr) | 1985-10-17 | 1985-10-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6268240U true JPS6268240U (fr) | 1987-04-28 |
Family
ID=31083746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15937585U Pending JPS6268240U (fr) | 1985-10-17 | 1985-10-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6268240U (fr) |
-
1985
- 1985-10-17 JP JP15937585U patent/JPS6268240U/ja active Pending