JPH02106834U - - Google Patents
Info
- Publication number
- JPH02106834U JPH02106834U JP1989016178U JP1617889U JPH02106834U JP H02106834 U JPH02106834 U JP H02106834U JP 1989016178 U JP1989016178 U JP 1989016178U JP 1617889 U JP1617889 U JP 1617889U JP H02106834 U JPH02106834 U JP H02106834U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- temporary base
- weak adhesion
- mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989016178U JPH02106834U (fr) | 1989-02-14 | 1989-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989016178U JPH02106834U (fr) | 1989-02-14 | 1989-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106834U true JPH02106834U (fr) | 1990-08-24 |
Family
ID=31228877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989016178U Pending JPH02106834U (fr) | 1989-02-14 | 1989-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106834U (fr) |
-
1989
- 1989-02-14 JP JP1989016178U patent/JPH02106834U/ja active Pending