JPS6267983U - - Google Patents
Info
- Publication number
- JPS6267983U JPS6267983U JP16009485U JP16009485U JPS6267983U JP S6267983 U JPS6267983 U JP S6267983U JP 16009485 U JP16009485 U JP 16009485U JP 16009485 U JP16009485 U JP 16009485U JP S6267983 U JPS6267983 U JP S6267983U
- Authority
- JP
- Japan
- Prior art keywords
- bottom plate
- casing
- impeller
- strainer
- impeller casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003756 stirring Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000013049 sediment Substances 0.000 description 1
Landscapes
- Structures Of Non-Positive Displacement Pumps (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16009485U JPS6267983U (hu) | 1985-10-19 | 1985-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16009485U JPS6267983U (hu) | 1985-10-19 | 1985-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6267983U true JPS6267983U (hu) | 1987-04-28 |
Family
ID=31085148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16009485U Pending JPS6267983U (hu) | 1985-10-19 | 1985-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6267983U (hu) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5837990B2 (ja) * | 1980-10-24 | 1983-08-19 | 株式会社東芝 | 半導体装置の製造方法 |
-
1985
- 1985-10-19 JP JP16009485U patent/JPS6267983U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5837990B2 (ja) * | 1980-10-24 | 1983-08-19 | 株式会社東芝 | 半導体装置の製造方法 |