JPS6267983U - - Google Patents

Info

Publication number
JPS6267983U
JPS6267983U JP16009485U JP16009485U JPS6267983U JP S6267983 U JPS6267983 U JP S6267983U JP 16009485 U JP16009485 U JP 16009485U JP 16009485 U JP16009485 U JP 16009485U JP S6267983 U JPS6267983 U JP S6267983U
Authority
JP
Japan
Prior art keywords
bottom plate
casing
impeller
strainer
impeller casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16009485U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16009485U priority Critical patent/JPS6267983U/ja
Publication of JPS6267983U publication Critical patent/JPS6267983U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Of Non-Positive Displacement Pumps (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図から第8図は本考案に係る水中ポンプの
構造説明図、第9図は従来の水中ポンプの構造説
明図である。 図中、11:インペラケーシング、12:イン
ペラ、13:土砂吸引口、14:筒状ストレーナ
、15:筒状部、16:底板、17:中央開口、
18:出力軸、19:撹拌カツター、21,22
:透孔。
1 to 8 are structural explanatory diagrams of a submersible pump according to the present invention, and FIG. 9 is a structural explanatory diagram of a conventional submersible pump. In the figure, 11: Impeller casing, 12: Impeller, 13: Sediment suction port, 14: Cylindrical strainer, 15: Cylindrical part, 16: Bottom plate, 17: Center opening,
18: Output shaft, 19: Stirring cutter, 21, 22
: Through hole.

Claims (1)

【実用新案登録請求の範囲】 ポンプケーシングA内に内蔵した回転モータB
と、同ケーシングAの下部に連結したインペラケ
ーシング11と、同インペラケーシング11の下
端に連結した底板16付の筒状ストレーナ14と
、同インペラケーシング11と筒状ストレーナ1
4の底板16に設けた中央開口17を通して下方
に伸延する回転モータの出力軸18と、同出力軸
18に、それぞれインペラケーシング11内と底
板16下部において固着されるインペラ12及び
撹拌カツター19とを具備する水中ポンプにおい
て、 同筒状ストレーナ14の底板16を有孔底板と
するとともに、同底板16を、外周縁16a側を
高くするとともに、中央開口17側を低くした凹
の断面形状としたことを特徴とする凹状ストレー
ナ底板を有する水中ポンプ。
[Scope of claim for utility model registration] Rotating motor B built in pump casing A
, an impeller casing 11 connected to the lower part of the casing A, a cylindrical strainer 14 with a bottom plate 16 connected to the lower end of the impeller casing 11, and the impeller casing 11 and the cylindrical strainer 1.
An output shaft 18 of a rotary motor extends downward through a central opening 17 provided in the bottom plate 16 of 4, and an impeller 12 and a stirring cutter 19 are fixed to the output shaft 18 inside the impeller casing 11 and at the bottom of the bottom plate 16, respectively. In the submersible pump, the bottom plate 16 of the cylindrical strainer 14 is a perforated bottom plate, and the bottom plate 16 has a concave cross-sectional shape in which the outer peripheral edge 16a side is higher and the center opening 17 side is lower. A submersible pump having a concave strainer bottom plate.
JP16009485U 1985-10-19 1985-10-19 Pending JPS6267983U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16009485U JPS6267983U (en) 1985-10-19 1985-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16009485U JPS6267983U (en) 1985-10-19 1985-10-19

Publications (1)

Publication Number Publication Date
JPS6267983U true JPS6267983U (en) 1987-04-28

Family

ID=31085148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16009485U Pending JPS6267983U (en) 1985-10-19 1985-10-19

Country Status (1)

Country Link
JP (1) JPS6267983U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837990B2 (en) * 1980-10-24 1983-08-19 株式会社東芝 Manufacturing method of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837990B2 (en) * 1980-10-24 1983-08-19 株式会社東芝 Manufacturing method of semiconductor device

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