JPS626700Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a stack for flat semiconductor devices (hereinafter referred to as a stack).

In recent years, as the capacity of semiconductor devices has increased, the semiconductor elements used therein have become increasingly larger, and as a result, there has been a demand for a stack having a fastening device with a large pressure contact force.

Figures 1a and 1b are diagrams showing an example of the configuration of a conventional flat semiconductor device stack. In both figures, 1 is a flat semiconductor device, and cooling fins 2 are applied to both sides of the device to dissipate heat generated by the device 1. The electrode conductors 3a, 3b and the insulating seat 4 are placed on the outside of the stack, and the stack is stacked with a plate-shaped holding plate 5 having a rectangular cross section, a tightening bolt 6, and a nut 7 from both end faces in the stacking direction. The stack is constructed by tightening and applying pressure using a tightening device constructed by. In the figure, reference numeral 8 denotes a mounting foot for mounting and storing the stack on the semiconductor device frame 10, and is fixed to the holding plate 5.

In the stack configured in this manner, the maximum bending moment acts on the holding plate 5 of the stack tightening device at the center, as shown in Fig. 2, and a reduced bending moment acts on the both sides. . However, since the conventional holding plate 5 has a uniform thickness in the cross section at the central portion where the maximum bending moment acts, the cross section on both sides is larger than necessary in terms of strength, resulting in the use of uneconomical materials. Therefore, the presser plate 5 was unnecessarily heavy and inconvenient to handle.

In view of the above points, it is an object of the present invention to provide a stack for flat semiconductor devices having a presser plate that is compact and lightweight by using economical materials.

The configuration of the present invention will be explained below based on the drawings. FIGS. 3a and 3b show an embodiment of the stack of the present invention, and the same reference numerals as in FIGS. 1a and 1b are the same parts, so a description thereof will be omitted. In the figure, reference numeral 9 denotes a holding plate that has the same function as the holding plate 5 of the conventional stack tightening device shown in Figs. Furthermore, a concave cross section is formed so that equal stress is applied to each part and equal rigidity is obtained in response to the bending moment acting on each part without deteriorating necessary functions. By forming the concave shape, it is possible to obtain a larger moment of inertia of area and greater bending stiffness even with the same cross-sectional area compared to the conventional presser plate 5 which has a rectangular cross-sectional shape. The cross-sectional area can be made smaller than that of the presser plate 5, and the required strength can be obtained with less material. Further, by forming the concave shape, the presser plate 9 can also be used as the conventional mounting foot 8. Furthermore, by storing the bolts 6 and nuts 7 of the tightening device in the recesses of the presser plate 9, the stack can be made smaller in size as well as the mounting feet 8 are removed compared to the conventional stack.

4a, b and 5a, b show other embodiments. In FIG. 4a, b, the presser plate 11 does not have a concave cross-sectional shape, but simply extends from the center to both sides. This is the case where the mountain shape is sloped, and the ones in Figures 5a and b are the cases where the cross section is simply concave without slope from the center to both sides. , the example shown in FIG. 5 also achieves a smaller size and lighter weight.

According to the present invention described above, it is possible to provide a flat semiconductor element stack which can be made economical in the material of the holding plate, and can also reduce the number of parts, making it smaller and lighter.

[Brief explanation of the drawing]

Figures 1a and b are plan and front views of a conventional stack for flat semiconductor devices, Figure 2 is a diagram illustrating the bending moment acting on the holding plate of the stack for flat semiconductor elements, and Figures 3a and b are A plan view and a front view of an embodiment of the present invention, Fig. 4 a, b and Fig. 5 a, b
These are a plan view and a front view of different other embodiments, respectively. 1... Flat semiconductor element, 2... Cooling fin, 3
a, 3b... Electrode conductor, 4... Insulating seat, 5... Holding plate, 6... Tightening bolt, 7... Nut, 8...
...Mounting foot, 9... Holding plate, 10... Semiconductor device body frame, 11, 12... Holding plate.

Claims (1)

[Scope of utility model registration request] A flat semiconductor element formed by integrally tightening a laminate in which cooling fins are placed on both sides of the flat semiconductor element, and electrode conductors, insulating seats, etc. are interposed on the outside thereof, and are tightened by a tightening device consisting of a holding plate, tightening bolts, and nuts. 1. A stack for flat semiconductor devices, characterized in that the holding plate has a sloped mountain shape from the center portion to both side clamping portions, and has a concave cross section.