JPS6265855U - - Google Patents
Info
- Publication number
- JPS6265855U JPS6265855U JP1985158377U JP15837785U JPS6265855U JP S6265855 U JPS6265855 U JP S6265855U JP 1985158377 U JP1985158377 U JP 1985158377U JP 15837785 U JP15837785 U JP 15837785U JP S6265855 U JPS6265855 U JP S6265855U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- envelope
- diode device
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158377U JPS6265855U (enExample) | 1985-10-14 | 1985-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158377U JPS6265855U (enExample) | 1985-10-14 | 1985-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6265855U true JPS6265855U (enExample) | 1987-04-23 |
Family
ID=31081807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985158377U Pending JPS6265855U (enExample) | 1985-10-14 | 1985-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6265855U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005210042A (ja) * | 2003-09-11 | 2005-08-04 | Kyocera Corp | 発光装置および照明装置 |
| JP2009158541A (ja) * | 2007-12-25 | 2009-07-16 | Citizen Electronics Co Ltd | 発光ダイオードの製造方法 |
| JP2019511840A (ja) * | 2016-03-16 | 2019-04-25 | ルミレッズ ホールディング ベーフェー | Ｌｅｄモジュールを製造する方法 |
-
1985
- 1985-10-14 JP JP1985158377U patent/JPS6265855U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005210042A (ja) * | 2003-09-11 | 2005-08-04 | Kyocera Corp | 発光装置および照明装置 |
| JP2009158541A (ja) * | 2007-12-25 | 2009-07-16 | Citizen Electronics Co Ltd | 発光ダイオードの製造方法 |
| JP2019511840A (ja) * | 2016-03-16 | 2019-04-25 | ルミレッズ ホールディング ベーフェー | Ｌｅｄモジュールを製造する方法 |