JPS6265838U - - Google Patents
Info
- Publication number
- JPS6265838U JPS6265838U JP15804485U JP15804485U JPS6265838U JP S6265838 U JPS6265838 U JP S6265838U JP 15804485 U JP15804485 U JP 15804485U JP 15804485 U JP15804485 U JP 15804485U JP S6265838 U JPS6265838 U JP S6265838U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- wafer
- claw
- press
- fixing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 210000000078 claw Anatomy 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15804485U JPS6265838U (es) | 1985-10-15 | 1985-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15804485U JPS6265838U (es) | 1985-10-15 | 1985-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6265838U true JPS6265838U (es) | 1987-04-23 |
Family
ID=31081163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15804485U Pending JPS6265838U (es) | 1985-10-15 | 1985-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6265838U (es) |
-
1985
- 1985-10-15 JP JP15804485U patent/JPS6265838U/ja active Pending