JPS6263669A - Vapor depositing apparatus using electron beam - Google Patents

Abstract

PURPOSE:To evaporate uniformly a material to be evaporated and to reduce a change in the rate of vapor deposition by forming a part for holding a material to be evaporated at the central part of a crucible and by making the crucible rotatable during the evaporation of the material to be evaporated. CONSTITUTION:This vapor depositing apparatus using electron beams is composed essentially of a vacuum vessel 11, a crucible 12 placed in the vessel 11, an electron beam generating part 15, and a rotating mechanism 13 for rotating the crucible 12 during the evaporation of a material 18 to be evaporated. The crucible 12 has a part 17 for holding a material to be evaporated at the central part and the material 18 put in the part 17 is evaporated by heating with electron beams.

Description

DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD OF THE INVENTION The present invention relates to an electron beam evaporation apparatus that heats evaporation material in a crucible with an electron beam.

[Technical background of the invention and its problems] The electron beam heating evaporation method can easily obtain high power density on the surface of the evaporation material and can perform efficient heating, so compared to the resistance heating evaporation method, the produced film is It is widely used as a method for producing high-purity thin films, as it has advantages such as less deviation in composition and less contamination of impurities from evaporation sources.

In conventional electron beam evaporation equipment, the evaporation material in a rough evaporation crucible placed in a vacuum chamber is heated and evaporated by an electron beam emitted from an electron gun, and the material condenses and adheres to the object to be evaporated in the same vacuum chamber. It's something that will make you. In this case, the irradiation spot of the electron beam on the evaporated material is focused so that the electron beam exhibits a predetermined power density, and is limited to a certain scanning range.

FIG. 3 is a block diagram showing a conventional electron beam evaporation apparatus, and FIG. 4 is a plan view of a crucible used in this electron beam evaporation apparatus.

A vacuum chamber 1 of this electron beam evaporation apparatus is maintained at a desired high vacuum inside by an exhaust system (not shown), and a disk-shaped crucible 2 made of, for example, copper is installed at the bottom of the vacuum chamber 1. It can be rotated with the top surface horizontal.

Further, a deflection electrode 3 and a filament 4 are installed in another lower part of the vacuum chamber 1, so that a predetermined position on the upper surface of the crucible 2 can be irradiated with an arc-shaped electron beam 5.

Furthermore, the substrate 6 on which vapor deposition is performed is mounted on the upper part of the vacuum chamber 1 so that the surface on which the vapor deposition film 7 is formed faces the crucible 2, and a metal plate such as stainless steel is placed between the crucible 2 and the substrate 6. A shutter 8 is provided.

The shutter 8 is rotated in the direction of the arrow to control the evaporation time, and is also used to prevent the released impurity gas from contaminating the substrate when preheating the evaporation material and releasing the gas. be done.

As roughly shown in FIG. 4, the crucible 2 is provided with an arc-shaped evaporation material storage section 9a in plan view and a plurality of circular evaporation material storage sections 9b, 9b, . . . 9b on the same circumference on the upper surface. and the respective evaporation material storage sections 9a, 9b, 9b...
- The material to be deposited is stored in 9b.

In such an electron beam evaporation apparatus, evaporation 1. Change the irradiation position of the electron beam 5) of the IU material 7\ using the 1-kun field or electric field! , : Deflection of the electron beam 5 or rotation of the crucible 2, 1 J, is achieved by the revolving movement of the evaporation material storage section 9 about the center of the crucible 2.

Using such an electron beam evaporator, high melting point metals such as Cr and Ti, A, e20:v, T! 02, Ding az O
5. When performing evaporation of dielectric materials such as ZrO2, Sio2, MqO, etc., as the evaporation progresses, the vaporized surface of these evaporated materials 10 does not maintain a flat shape in the crucible 2, and only a portion A burrowing phenomenon in which vapor deposition progresses is often observed.

This situation will be explained below using FIG.

In commonly used electron guns for electron beam heating, the electron beam 5 is not oriented properly and the 5th
As shown in Figure (A), the evaporation material 1 in the evaporation material storage section 9
In contrast to 0, the electron beam is not applied from directly above. Therefore, as the evaporation progresses and the evaporation surface lowers, a shadow portion 10a is formed within the evaporation material storage portion 9 where the beam does not hit, as shown in FIG. 5(B). For even longer evaporation, as shown in FIG. 5(C), the electron beam 5
Even though the evaporated material reaches the bottom of the evaporation material storage section 9, the shadow portion 10a remains without being evaporated.

As a result of such a digging phenomenon, the evaporation material 10 in the evaporation material storage section 9 does not contribute effectively, and furthermore, even if the power of the electron beam 5 is kept constant, the evaporation rate changes as the evaporation progresses. There were some problems.

[Objective of the Invention] The present invention has been made in response to the above-mentioned circumstances, and provides an electron beam evaporation apparatus that evaporates evaporation material uniformly, contributes to evaporation without waste, and has less fluctuation in evaporation rate. It is something to do.

[Summary of the Invention] The present invention provides a vacuum chamber whose interior is maintained at a high vacuum, a crucible installed in the vacuum chamber having an evaporation material storage section having a circular opening, and a crucible that stores the evaporation material in the crucible. In an electron beam evaporation apparatus having an electron beam generation section installed in the vacuum chamber, the evaporation material storage section of the crucible is formed approximately in the center of the crucible. In addition, by providing a rotation mechanism that rotates the crucible during evaporation of the evaporation material, the evaporation material is evaporated uniformly and contributes to the evaporation without waste, and fluctuations in the evaporation rate are reduced.

[Embodiments of the invention] Hereinafter, the present invention will be explained in detail using the drawings.

FIG. 1 is a side view showing an embodiment of the present invention.

This electron beam evaporation apparatus consists of a vacuum chamber '11 whose interior is kept at a high vacuum by an exhaust system (not shown), a crucible 2 provided at the bottom of the vacuum chamber 11, and a crucible 12 placed at the center of the vacuum chamber '11. A rotary opening groove 13 that rotates at low speed around a shaft 12a, a filament 15a that is provided near the crucible 12 and that generates an electron beam 14, and a deflection electrode 1 that deflects the electron beam 14 toward the crucible 12.
The main parts thereof are constituted by an electron gun 15 consisting of an electron gun 5b and a shutter 1G for adjusting the deposition time.

Further, an evaporation material 18 is stored in the evaporation material storage section 17 of the crucible 12, and a substrate 19 is attached to the upper part of the vacuum chamber 11, and a evaporation film 19a is formed on the lower surface of the substrate 19.

In this electron beam evaporation apparatus, an electron beam 14 is irradiated onto the evaporation material 1B in the crucible 12 as shown in FIG. The center of material storage section 17!
Rotate around tb12a as an axis. At this time, when the electron beam 14 is deflected and scanned within an appropriate scanning range 20, the entire surface of the evaporative material storage section 17 is heated successively, and evaporation progresses uniformly as shown in FIG. 2(B).

The evaporation material storage section 17 used in the experiment had an inner diameter of 36 mm.

It has a cylindrical shape with a depth of 17 mm, and during the experiment, the electron beam was polarized and scanned over almost the entire surface of the opening of the evaporative material storage section 17 to heat it. For this reason, an ingot-like material is suitable for the evaporation material 18.

Here, A, 22 (h) is used as the evaporation material 18, the electron beam 14 is heated while avoiding the deflection scanning of the opening [] 17a of the evaporation material storage section 17, and the crucible 12 is fixed, and We will explain how the vapor deposition occurs when it is rotated intermittently.

This AC20:v ingot is formed by gradually melting Aβ203 powder to fill the evaporation material storage section 17, the vacuum degree of the vacuum chamber 11 is approximately 1 x 10' Torr, the acceleration voltage of the electron beam '14 is 10 kV, Beam current is 30
It is kept at 0mA.

When the crucible 12 is fixed, the film thickness on the substrate is 3 μm when the electron beam 14 reaches the bottom of the crucible and it becomes impossible to continue vapor deposition.

On the other hand, if the crucible 12 is rotated intermittently,
The evaporation surface inside the evaporation material storage section 17 is uniformly lowered by 5 μm.
The above film formation is possible.

In this embodiment, the crucible 12 is rotated intermittently; however, for example, the crucible 12 may be
A similar effect can be expected by continuous rotation or vibrational rotation about 2a.

[Effects of the Invention] As explained above, according to the present invention, since the crucible can be rotated around the central axis of the evaporation material storage section, the evaporation material can be evaporated without requiring complicated scanning of the electron beam. It becomes possible to evaporate uniformly while keeping the evaporation surface flat, and the evaporation material in the evaporation material storage section can be used effectively, and fluctuations in the evaporation rate are reduced.

[Brief explanation of drawings]

Fig. 1 is a block diagram showing an embodiment of the present invention, Fig. 2 is a diagram explaining the state of evaporation in the same embodiment, Fig. 3 is a block diagram of a conventional electron beam evaporation apparatus, and Fig. 4 is a block diagram of a conventional electron beam evaporation apparatus. FIG. 5 is a plan view of the crucible of the electron beam evaporation apparatus of FIG. 11...... Vacuum chamber 12... Crucible 13... Rotating mechanism 14... Electron beam 15... ...... Electron gun 17 ... Evaporation material storage section 17a ...
...Circular opening Applicant Toshiba Corporation Tokuda Manufacturing Representative Patent Attorney Sa Suyama - Figure 3 Figure 4"'-?-3 '"-e'-3 Figure 5

Claims (1)

[Claims] (1) A vacuum chamber whose interior is maintained at a high vacuum, a crucible installed in the vacuum chamber having an evaporation material storage section with a circular opening, and an evaporation chamber stored in the evaporation material storage section of this crucible. In an electron beam evaporation apparatus having an electron beam generation section installed in the vacuum chamber for evaporating a material by electron beam heating, the evaporation material storage section of the crucible is formed approximately in the center thereof, and the crucible is An electron beam evaporation apparatus characterized by being provided with a rotation mechanism that rotates during evaporation of a material.