JPS6262444U - - Google Patents
Info
- Publication number
- JPS6262444U JPS6262444U JP1985153781U JP15378185U JPS6262444U JP S6262444 U JPS6262444 U JP S6262444U JP 1985153781 U JP1985153781 U JP 1985153781U JP 15378185 U JP15378185 U JP 15378185U JP S6262444 U JPS6262444 U JP S6262444U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- semiconductor device
- seal ring
- case base
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985153781U JPS6262444U (ko) | 1985-10-07 | 1985-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985153781U JPS6262444U (ko) | 1985-10-07 | 1985-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6262444U true JPS6262444U (ko) | 1987-04-17 |
Family
ID=31072969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985153781U Pending JPS6262444U (ko) | 1985-10-07 | 1985-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6262444U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017054856A (ja) * | 2015-09-07 | 2017-03-16 | 株式会社東芝 | 電子部品 |
-
1985
- 1985-10-07 JP JP1985153781U patent/JPS6262444U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017054856A (ja) * | 2015-09-07 | 2017-03-16 | 株式会社東芝 | 電子部品 |