JPS6262435U - - Google Patents

Info

Publication number
JPS6262435U
JPS6262435U JP15293585U JP15293585U JPS6262435U JP S6262435 U JPS6262435 U JP S6262435U JP 15293585 U JP15293585 U JP 15293585U JP 15293585 U JP15293585 U JP 15293585U JP S6262435 U JPS6262435 U JP S6262435U
Authority
JP
Japan
Prior art keywords
mold
resin
resin material
separately
molds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15293585U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0432755Y2 (no
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985152935U priority Critical patent/JPH0432755Y2/ja
Publication of JPS6262435U publication Critical patent/JPS6262435U/ja
Application granted granted Critical
Publication of JPH0432755Y2 publication Critical patent/JPH0432755Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1985152935U 1985-10-04 1985-10-04 Expired JPH0432755Y2 (no)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985152935U JPH0432755Y2 (no) 1985-10-04 1985-10-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985152935U JPH0432755Y2 (no) 1985-10-04 1985-10-04

Publications (2)

Publication Number Publication Date
JPS6262435U true JPS6262435U (no) 1987-04-17
JPH0432755Y2 JPH0432755Y2 (no) 1992-08-06

Family

ID=31071366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985152935U Expired JPH0432755Y2 (no) 1985-10-04 1985-10-04

Country Status (1)

Country Link
JP (1) JPH0432755Y2 (no)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04299543A (ja) * 1991-03-28 1992-10-22 Nec Corp 半導体製造装置
JPH0732414A (ja) * 1993-07-22 1995-02-03 Towa Kk 電子部品の樹脂封止成形方法及び装置
JPH0732415A (ja) * 1993-07-22 1995-02-03 Towa Kk 電子部品の樹脂封止成形方法及び装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5138875A (en) * 1974-09-27 1976-03-31 Matsushita Electronics Corp Handotaisochino jushifujihoho
JPS59159535A (ja) * 1983-03-02 1984-09-10 Sanyo Electric Co Ltd 半導体素子の樹脂モ−ルド方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5138875A (en) * 1974-09-27 1976-03-31 Matsushita Electronics Corp Handotaisochino jushifujihoho
JPS59159535A (ja) * 1983-03-02 1984-09-10 Sanyo Electric Co Ltd 半導体素子の樹脂モ−ルド方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04299543A (ja) * 1991-03-28 1992-10-22 Nec Corp 半導体製造装置
JPH0732414A (ja) * 1993-07-22 1995-02-03 Towa Kk 電子部品の樹脂封止成形方法及び装置
JPH0732415A (ja) * 1993-07-22 1995-02-03 Towa Kk 電子部品の樹脂封止成形方法及び装置

Also Published As

Publication number Publication date
JPH0432755Y2 (no) 1992-08-06

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