JPS626024Y2 - - Google Patents
Info
- Publication number
- JPS626024Y2 JPS626024Y2 JP1982106736U JP10673682U JPS626024Y2 JP S626024 Y2 JPS626024 Y2 JP S626024Y2 JP 1982106736 U JP1982106736 U JP 1982106736U JP 10673682 U JP10673682 U JP 10673682U JP S626024 Y2 JPS626024 Y2 JP S626024Y2
- Authority
- JP
- Japan
- Prior art keywords
- charging
- cooling chamber
- hopper
- temperature
- cone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007787 solid Substances 0.000 claims description 30
- 238000001816 cooling Methods 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 11
- 238000005204 segregation Methods 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 4
- 230000002265 prevention Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 description 13
- 239000000112 cooling gas Substances 0.000 description 6
- 239000011362 coarse particle Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Filling Or Emptying Of Bunkers, Hoppers, And Tanks (AREA)
- Auxiliary Methods And Devices For Loading And Unloading (AREA)
- Feeding Of Articles To Conveyors (AREA)
Description
【考案の詳細な説明】
本考案は高温固体を対向流竪型冷却装置の冷却
室に分配装入する装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for distributing high-temperature solids into the cooling chamber of a counterflow vertical cooling system.
高温固体と冷却ガスを冷却室内で対向流により
接触させ熱回収する対向流竪型冷却設備におい
て、処理能力を向上できるようにするためには、
冷却室の個数を増やすか、あるいは個数はそのま
まとし容積を増やすかのいずれかを選択しなけれ
ばならないが、前者の場合はコストの面で得策で
はないので、後者の方向で研究が進められてい
る。 In order to improve the processing capacity of counter-flow vertical cooling equipment, which recovers heat by bringing high-temperature solids and cooling gas into contact with each other in a cooling chamber through counter-flow,
A choice must be made to either increase the number of cooling chambers or to leave the number unchanged and increase the volume, but the former is not a good idea from a cost standpoint, so research is progressing in the latter direction. There is.
しかし、種々の粒度分布を有する高温固体を取
扱う対向流竪型冷却設備において冷却室の内径を
大きくしていくと、冷却室内で高温固体の粒度偏
析が助長され、その結果、高温固体の冷却が均一
に行われなくなるので、冷却ガスと高温固体との
間の熱伝達率が極端に低下するという問題があ
る。 However, in counter-flow vertical cooling equipment that handles high-temperature solids with various particle size distributions, increasing the internal diameter of the cooling chamber promotes particle size segregation of the high-temperature solids within the cooling chamber, and as a result, cooling of the high-temperature solids becomes difficult. Since the heat transfer is not carried out uniformly, there is a problem in that the heat transfer coefficient between the cooling gas and the high-temperature solid is extremely reduced.
本考案は上述の従来の問題点を解決することを
目的とするもので、高温固体の落下口と冷却室の
間に、上記落下口の真下にその頂部が位置するよ
うにして円錐体を配設し、該円錐体の外周に複数
の集合ホツパを配設し、該各集合ホツパの下部開
口の下方に装入ホツパを各々配設し、該各装入ホ
ツパ内に上記各下部開口の下方に位置するよう粒
度偏析防止金具を各々配置し、該各装入ホツパの
下部装入ノズルを前記冷却室と各々連絡せしめた
ことを特徴とする高温固体の分配装入装置、にか
かるものである。 The purpose of this invention is to solve the above-mentioned conventional problems, and a cone is placed between the drop port for high-temperature solids and the cooling chamber so that its top is located directly below the drop port. a plurality of collecting hoppers are arranged on the outer periphery of the conical body, a charging hopper is arranged below the lower opening of each collecting hopper, and a charging hopper is arranged below each of the lower openings in each charging hopper. A distributing and charging device for high-temperature solids, characterized in that metal fittings for preventing grain size segregation are arranged at respective positions, and the lower charging nozzles of each charging hopper are connected to the cooling chamber. .
以下本考案の実施例を図面により説明する。第
１図及び第２図は本考案について示すもので、高
温固体の落下口１の真下に頂部が位置するように
分配円錐体２を設けて該分配円錐体２の表面上を
高温固体３が等分布で落下するようにし、かつ該
分配円錐体２の外周に該分配円錐体２を四方から
取囲むようにして４個の集合ホツパ４を配して各
集合ホツパ４に等量の高温固体３が捕集されるよ
うにし、該集合ホツパ４の下部開口（装入口）５
から落下した高温固体３を受ける装入ホツパ６を
上部に備えた４本の装入ノズル７を冷却室８の頂
部に挿入している。９は装入ホツパ６に設けた粒
度偏析防止金具、１０は冷却室８に設けた冷却ガ
ス出口である。 Embodiments of the present invention will be described below with reference to the drawings. Figures 1 and 2 show the present invention, in which a distribution cone 2 is provided so that its top is located directly below the drop opening 1 for high temperature solids, and a high temperature solid 3 flows over the surface of the distribution cone 2. Four collecting hoppers 4 are arranged around the outer periphery of the distribution cone 2 so as to surround the distribution cone 2 from all sides, and an equal amount of high-temperature solids 3 are placed in each collection hopper 4 so that the solids fall in an even distribution. The lower opening (charging port) 5 of the collecting hopper 4
Four charging nozzles 7 each having a charging hopper 6 at the top for receiving high-temperature solids 3 falling from the cooling chamber 8 are inserted into the top of the cooling chamber 8. Reference numeral 9 indicates a metal fitting for preventing grain size segregation provided in the charging hopper 6, and reference numeral 10 indicates a cooling gas outlet provided in the cooling chamber 8.
上記実施例において落下口１から流出した高温
固体４は分配円錐体２の頂部に落下した後、分配
円錐体２の表面を等分布で降下し、各集合ホツパ
４に等量の高温固体３が捕集される。集合ホツパ
４に捕集された高温固体３は装入口５から装入ホ
ツパ６内の粒度偏析防止金具９の頂部に向け落下
し、粒度偏析防止金具９を取り囲んだ火山状に盛
り上つて堆積する。この際、粗粒は盛上りの斜面
を転げ落ちて装入ホツパ内壁寄りおよび粒度偏析
防止金具寄りのところにそれぞれ堆積し、細粒は
盛り上りの頂上近傍に堆積する。そして、このよ
うに分散された粗粒は細粒と混合しながら装入ノ
ズル７を経て冷却室８に装入される。冷却室８内
に装入された高温固体３は冷却室８の下部から順
次切出されて冷却室８内を降下し、冷却室８の下
部から吹込まれ上昇する冷却ガスと接触して冷却
され、一方冷却ガスは高温ガスとなつて冷却ガス
出口１０から外部に取出される。 In the above embodiment, the high-temperature solids 4 flowing out from the drop port 1 fall to the top of the distribution cone 2 and then descend on the surface of the distribution cone 2 with equal distribution, so that an equal amount of high-temperature solids 3 is deposited in each collecting hopper 4. be captured. The high-temperature solids 3 collected in the collecting hopper 4 fall from the charging port 5 toward the top of the particle size segregation prevention fitting 9 in the charging hopper 6, and rise up and accumulate in a volcanic shape surrounding the particle size segregation prevention fitting 9. . At this time, coarse grains roll down the slope of the bulge and are deposited near the inner wall of the charging hopper and near the metal fitting for preventing particle size segregation, while fine grains are deposited near the top of the bulge. The thus dispersed coarse particles are charged into the cooling chamber 8 through the charging nozzle 7 while being mixed with the fine particles. The high-temperature solid 3 charged into the cooling chamber 8 is sequentially cut out from the lower part of the cooling chamber 8, descends within the cooling chamber 8, and is cooled by contacting the cooling gas blown in from the lower part of the cooling chamber 8 and rising. On the other hand, the cooling gas becomes a high-temperature gas and is taken out from the cooling gas outlet 10.
このように本考案では、各装入ホツパ６に高温
固体３を均等に分配でき、従つて各装入ノズル７
から等量の高温固体３を冷却室８内に装入できる
ので、冷却室８内で高温固体３の粒度偏析が助長
されることをなくせる。 In this way, the present invention allows the high-temperature solid 3 to be evenly distributed to each charging hopper 6, and therefore to each charging nozzle 7.
Since the same amount of the high-temperature solid 3 can be charged into the cooling chamber 8, the particle size segregation of the high-temperature solid 3 in the cooling chamber 8 can be prevented from being promoted.
なお前記実施例では集合ホツパ及び装入ノズル
の個数をそれぞれ４個としたが、２個以上であれ
ばよく、その他本考案の要旨を逸脱しない範囲に
おいて種々の変更を加え実施できること等は勿論
である。 In the above embodiment, the number of collecting hoppers and charging nozzles was four each, but it is sufficient to have two or more, and it goes without saying that various changes can be made without departing from the gist of the present invention. be.
本考案は前述したように高温固体を円錐体（分
配円錐体）の頂部に落下させて円錐体の表面上を
等分布に降下させると共に、該降下した高温固体
を複数の集合ホツパで均等に捕集し、粒度偏析防
止金具９を有する装入ホツパ６内で各種粒径の高
温固体を一様に混合し、各装入ノズル７を経て冷
却室８内に等量の高温固体を装入できるようにし
たので、種々の粒度分布を有する高温固体の大径
の冷却室に装入した場合に冷却室内で高温固体の
粒度偏析が助長されることをなくせ、従つて高温
固体の均一な冷却を行うことが可能になる、とい
う優れた効果を奏し得る。 As mentioned above, the present invention allows high-temperature solids to fall onto the top of a cone (distribution cone) and descend in an even distribution over the surface of the cone, and the falling high-temperature solids are evenly captured by multiple collecting hoppers. High-temperature solids of various particle sizes are uniformly mixed in a charging hopper 6 equipped with a particle size segregation prevention fitting 9, and an equal amount of high-temperature solids can be charged into a cooling chamber 8 through each charging nozzle 7. As a result, when high-temperature solids having various particle size distributions are charged into a large-diameter cooling chamber, particle size segregation of the high-temperature solids is prevented from being promoted in the cooling chamber, and the high-temperature solids can be cooled uniformly. This has the excellent effect of making it possible to do so.
第１図及び第２図は本考案の実施例を示すもの
で、第１図は縦断面図、第２図は第１図の−
矢視図である。
１……落下口、２……分配円錐体、３……高温
固体、４……集合ホツパ、６……装入ホツパ、７
……装入ノズル、８……冷却室。
1 and 2 show an embodiment of the present invention, FIG. 1 is a longitudinal sectional view, and FIG. 2 is a -
It is an arrow view. 1... Falling port, 2... Distribution cone, 3... High temperature solid, 4... Collection hopper, 6... Charging hopper, 7
...Charging nozzle, 8...Cooling chamber.
Claims (1)
の真下にその頂部が位置するようにして円錐体を
配設し、該円錐体の外周に複数の集合ホツパを配
設し、該各集合ホツパの下部開口の下方に装入ホ
ツパを各々配設し、該各装入ホツパ内に上記各下
部開口の下方に位置するよう粒度偏析防止金具を
各々配置し、該各装入ホツパの下部装入ノズルを
前記冷却室と各々連絡せしめたことを特徴とする
高温固体の分配装入装置。 A cone is disposed between the high-temperature solid droplet and the cooling chamber, with its top located directly below the droplet, and a plurality of collecting hoppers are disposed around the outer periphery of the cone. A charging hopper is arranged below the lower opening of the collecting hopper, a particle size segregation prevention fitting is arranged in each charging hopper so as to be located below each of the lower openings, and a metal fitting for preventing grain size segregation is arranged in the lower part of each charging hopper. 1. A distributing and charging device for high-temperature solids, characterized in that each charging nozzle is connected to the cooling chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10673682U JPS5911832U (en) | 1982-07-14 | 1982-07-14 | Distributing and charging equipment for high temperature solids |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10673682U JPS5911832U (en) | 1982-07-14 | 1982-07-14 | Distributing and charging equipment for high temperature solids |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5911832U JPS5911832U (en) | 1984-01-25 |
| JPS626024Y2 true JPS626024Y2 (en) | 1987-02-12 |
Family
ID=30249654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10673682U Granted JPS5911832U (en) | 1982-07-14 | 1982-07-14 | Distributing and charging equipment for high temperature solids |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5911832U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5053948A (en) * | 1973-09-13 | 1975-05-13 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5225814Y2 (en) * | 1972-11-28 | 1977-06-11 |
-
1982
- 1982-07-14 JP JP10673682U patent/JPS5911832U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5053948A (en) * | 1973-09-13 | 1975-05-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5911832U (en) | 1984-01-25 |
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