JPS6258618A - Heat treatment device - Google Patents

Abstract

PURPOSE:To let gas to flow smoothly without reducing the number of wafers by a method wherein the jig, with which wafers are supported in a heat treating furnace core tube, is supported in such a manner that the angle of said wafers against the longitudinal direction of the furnace core tube is brought to 90 deg.<theta<180 deg.. CONSTITUTION:A jig 1 is inserted into the furnace core tube 4 of a heat treating furnace, and wafers 2... are arranged in the groove 3 provided on the jig 1. Said groove 3 is incliningly formed in such a manner that the angle theta of the wafers 2 against the longitudinal direction of the furnace core tube 4 is set at 90 deg.<theta<180 deg.. When the angle theta is brought close to 90 deg., the number of the wafers 2 which can be arranged on the jig 1 is increased, but the flow G of gas is turned to a non-smooth state. Also, when the angle theta is brought close to 180 deg., the number of wafers is reduced, but the flow G of gas becomes smooth. Accordingly, the optimum angle theta can be selected taking into consideration of the temperature of heat treatment, the flow rate of gas, the number of wafers arranged and the like.

Description

[Detailed Description of the Invention] Industrial Application Field This chapter relates to heat treatment equipment used in semiconductor manufacturing processes.
Ru.

2. Description of the Related Art In this type of heat treatment apparatus, a boat-shaped jig as shown in FIG. 3 or 4 is used to dispose wafers in a heat treatment furnace. , 1 is a boat-shaped jig, 2 is a wafer, 3
is the wafer support disease formed on jig 1, G is the gas flow,
0 indicates the angle between the wafer 2 and the core tube length direction A.

51 Problems that Akira attempts to solve In such a conventional configuration, in the jig shown in FIG. 3, the angle θ is 9 (1") and the gas flow G near the wafer 2 is not smooth, so The variation in the degree of heat treatment between wafers 2 processed simultaneously becomes large.Furthermore, with the jig where the angle θ is 180° as shown in Fig. 4, the gas flow G becomes smooth; When used, the number of wafers that can be arranged is reduced.

It is an object of the present invention to provide a heat treatment apparatus which has small variations in the degree of heat treatment within a wafer surface and between simultaneously processed wafers, and which does not reduce the number of wafers that can be arranged.

Means for Solving the Problems The heat treatment apparatus of Komei provides a jig for supporting the wafer in the heat treatment tube so that the angle O of the wafer with respect to the longitudinal direction of the core is in the range of 90° to 180°. The feature is that the structure is such that it is supported so that

According to this configuration, since the angle 0 is larger than 90', the gas flow in the vicinity of the wafer becomes a circle K), and because the angle θ is smaller than 180°, one circle can be placed in the cylindrical reactor core tube. The number of workpieces will not decrease.

EXAMPLE Hereinafter, an example of the present invention will be explained based on FIGS. 1 and 2.

As shown in FIG. 2, the jig 1 is used by being inserted into the core tube 4 of a heat treatment furnace with the wafers 2 fully disposed therein. As can be seen from the plan view of FIG. 1, the groove 3 is formed so that the angle θ of the wafer 2 with respect to the longitudinal direction of the furnace tube 4 is 90° and θ<180°.

If the angle θ approaches 180°, the gas flow G becomes smoother, but the number of wafers that can be placed on the jig 1 decreases. Furthermore, if the angle θ approaches 90°, the number of wafers that can be placed on the jig 1 will increase, but the gas flow G will not be smooth. Taking the above two things into consideration, the angle 0 is determined by selecting the optimum angle θ for the on-site conditions (heat treatment temperature, gas flow rate, number of wafers, etc.), and P43 is formed.

As described in the detailed description of the invention, in the heat treatment apparatus of the present invention, the jig is configured so that the angle 0 of the wafer with respect to the longitudinal direction of the reactor core tube is in the range of 90° to θ to 180°, so the number of wafers that can be placed on the jig is It is possible to smooth the gas flow near the wafer without reducing the heat treatment, and it is possible to reduce variations in the degree of heat treatment within the wafer and between simultaneously processed wafers. In today's world, where variations in the degree of heat treatment among simultaneously processed wafers have become a big problem, the heat treatment J! 1! The device has an extremely high lji value in industry.

[Brief explanation of the drawing]

FIG. 1 is a top view of an embodiment of the heat treatment apparatus of the present invention inside the core tube, FIG. 2 is a side view of FIG. 1, and FIG. 3 is a conventional θ=
FIG. 4 is a top view of a conventional θ-180° jig. 1...Boat type jig, 2...Wafer, 3...Groove,
4... Core tube, G... Gas flow, A... Longitudinal direction of the reactor core tube, θ... Angular agent between the wafer and the longitudinal direction of the reactor core Yoshihiro Morimoto Figure 1

Claims (1)

[Claims] 1. A jig that supports the wafer in the heat treatment tube,
The angle θ of the wafer with respect to the longitudinal direction of the furnace core tube is 9
A heat treatment apparatus configured to be supported in a range of 0°<θ<180°.