JPS6257911U - - Google Patents
Info
- Publication number
- JPS6257911U JPS6257911U JP14883785U JP14883785U JPS6257911U JP S6257911 U JPS6257911 U JP S6257911U JP 14883785 U JP14883785 U JP 14883785U JP 14883785 U JP14883785 U JP 14883785U JP S6257911 U JPS6257911 U JP S6257911U
- Authority
- JP
- Japan
- Prior art keywords
- mounting plate
- magnetic head
- hole
- lead wire
- attach
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Description
第1図は、本考案の一実施例を示す磁気ヘツド
の正面図、第2図は、上記第1図に示した磁気ヘ
ツドの側面図、第3図は、従来の磁気ヘツドの正
面図、第4図は、上記第3図に示した磁気ヘツド
の側面図である。
図において、1……磁気ヘツドチツプ、2……
取付板、2a……突出部、2b……シリンダマウ
ント基準面、3……コイル、4……リード線、5
……透孔、6……基板、7……樹脂、9……凹部
である。
FIG. 1 is a front view of a magnetic head showing an embodiment of the present invention, FIG. 2 is a side view of the magnetic head shown in FIG. 1, and FIG. 3 is a front view of a conventional magnetic head. FIG. 4 is a side view of the magnetic head shown in FIG. 3 above. In the figure, 1... magnetic head chip, 2...
Mounting plate, 2a... Protrusion, 2b... Cylinder mount reference surface, 3... Coil, 4... Lead wire, 5
...Through hole, 6...Substrate, 7...Resin, 9...Concave portion.
Claims (1)
、該磁気ヘツドチツプに巻回したコイルのリード
線を取付孔の透孔に通し、取付板に取り付けられ
ている基板に半田付けし、該リード線を樹脂にて
取付板に接着固定するとともにリード線を通す透
孔の外側に位置する取付板のシリンダマウント基
準面に樹脂付着防止および断線防止用の凹部を設
けたことを特徴とする磁気ヘツド。 Attach the magnetic head chip to the protrusion of the mounting plate, pass the lead wire of the coil wound around the magnetic head chip through the through hole of the mounting hole, solder it to the board attached to the mounting plate, and attach the lead wire to the resin. 1. A magnetic head which is adhesively fixed to a mounting plate and has a recess for preventing resin adhesion and wire breakage on the cylinder mount reference surface of the mounting plate located outside of a through hole through which a lead wire is passed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14883785U JPS6257911U (en) | 1985-09-27 | 1985-09-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14883785U JPS6257911U (en) | 1985-09-27 | 1985-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6257911U true JPS6257911U (en) | 1987-04-10 |
Family
ID=31063478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14883785U Pending JPS6257911U (en) | 1985-09-27 | 1985-09-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6257911U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6047119B2 (en) * | 1980-10-22 | 1985-10-19 | 三洋機工株式会社 | automatic stamping machine |
-
1985
- 1985-09-27 JP JP14883785U patent/JPS6257911U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6047119B2 (en) * | 1980-10-22 | 1985-10-19 | 三洋機工株式会社 | automatic stamping machine |
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