JPS6257215A - Charged-particle-beam scribing apparatus - Google Patents

Abstract

PURPOSE:To enhance a scribing efficiency, by simultaneously sending a pattern data to a plurality of pattern scribing parts from one pattern-data-controlling and system-controlling part, and directly scribing the patterns on a plurality of materials simultaneously. CONSTITUTION:Two pattern scribing parts comprising optoelectronic systems 5 and 5', amplifiers DAC systems 10 and 10', data correction control parts 9 and 9', stage control parts 8 and 8' and scribing chambers 6 and 6' are provided. One pattern-data-controlling and system-controlling part comprising a magnetic tape 1, a control device2, a disk 3 and a data memory 4 is provided and commonly connected to said two pattern scribing parts. An electron beam is controlled by the data, which is sent from the data memory 4 in the pattern- data-controlling and system-controlling part and shot on the materials on two stages provided in the scribing chambers 6 and 6'. The same patterns are directly scribed on the materials simultaneously.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a charged particle beam writing apparatus with improved throughput.

[Prior Art] Recently, a direct writing method using an electron beam has been attracting attention as a method for writing LSI patterns and VLSI patterns.

Figure 2 shows a conventional e-beer l for carrying out such a method.
This figure shows a block diagram of a drawing device, which is mainly composed of a pattern data management and system management section, and a pattern drawing section. The pattern data management and system management section includes a magnetic tape 1 that stores all pattern data, a disk 3 from which a plurality of pattern data is read from the magnetic tape 1 according to a command from the control device 2, and a system that stores all pattern data prior to drawing according to a command from the control device 2. It consists of a data memory 4 into which necessary pattern data is read from this disk. The pattern drawing section includes an electron optical system that includes an electron gun, a blanking electrode, a deflector that controls the position of the electron beam from the electron gun on the material, and lenses that focus the electron beam on the material. 5. A drawing room 6 equipped with a stage on which a material is placed, a detector for detecting backscattered electrons generated from this material, etc.; the control device 20 is activated by commands to detect misalignment of the material, distortion of the deflector, etc. A signal processing unit 7 that detects patterns; a stage control unit 8 that operates based on instructions from the control device 2 and detects stage movement and rotation errors; and a stage control section 8 that operates based on instructions from the control device 2 and detects patterns from the data memory 4. A data correction control section 9 that applies correction parameters specific to each device and distortion correction parameters specific to the chip based on signals from the signal processing section 7 and the stage control section 8 to the data, and an amplifier such as a blanking amplifier or a deflection amplifier. The amplifier/DAC system 10 includes an inverter system.

[Problems to be solved by the invention] Now, using such an electron beam lithography system (4 size -
When a pattern is directly drawn on a chip, it is necessary to draw one pattern on each chip in the shrine, so it takes time to draw one ttA\+1, which is disadvantageous for ω production. Therefore, there is an idea to prepare a plurality of such drawing devices and perform monthly interest drawings at multiple times in the same time, but this would increase the cost significantly.

[Objective] The present invention aims to solve such problems.

[Means for Solving the Problems] Therefore, the charged particle beam lithography apparatus of the present invention includes a plurality of pattern lithography sections and one pattern data management and system management section.

[Embodiment] FIG. 1 shows a block diagram of an electron beam lithography apparatus of the present invention, and the same numbers as those used in FIG. 2 are the same components.

As shown in the figure, in this embodiment, the device-specific electron optical system (5, 5'), amplifier DAC system (10, 10'),
Data correction control section (9, 9-), signal processing section (7, 7M
, a stage control section (8° 8'), a drawing room (6, 61), and a pattern data management and system management section consisting of a magnetic tape 1.control device 2.disk 3.data memory 4. One is provided and commonly connected to the two pattern drawing sections.

The pattern data is then sent from the data memory 4 of the pattern data management and system management section to the data correction control sections 9 and 9', respectively. These data correction control units 9, 9
' is subjected to device-specific correction and chip-specific distortion correction etc. to these data based on the signals from the signal processing section 7.7' and the stage control section 8.8-, respectively, and then the amplifier DA
It is sent to the electron optical system 5, 5- via the C system 10°10'.

Then, the electron beam, which has been controlled in various ways by the electron optical systems 5 and 5-, is shot onto the materials on each stage provided in the drawing chamber 6. The same pattern is drawn directly at the same time.

Incidentally, in the above embodiment, a drawing device was shown in which the same pattern data is supplied from one pattern data management and system management section to two pattern drawing sections, respectively.
The same pattern data may be supplied from one pattern data management and system management section to three or more pattern drawing sections.

Further, in the above embodiment, 662 drawing rooms were provided, but
If a large stage on which multiple materials can be placed is used, there will only be one drawing chamber, and two electron optical systems 5.5' can be installed above this one drawing chamber. good.

[Effects of the Invention] According to the present invention, pattern data is sent from one pattern data management and system management section to a plurality of pattern drawing sections at the same time, and patterns are directly drawn on a plurality of materials at the same time. As a result, the drawing time for each monthly interest sheet becomes faster by the number of sheets to be drawn at the same time. Example λ
For example, if patterns are drawn on two sheets of material at the same time, the drawing speed for one sheet per month can be doubled. and,
In this case, at least 1/2 of the cost of the entire drawing device
Since the pattern data management and system management departments, which account for about 100% of the cost, are shared, the entire device can achieve twice the throughput at 1.5 times the cost, reducing the drawing cost per material sheet. .

[Brief explanation of drawings]

FIG. 1 shows a block diagram of an embodiment of the electron beam lithography apparatus of the present invention, and FIG. 2 shows a block diagram of a conventional electron beam lithography apparatus. 1: Magnetic tape 2: Control device 3: Disk
4: Data memory 5: Electron optical system 6: Drawing room 7
: Signal processing section 8: Stage control section 9: Data correction control section 10: Amplifier DAC system

Claims (1)

[Claims] A charged particle beam lithography device consisting of a plurality of pattern lithography units and one pattern data management and system management unit.