JPS625679U - - Google Patents
Info
- Publication number
- JPS625679U JPS625679U JP9608085U JP9608085U JPS625679U JP S625679 U JPS625679 U JP S625679U JP 9608085 U JP9608085 U JP 9608085U JP 9608085 U JP9608085 U JP 9608085U JP S625679 U JPS625679 U JP S625679U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- chip component
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9608085U JPS625679U (en, 2012) | 1985-06-25 | 1985-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9608085U JPS625679U (en, 2012) | 1985-06-25 | 1985-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS625679U true JPS625679U (en, 2012) | 1987-01-14 |
Family
ID=30961433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9608085U Pending JPS625679U (en, 2012) | 1985-06-25 | 1985-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625679U (en, 2012) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889891A (ja) * | 1981-11-24 | 1983-05-28 | ソニー株式会社 | 電子部品の混成形実装基板 |
-
1985
- 1985-06-25 JP JP9608085U patent/JPS625679U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889891A (ja) * | 1981-11-24 | 1983-05-28 | ソニー株式会社 | 電子部品の混成形実装基板 |
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