JPS625653U - - Google Patents
Info
- Publication number
- JPS625653U JPS625653U JP9716285U JP9716285U JPS625653U JP S625653 U JPS625653 U JP S625653U JP 9716285 U JP9716285 U JP 9716285U JP 9716285 U JP9716285 U JP 9716285U JP S625653 U JPS625653 U JP S625653U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead frame
- adjacent leads
- view
- metal wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9716285U JPS625653U (de) | 1985-06-26 | 1985-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9716285U JPS625653U (de) | 1985-06-26 | 1985-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS625653U true JPS625653U (de) | 1987-01-14 |
Family
ID=30963820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9716285U Pending JPS625653U (de) | 1985-06-26 | 1985-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625653U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009049072A (ja) * | 2007-08-15 | 2009-03-05 | Panasonic Corp | リードフレーム、半導体装置、リードフレームの製造方法、および半導体装置の製造方法 |
-
1985
- 1985-06-26 JP JP9716285U patent/JPS625653U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009049072A (ja) * | 2007-08-15 | 2009-03-05 | Panasonic Corp | リードフレーム、半導体装置、リードフレームの製造方法、および半導体装置の製造方法 |