JPS6256381A - Method of joining metal member to ceramic member - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for joining a metal member to a ceramic member via a thermal stress buffer.

This joining method can be applied, for example, to joining a band to an automobile camshaft or joining a gas turbine shaft to another shaft.

[Conventional technology]

In order to take advantage of the properties of ceramics such as heat resistance and heat insulation, and to compensate for the weaknesses of ceramics such as toughness,
Alternatively, in order to take advantage of the advantages of both ceramics and metals, various techniques for joining metal members to ceramics have been studied.

However, since the thermal expansion coefficients of ceramics and metals are significantly different (usually about 1 order of magnitude), joining ceramic and metal components generates large thermal stress at the joint, which can cause cracks in the ceramic component. This may occur. Therefore, when joining a ceramic member and a metal member, in order to alleviate this thermal stress, a method is adopted in which a soft metal member is interposed between the ceramic member and the metal member as a thermal stress buffer. .

[Problem that the invention seeks to solve]

As described above, by interposing the thermal stress buffer material between the ceramic member and the metal member, cranking caused by thermal stress can be significantly improved.

However, if shearing force is applied to the joined members after joining,
When a soft metal is used as a thermal stress buffer, it easily deforms and bending stress tends to act on the joint. Therefore, a bending tensile force acts on the end face of the joint, and even with a relatively low load, cracks may occur in the ceramic member, leading to damage.

Therefore, there has been a need for a device that takes advantage of the advantages of using a thermal stress buffer while preventing the ceramic member from being easily damaged even when shearing force is applied.

[Means for solving problems]

The above problem is solved by the following method of joining a metal member to a ceramic member of the present invention.

That is, the present invention is a method for joining a metal member to a ceramic member via a thermal stress buffer, in which the bonding area between the ceramic member and the thermal stress buffer is defined as the bonding area between the thermal stress buffer and the metal member. It is characterized in that it is made larger and the angle of the end face of the thermal stress buffering material with respect to the joint surface of the ceramic member and the thermal stress buffering material is 90 degrees or more.

In the present invention, soft metals commonly used as thermal stress buffering materials, such as copper and nickel, can be used. The ceramic member, the thermal stress buffer material, and the metal member are each joined using a brazing material or the like.

[Effect]

According to the present invention, since the bonding area between the ceramic member and the thermal stress buffering material is made larger than the bonding area between the thermal stress buffering material and the metal member, the load acting per unit area of the ceramic member is reduced compared to the conventional method.

In addition, by setting the angle of the end face of the thermal stress buffering material to the joint surface of the ceramic member and the thermal stress buffering material to be 90 degrees or more, it is difficult to generate tensile force acting on the end face of the joint due to shearing force etc. Become.

As a result, the bonding strength between the ceramic member and the metal member is significantly improved.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

(First example) A first embodiment will be described with reference to FIG.

Here, FIG. 1 is a schematic configuration diagram showing an outline of a method for joining a ceramic member and a metal member according to a first embodiment of the present invention.

A rectangular parallelepiped (4Qm) made of silicon nitride (St, lN4)
Prepare a ceramic member 1 of x 16 m x 10 cranes), a rectangular parallelepiped thermal stress buffer material 2 made of copper (16 m x 10 w 1 x 2111), and a rectangular parallelepiped metal member 3 of carbon w4 (S20) (25 fl x 16 cranes XIQwm). did. Then, as shown in FIG. 1, this ceramic member 1, thermal stress buffer material 2, and metal member 3 are stacked,
A CuTi brazing material 4 is interposed between these. At this time, the CuTi brazing material 4 is installed so that it wets an area of 16wXIQm between the ceramic member 1 and the thermal stress buffer material 2, and the area between the thermal stress buffer material 2 and the metal member 3 is 3 fins x 5.
It was installed so that 1.2 mm of water was wet. In addition, ceramic members
The angle of the end face of the thermal stress buffering material 2 with respect to the joint surface of the thermal stress buffering material 2 is 90 degrees. The whole was placed in a vacuum furnace, heated in vacuum at 930° C. for 1 hour, and then slowly cooled.

The bonding strength of the ceramic member with metal member obtained as a result was investigated. That is, a load was applied to the metal member 3 parallel to the joint surface of the thermal stress buffer material 2, and the shear strength was examined. As a result, the shear strength was 21 ksr/m''. At this time, there was no abnormality on the bonded surface, but a part of the ceramic member 1 to which the thermal stress buffer material 2 was bonded was damaged.

(Second example) A second embodiment will be described with reference to FIG.

Here, FIG. 1 is a schematic configuration diagram showing an outline of a method for joining a ceramic member and a metal member according to a second embodiment of the present invention.

The second embodiment differs from the first embodiment in that, as shown in FIG. is the same as in the first embodiment, the angle of the end face of the thermal stress buffering material 2 with respect to the joint surface of the ceramic member 1 and the thermal stress buffering material 2 is set to 180 degrees, and the angle of the end surface of the thermal stress buffering material 2 and the metal member The joint area with 3 is 15m x 10++n
The metal member 3 was joined to the ceramic member 1 via the thermal stress buffering material 2 in substantially the same manner as in the first example except that the structure was made larger than that of the first embodiment.

The shear strength of the resulting ceramic member with metal member was examined and found to be 13 kg/m.

(Third example) A third embodiment will be described with reference to FIG.

Here, FIG. 3 is a schematic configuration diagram showing an outline of a method for joining a ceramic member and a metal member according to a third embodiment of the present invention.

The third embodiment differs from the first embodiment in that, as shown in FIG. By sandwiching the ceramic member 1 and the thermal stress buffering material 2 and making the bonding area the same as in the first embodiment, the angle of the end surface of the thermal stress buffering material 2 with respect to the bonding surface of the ceramic member 1 and the thermal stress buffering material 2 can be adjusted. was set to 270 degrees, and the bonding area between the thermal stress buffer material 2 and the metal member 3 was 15w x 10fl, which was larger than that of the first embodiment. A metal member 3 was joined to 1 with a thermal stress buffer material 2 interposed therebetween.

The shear strength of the resulting ceramic member with metal member was examined and found to be 20 kg/1 m''.

(First comparative example) - A first comparative example will be explained with reference to FIG.

Here, FIG. 4 is a schematic configuration diagram showing an outline of a method for joining a ceramic member and a metal member according to a first comparative example of the present invention.

In the first comparative example, the difference from the first example is that, as shown in FIG. The metal member 3 was joined to the ceramic member 1 via the thermal stress buffering material 2 in substantially the same manner as in the first embodiment except that the area was the same.

When the shear strength of the resulting ceramic member with metal member was examined, it was 5 kg/m'' to 16 kg/Tsuru2.

(Second comparative example) A second comparative example will be explained with reference to FIG.

Here, FIG. 5 is a schematic configuration diagram showing an outline of a method for joining a ceramic member and a metal member according to a second comparative example of the present invention.

The second comparative example differs from the first example in that, as shown in FIG. The angle of the end face of the thermal stress buffer material 2 with respect to the bonding surface of the buffer material 2 is set to 40 degrees, and the other parts are substantially the same as in the first embodiment. The metal member 3 was joined.

The shear strength of the resulting ceramic member with metal member was examined and found to be 6.7 kg/w''.

As is clear from the above examples and comparative examples, the bonding area between the ceramic member and the thermal stress buffering material is made larger than the bonding area between the thermal stress buffering material and the metal member, and the bonding area between the ceramic member and the thermal stress buffering material is It can be seen that by setting the angle of the end face of the thermal stress buffer material to the joint surface to be 90 degrees or more, the joint strength between the ceramic member and the metal member is significantly improved.

Although specific embodiments of the present invention have been described above, the present invention is not limited to the above embodiments (and includes various embodiments within the scope of the claims).

〔Effect of the invention〕

As described above, according to the method of joining a metal member to a ceramic member of the present invention, the following effects are achieved.

(b) The bonding strength between the ceramic member and the metal member is significantly improved.

(b) It is relatively easy to apply because the thermal stress buffering material used in the past can be used as is.

[Brief explanation of drawings]

FIG. 1 is a schematic configuration diagram showing an outline of a method for joining a ceramic member and a metal member according to a first embodiment of the present invention, and FIG. FIG. 3 is a schematic diagram showing the outline of the method for joining a ceramic member and metal member according to the third embodiment of the present invention; FIG. 4 is a diagram showing the outline of the method for joining the ceramic member and metal member according to the third embodiment of the present invention; FIG. 5 is a schematic configuration diagram showing an outline of a method for joining a ceramic member and a metal member according to a second comparative example. 1...Ceramic member 2-----1 Thermal stress buffer material 3-----1--Metal member 4---1--CuTi brazing material Applicant: Toyota Motor Corporation Co., Ltd. Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] (1) A method of joining a metal member to a ceramic member via a thermal stress buffer, the bonding area of the ceramic member and the thermal stress buffer being larger than the bonding area of the thermal stress buffer and the metal member. Also, a method for joining a metal member to a ceramic member, characterized in that the angle of the end face of the thermal stress buffer with respect to the joining surface of the ceramic member and the thermal stress buffer is 90 degrees or more.