JPS6255354U - - Google Patents

Info

Publication number
JPS6255354U
JPS6255354U JP1985146750U JP14675085U JPS6255354U JP S6255354 U JPS6255354 U JP S6255354U JP 1985146750 U JP1985146750 U JP 1985146750U JP 14675085 U JP14675085 U JP 14675085U JP S6255354 U JPS6255354 U JP S6255354U
Authority
JP
Japan
Prior art keywords
stud
heat dissipation
package
stage
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985146750U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0333068Y2 (id
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985146750U priority Critical patent/JPH0333068Y2/ja
Publication of JPS6255354U publication Critical patent/JPS6255354U/ja
Application granted granted Critical
Publication of JPH0333068Y2 publication Critical patent/JPH0333068Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
JP1985146750U 1985-09-26 1985-09-26 Expired JPH0333068Y2 (id)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985146750U JPH0333068Y2 (id) 1985-09-26 1985-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985146750U JPH0333068Y2 (id) 1985-09-26 1985-09-26

Publications (2)

Publication Number Publication Date
JPS6255354U true JPS6255354U (id) 1987-04-06
JPH0333068Y2 JPH0333068Y2 (id) 1991-07-12

Family

ID=31059500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985146750U Expired JPH0333068Y2 (id) 1985-09-26 1985-09-26

Country Status (1)

Country Link
JP (1) JPH0333068Y2 (id)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014013908A (ja) * 2006-04-06 2014-01-23 Freescale Semiconductor Inc 一体型スルーホール熱放散ピンを有するモールドされた半導体パッケージおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014013908A (ja) * 2006-04-06 2014-01-23 Freescale Semiconductor Inc 一体型スルーホール熱放散ピンを有するモールドされた半導体パッケージおよびその製造方法

Also Published As

Publication number Publication date
JPH0333068Y2 (id) 1991-07-12

Similar Documents

Publication Publication Date Title
JPS6255354U (id)
JPH0270447U (id)
JPS6252942U (id)
JPH01104736U (id)
JPH0254263U (id)
JPS61134080U (id)
JPS62122373U (id)
JPS62157155U (id)
JPS61192480U (id)
JPH0351861U (id)
JPS6430878U (id)
JPH01139447U (id)
JPS6371570U (id)
JPS6212948U (id)
JPH0236045U (id)
JPH02138438U (id)
JPS63137954U (id)
JPH0180948U (id)
JPH02136332U (id)
JPH0463185U (id)
JPS61205145U (id)
JPS6151746U (id)
JPS6232534U (id)
JPH0247055U (id)
JPH01140876U (id)