JPS6255354U - - Google Patents
Info
- Publication number
- JPS6255354U JPS6255354U JP1985146750U JP14675085U JPS6255354U JP S6255354 U JPS6255354 U JP S6255354U JP 1985146750 U JP1985146750 U JP 1985146750U JP 14675085 U JP14675085 U JP 14675085U JP S6255354 U JPS6255354 U JP S6255354U
- Authority
- JP
- Japan
- Prior art keywords
- stud
- heat dissipation
- package
- stage
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985146750U JPH0333068Y2 (https=) | 1985-09-26 | 1985-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985146750U JPH0333068Y2 (https=) | 1985-09-26 | 1985-09-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6255354U true JPS6255354U (https=) | 1987-04-06 |
| JPH0333068Y2 JPH0333068Y2 (https=) | 1991-07-12 |
Family
ID=31059500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985146750U Expired JPH0333068Y2 (https=) | 1985-09-26 | 1985-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0333068Y2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014013908A (ja) * | 2006-04-06 | 2014-01-23 | Freescale Semiconductor Inc | 一体型スルーホール熱放散ピンを有するモールドされた半導体パッケージおよびその製造方法 |
-
1985
- 1985-09-26 JP JP1985146750U patent/JPH0333068Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014013908A (ja) * | 2006-04-06 | 2014-01-23 | Freescale Semiconductor Inc | 一体型スルーホール熱放散ピンを有するモールドされた半導体パッケージおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0333068Y2 (https=) | 1991-07-12 |