JPS6254595B2 - - Google Patents
Info
- Publication number
- JPS6254595B2 JPS6254595B2 JP58062510A JP6251083A JPS6254595B2 JP S6254595 B2 JPS6254595 B2 JP S6254595B2 JP 58062510 A JP58062510 A JP 58062510A JP 6251083 A JP6251083 A JP 6251083A JP S6254595 B2 JPS6254595 B2 JP S6254595B2
- Authority
- JP
- Japan
- Prior art keywords
- scrap
- laser
- cut
- laser beam
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 230000007246 mechanism Effects 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 description 4
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Accessories And Tools For Shearing Machines (AREA)
Description
【発明の詳細な説明】
本発明は、鉄、非金属、紙、フイルム、合成紙
など連続した長尺板を定寸幅に切断するサイドト
リマ（又はスリツタ）装置に係り、特にスクラツ
プ（耳切部）を短尺状に切断するスクラツプチヨ
ツパ装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a side trimmer (or slitter) device for cutting a continuous long plate such as iron, nonmetal, paper, film, or synthetic paper into a fixed width. ) for cutting into short pieces.
従来のこの種の装置としては第１図ないし第３
図に示すものが知られている。同図によれば被切
断材１がパスライン上を連続して搬送されピンチ
ロール２に噛み込まれ、このピンチロール２によ
つて次のサイドトリマ（又はスリツタ）３に送り
込まれ、このサイドトリマ３の作用を受けて定寸
幅に切断される。切断された被切断材１′はその
ままパスライン上を搬送されることとなるが、こ
のとき生じたスクラツプ４は第１図に示すように
上記サイドトリマ３から送出された直後パスライ
ン下方に配設されたガイドテーブル５（第１図、
第３図参照）上に移送されその下流端に配設され
た回転ドラム式スクラツプチヨツパ（以下「スク
ラツプチヨツパ」という。）６に達し、ここでス
クラツプ４は所定寸法に切断されて次のバケツト
７内に収納される。なお、上記ピンチロール２お
よびスクラツプチヨツパ６はそれぞれ駆動機構２
ａ，６ａによつて駆動される。 Conventional devices of this type are shown in Figures 1 to 3.
The one shown in the figure is known. According to the figure, a material to be cut 1 is continuously conveyed on a pass line, is bitten by a pinch roll 2, is sent to the next side trimmer (or slitter) 3 by this pinch roll 2, and is fed to the next side trimmer (or slitter) 3. It is cut to a fixed width by the action of step 3. The cut material 1' is conveyed as it is on the pass line, but the scrap 4 generated at this time is placed below the pass line immediately after being sent out from the side trimmer 3, as shown in FIG. The installed guide table 5 (Fig. 1,
(see Figure 3) and reaches a rotating drum type scrap hopper (hereinafter referred to as ``scrap hopper'') 6 disposed at the downstream end, where the scrap 4 is cut into predetermined dimensions. and stored in the next bucket 7. In addition, the pinch roll 2 and the scrapper hopper 6 are each driven by a drive mechanism 2.
a, 6a.
以上の構成を有するスクラツプチヨツパでは、
スクラツプ４を機械的に切断するため、摩耗した
刃を取替えなければならず、また噛み合い不良な
どの事故を起こす原因にもなつていた。 Scrap Petit Jotsupa, which has the above configuration,
Since the scrap 4 is mechanically cut, a worn blade must be replaced, which also causes accidents such as poor engagement.
本発明は叙上の欠点を解消すべくなされたもの
で、連続搬送される被切断材の両側を切断し定寸
幅にする切断機と、この切断機の下流側に配設さ
れ、上記被切断材の切断によつて発生したスクラ
ツプを間欠的にその幅方向に切断するスクラツプ
チヨツパ装置において、１台のレーザ発振器と、
この発振器からのレーザビームを集光照射する２
台のレーザヘツドと、これら２台のレーザヘツド
内に交互に上記レーザビームを切替案内する分光
器と、上記レーザヘツドから照射されるレーザビ
ームを上記スクラツプ幅方向に走査させる走査機
構とを備えたことを特徴とするものである。 The present invention has been made to solve the above-mentioned drawbacks, and includes a cutting machine that cuts both sides of a continuously conveyed material to a specified width, and a cutting machine that is disposed downstream of this cutting machine to In a scrapp cutter device that intermittently cuts scrap generated by cutting a material in the width direction thereof, one laser oscillator;
Focusing the laser beam from this oscillator 2
It is characterized by being equipped with a laser head, a spectrometer that alternately switches and guides the laser beam into these two laser heads, and a scanning mechanism that scans the laser beam irradiated from the laser head in the width direction of the scrap. That is.
以下第４図ないし第６図の図示実施例に基づ
き、従来と同一部分又は相当部分には同一符号を
付して本発明を説明すると、本実施例では、第４
図からも明らかなように、回転ドラム式スクラツ
プチヨツパ４に代え、レーザビーム式スクラツプ
チヨツパ装置（以下「レーザ装置」という。）９
を採用し、かつパスライン上でスクラツプ４を切
断する構成を採つた点が従来とその構成を異にし
ている。したがつてこの構成をさらに詳述する
と、サイドトリマ３の切断によつて生じたスクラ
ツプ４はそのまま切断材１′と同様パスライン上
を搬送されることとなるが、これらの切断材１′
とスクラツプ４は上記サイドトリマ３直後のパス
ライン上に配設された一対の押えロール８によつ
てパスライン上で押圧作用を受けながら下流へと
送出される。この送出された切断材１′とスクラ
ツプ４は上記押えロール８直後に配設されたレー
ザ装置９直下を通過することとなる。このレーザ
装置９は上記パスライン上に僅かの間隔をあけて
これと直交配設される。然してこのレーザ装置９
はレーザ発振器９ａと光路カバー９ｂと以下に述
べるレンズ等の光学系機構から成るレーザヘツド
部が構成される。すなわち、発振器９ａに発生し
たレーザビーム１０は第６図に示す第１レーザヘ
ツド部H1内分光器１１に達する。この分光器１
１が実線状態にあるとき、レーザビーム１０は下
方に反射されて、この分光器１１の下方に配設さ
れた反射鏡１２に達する。この反射鏡１２は分光
器１１からのレーザビーム１０を90゜折曲させる
よう45゜傾斜して配設されており、折曲させたレ
ーザビーム１０を次の回転反射鏡１３に向け入射
させる。この回転反射鏡１３は軸１３ａに軸支さ
れ第６図矢示Ａ方向に揺動可能に構成される。然
してこの反射鏡１３によつて反射されたレーザビ
ーム１０はこれとともにレーザヘツド部を構成す
る集光レンズ１４に送り込まれ、この集光レンズ
１４の作用によつてレーザビーム１０はパスライ
ン上のスクラツプ４表面に集光照射されることと
なる。ところがこのスクラツプ４に集光照射され
たレーザビーム１０は高エネルギー状態となつて
いるため、上記回転反射鏡１３が矢示Ａ方向に回
転すると、上記レーザビーム１０は矢示Ｂ方向に
回動し、この動作によつてスクラツプ４は切断さ
れる。かくして、切断されたスクラツプ４はさら
にパスライン上を進行して上記レーザ装置９のす
ぐ下流側でパスライン直下に配設されたバケツト
６内に収納される。このとき切断後のスクラツプ
４は、このバケツト６の下流側面に位置するよう
パスライン上に設けられたストツパ払出し装置１
５の作用を受けて、確実にバケツト６内に収納さ
れる。また上記レーザ装置９とバケツト６間に
は、スクラツプ４切断時に発生したドロス受装置
１６が配設されている。また、第６図中、分光器
１１が矢示Ｃ方向に回転すると、レーザビーム１
０は光路カバー９ｂ内を通過して被切断材１の他
側に位置する第２レーザヘツド部H2に達し、第
２反射鏡１７によつてこのビーム１０は下方に折
曲されて上述のビームヘツド部H1と同様、第３
反射鏡１８、第２回転反射鏡１９、を経て第２集
光レンズ２０によつてこのビム１０は高エネルギ
状態を形成してスクラツプ４を矢示B′方向に切断
する。 Hereinafter, the present invention will be explained based on the illustrated embodiments shown in FIGS.
As is clear from the figure, the rotating drum type scrapp hopper 4 has been replaced with a laser beam type scrapp hopper device (hereinafter referred to as "laser device") 9.
The structure is different from the conventional one in that it adopts a structure in which the scrap 4 is cut on the pass line. Therefore, to explain this configuration in more detail, the scrap 4 generated by cutting by the side trimmer 3 is conveyed as is on the pass line in the same way as the cut material 1';
The scrap 4 is sent downstream while being pressed on the pass line by a pair of press rolls 8 disposed on the pass line immediately after the side trimmer 3. The cut material 1' and the scrap 4 thus sent out pass directly below the laser device 9 disposed immediately behind the presser roll 8. This laser device 9 is installed perpendicular to the above-mentioned pass line with a slight interval therebetween. However, this laser device 9
A laser head section is composed of a laser oscillator 9a, an optical path cover 9b, and optical system mechanisms such as lenses described below. That is, the laser beam 10 generated by the oscillator 9a reaches the spectroscope 11 in the first laser head section H1 shown in FIG . This spectrometer 1
1 is in the solid line state, the laser beam 10 is reflected downward and reaches the reflecting mirror 12 disposed below the spectrometer 11. This reflecting mirror 12 is arranged at an angle of 45° so as to bend the laser beam 10 from the spectroscope 11 by 90°, and directs the bent laser beam 10 to the next rotating reflecting mirror 13 . This rotary reflecting mirror 13 is supported by a shaft 13a and is configured to be swingable in the direction of arrow A in FIG. The laser beam 10 reflected by the reflecting mirror 13 is also sent to the condenser lens 14 constituting the laser head section, and by the action of the condenser lens 14, the laser beam 10 is directed to the scrap 4 on the pass line. The surface will be irradiated with focused light. However, since the laser beam 10 focused and irradiated onto the scrap 4 is in a high energy state, when the rotating reflecting mirror 13 rotates in the direction of arrow A, the laser beam 10 rotates in the direction of arrow B. By this operation, the scrap 4 is cut. Thus, the cut scrap 4 further advances on the pass line and is stored in a bucket 6 disposed immediately downstream of the laser device 9 and directly below the pass line. At this time, the scrap 4 after cutting is transferred to a stopper dispensing device 1 installed on the pass line so as to be located on the downstream side of the bucket 6.
5, the bag is reliably stored in the bucket bag 6. Further, a device 16 for receiving dross generated when cutting the scrap 4 is disposed between the laser device 9 and the bucket 6. Also, in FIG. 6, when the spectrometer 11 rotates in the direction of arrow C, the laser beam 1
0 passes through the optical path cover 9b and reaches the second laser head section H2 located on the other side of the material to be cut 1, and this beam 10 is bent downward by the second reflecting mirror 17 and directed to the above-mentioned beam head. Similar to part H 1 , the third
The beam 10 forms a high energy state through the reflecting mirror 18, the second rotating reflecting mirror 19, and the second condensing lens 20, and cuts the scrap 4 in the direction of arrow B'.
然して、上記各レーザヘツドH1，H2は分光器
１１の開閉動作によつて、被切断材１の両側に生
ずるスクラツプ４を交互に切断する方法をとつて
いるが、この間スクラツプ４は下流側に進行する
ものの、レーザ装置９自体は固設されているた
め、被切断材１の進行方向の動きはなくその切断
方向は、第７図の斜線２１のようになる。 However, each of the laser heads H 1 and H 2 alternately cuts the scraps 4 generated on both sides of the material 1 by opening and closing the spectroscope 11, but during this time the scraps 4 are cut downstream. Although the laser device 9 moves forward, since the laser device 9 itself is fixed, there is no movement in the advancing direction of the material 1 to be cut, and the cutting direction is as indicated by diagonal lines 21 in FIG.
なお、上記実施例では、レーザビーム１０を走
査する手段として、回転反射鏡１３，１９をそれ
ぞれ矢示Ａ，A′方向に回動させているが、この
動作はスクラツプ４に対し平行にしてもよく、ま
た分光器１１も平板鏡に限定されるものではな
い。さらにレーザ発振器９ａは連続的にレーザ光
を発光するものでなくてもよく、上記切断動作に
同期して断続的に発光する方法をとつてもよいこ
とはいうまでもない。 In the above embodiment, as a means for scanning the laser beam 10, the rotating reflecting mirrors 13 and 19 are rotated in the directions of arrows A and A', respectively. Furthermore, the spectroscope 11 is not limited to a flat mirror. Furthermore, it goes without saying that the laser oscillator 9a does not need to emit laser light continuously, and may emit light intermittently in synchronization with the cutting operation.
以上本実施例によれば、光学的手段でスクラツ
プ４を切断するため、切断用工具の摩耗によるそ
れの取替作業とか、切断部における噛み合い不良
などの機械的なトラブルを解消でき、その都度機
械を停止させるという不都合がなくなり、生産効
率を格段に向上させることができる。しかも一台
のレーザ発振器９ａによつて被切断材１の両側を
切断できる効果が得られる。 As described above, according to this embodiment, since the scrap 4 is cut by optical means, it is possible to eliminate mechanical troubles such as replacing the cutting tool due to wear and poor engagement at the cutting part, and This eliminates the inconvenience of having to stop the process, and production efficiency can be significantly improved. Moreover, the effect of being able to cut both sides of the material to be cut 1 with one laser oscillator 9a can be obtained.
以上本発明によれば、一台のレーザ発振器で被
切断材の両側に発生するスクラツプを切断するこ
とができ、機械自体のトラブルも極めて少なく定
寸幅の材料の生産効率を格段に向上させることが
できる。 As described above, according to the present invention, it is possible to cut scrap generated on both sides of a material to be cut with a single laser oscillator, and the troubles of the machine itself are extremely reduced, and the production efficiency of materials with a fixed width is greatly improved. Can be done.
第１図ないし第３図は従来の回転ドラム式スク
ラツプチヨツパを適用した切断装置を示す図であ
り、第１図はその側面図、第２図は平面図、第３
図は要部を示す平面図、第４図ないし第７図は本
発明の一実施例を示す図であり、第４図、第５図
は本実施例装置を適用した第１図、第２図と同様
の側面図と平面図、第６図は本実施例装置のレー
ザヘツド部を示す構成図、第７図は本実施例装置
の動作を示す説明図である。
１：被切断材、３：サイドトリマ（切断機）、
４：スクラツプ、６，９：スクラツプチヨツパ装
置、９ａ：レーザ発振器、１０：レーザビーム、
１１：分光器、H1，H2：レーザヘツド。
1 to 3 are diagrams showing a cutting device to which a conventional rotating drum type scrapper is applied, in which FIG. 1 is a side view, FIG. 2 is a plan view, and FIG.
The figure is a plan view showing the main parts, and FIGS. 4 to 7 are views showing one embodiment of the present invention. FIGS. FIG. 6 is a configuration diagram showing the laser head section of the apparatus of this embodiment, and FIG. 7 is an explanatory diagram showing the operation of the apparatus of this embodiment. 1: Material to be cut, 3: Side trimmer (cutting machine),
4: Scrap, 6, 9: Scrap hopper device, 9a: Laser oscillator, 10: Laser beam,
11: Spectrometer, H 1 , H 2 : Laser head.
Claims (1)
断機の下流側に配設され、上記被切断材の切断に
よつて発生したスクラツプを間欠的にその幅方向
に切断するスクラツプチヨツパ装置において、１
台のレーザ発振器と、この発振器からのレーザビ
ームを集光照射する２台のレーザヘツドと、これ
ら２台のレーザヘツドに交互に上記レーザビーム
を切替案内する分光器と、上記レーザヘツドから
照射されるレーザビームを上記スクラツプ幅方向
に走査させる走査機構とを備えたことを特徴とす
るスクラツプチヨツパ装置。1. A scrap hopper installed on the downstream side of a cutting machine that cuts both sides of a continuously conveyed material to be cut, and that intermittently cuts scrap generated by cutting the material to be cut in the width direction thereof. In the device, 1
A laser oscillator, two laser heads that condense and irradiate the laser beam from the oscillator, a spectrometer that alternately switches and guides the laser beam to these two laser heads, and a laser beam that is irradiated from the laser head. a scanning mechanism for scanning the scrap in the width direction of the scrap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58062510A JPS59189090A (en) | 1983-04-08 | 1983-04-08 | Chopper device for scrap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58062510A JPS59189090A (en) | 1983-04-08 | 1983-04-08 | Chopper device for scrap |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59189090A JPS59189090A (en) | 1984-10-26 |
| JPS6254595B2 true JPS6254595B2 (en) | 1987-11-16 |
Family
ID=13202242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58062510A Granted JPS59189090A (en) | 1983-04-08 | 1983-04-08 | Chopper device for scrap |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59189090A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6268797U (en) * | 1985-10-18 | 1987-04-30 | ||
| US7732732B2 (en) | 1996-11-20 | 2010-06-08 | Ibiden Co., Ltd. | Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
| DE69737991T2 (en) | 1996-11-20 | 2008-04-30 | Ibiden Co., Ltd., Ogaki | LASER PROCESSING DEVICE, METHOD AND DEVICE FOR PRODUCING A MULTILAYER PRINTED PCB |
-
1983
- 1983-04-08 JP JP58062510A patent/JPS59189090A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59189090A (en) | 1984-10-26 |
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