JPS6254101A - Precise device reducing error due to temperature variation - Google Patents

Abstract

PURPOSE:To reduce the error in a precise device without building in an expensive temperature control system by forming a scale with materials whose absolute value of the coefficient of linear expansion in the temperature range of -20-100 deg.C is smaller than 10X10<-7>/ deg.C. CONSTITUTION:In a precise cutting device, the first and second detecting means which detect the extent of horizontal movement of a moving main base 6 to a still main base 2 or the extent of rise/fall of a moving auxiliary supporting base 8 to the base 6 are arranged. Means 52 and 54 detect the extent of horizontal movement or rise/fall of a cutting blade 48 also. Means 52 and 54 are provided with linear scales 58 and 68 which are extended horizontally or vertically by a pair of attaching brackets 56 and 66. Both ends of scales 58 and 68 are fixed through elastic members 60 and 70 and thermal expansion or contraction is absorbed by elastic deformation of members 60 and 70. Scales 58 and 68 themselves are formed with materials whose absolute value of the coefficient of linear expansion in the temperature range of -20-100 deg.C is smaller than 10X10<-7>/ deg.C. Thus, the error is reduced considerably without the expensive temperature control system.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a precision device in which errors in relative movement between an object and an actuating element due to temperature changes are reduced.

<Prior Art> For example, in the manufacture of semiconductor devices, as is well known to those skilled in the art, the surface of a substantially disk-shaped semiconductor wafer is cut along cutting lines arranged in a grid (such cutting lines are generally referred to as streets). ) into a plurality of rectangular areas, and a required circuit pattern is applied to each of the rectangular areas. Next, the wafer is cut along the cutting lines, and thus a plurality of rectangular regions having circuit patterns are individually separated (the individually separated rectangular regions are generally referred to as chips). Such cutting of the wafer is performed by a precision cutting device called a dicer or dicing device. The width of the cutting line is extremely narrow, generally several tens of micrometers or less. Therefore, cutting a wafer using a precision cutting device must be performed with great precision, and the tolerance is generally a few microns or less.

The precision cutting apparatus includes a wafer holding means and a support means for supporting a cutting tool such as a rotating cutting blade made of diamond abrasive grains. So-called indexing, in which a cutting tool is sequentially aligned with a plurality of cutting lines on a wafer held on a wafer holding means, is performed by moving one of the supporting means and the holding means in a predetermined direction by operating a drive source. This is accomplished by moving the Control of the drive source, and therefore movement control of one of the support means and the holding means, is performed based on detection of the amount of movement of one of the support means and the holding means. For the above detection, a detection means having a scale having a large number of lines to be detected and a detector for detecting the lines to be detected on this scale is used.

<Problems with the Prior Art> According to the experience of the present inventor, in the conventional precision cutting device, cutting work can be continuously performed for a relatively long time, for example, 8 hours or more. Then, there is a problem in that the error in the above-mentioned indexing gradually increases and exceeds the permissible error.

<Object of the Invention> The present invention has been made in view of the above facts, and its main purpose is to provide a precision device such as the precision cutting device described above that is sufficiently stable without the need to incorporate an expensive temperature control system. It is an object of the present invention to provide a new and superior precision device that can perform required functions continuously over a relatively long period of time within tolerance limits.

<Summary of the Invention> As a result of investigating the above-mentioned problems in conventional precision cutting devices from various points of view, the following facts were discovered.

Initially, it was thought that the above-mentioned error in indexing was caused by thermal expansion of the structural members of the device due to heat generated by continuous operation of the device. However, although the thermal expansion of the structural members will of course produce an error in the above index, the error due to the thermal expansion of the structural member is relatively small, and the above error in the index is mainly due to the thermal expansion of the scale of the detection means. It was found that this was caused by

Regarding the scale of the detection means, conventionally, in order to reduce the generation of errors due to thermal expansion, the scale is made of a material having a coefficient of linear expansion that is substantially the same as or close to the coefficient of linear expansion of the structural member. It was considered important to form The majority of structural members are generally formed from iron or the like, and therefore are typically materials that have a coefficient of linear expansion substantially greater than - or close to - that of iron or the like. 20 to 10
The coefficient of linear expansion in the temperature range of 0°C is approximately 8xlQ-'/
The scale was formed from soda-zinc glass, which is ``c''.

As mentioned above, in view of the fact that the above error in indexing is mainly caused by the thermal expansion of the scale of the detection means, the present inventor controls the temperature of the scale to a predetermined temperature (for example, 20 ° C.) by circulating cooling water. When I tried that,
The above-mentioned error in indexing could be considerably reduced. However, incorporating a temperature control system such as cooling water circulation into the detection means necessarily increases the manufacturing and operating costs of the detection means considerably. In addition, although it is experimentally possible to control the temperature of the scale to a predetermined temperature, it is extremely difficult, if not impossible, in practice.

Based on the above-mentioned facts, as a result of conducting further intensive research and experiments, the present inventor surprisingly broke through the conventional technical common sense and found that if the scale is formed from a material with a significantly small coefficient of linear expansion. It has been found that the above-mentioned error in indexing can be significantly reduced. The smaller the coefficient of linear expansion of the material forming the scale, the smaller the error in indexing can be made, but generally the absolute value of the coefficient of linear expansion in the temperature range of -20 to 100°C is 10 x 10-7. If the scale is formed from a material having a temperature of /°C or less, the above object can be practically achieved.

Thus, according to the present invention, the holding means for holding the object, the supporting means for supporting the actuating element, and the detecting means are provided, and at least one of the holding means and the supporting means is arranged in a predetermined direction. The detection means includes a scale having a large number of lines to be detected and a detector for detecting the lines to be detected on the scale, and the detection means includes a scale having a large number of lines to be detected, and a detector for detecting the lines to be detected on the scale, and In a precision device for detecting the amount of movement in a direction, the scale of the detection means has an absolute value of linear expansion coefficient in the temperature range of -20 to 100°C of lOX 10-'/
A precision device is provided, characterized in that it is made of a material with a grade C or lower.

The actuating element can be various processing tools in various precision machining devices or various measuring heads in precision measuring devices.

A preferred material for forming scales is, for example, the product name "Neoceram GC-7" from Nippon Electric Glass Co., Ltd.
Crystallized glass sold as N-OJ (linear expansion coefficient at -20 to 100°C approximately 0.6X 10-7
/℃), the product name ``Neoceram GC-・2・N'' was released by the company.
Crystallized glass sold as "-0" (linear expansion coefficient -3xto-' to 15x at -20 to 100°C)
10-? /“C), the product name “Neoceram GC-” was released by the company.
Crystallized glass (-
Linear expansion coefficient 8X10-' to 10xl O-7/'c) at 20 to 100°C, Jena G from West Germany
Crystallized glass sold by Chott & Gen under the trade name rZERODURJ (linear expansion coefficient 0.5X at -20 to 100°C)
10-7 to 5 x 10-'/''C), quartz glass (linear expansion coefficient approximately 5.5x at -20 to 100°C)
1o-77"c) or high silicate glass whose weight ratio is 96% or more of silicic acid, which is generally referred to as 96% silica glass (linear expansion coefficient at -20 to 100°C approximately 8X)
Special glasses such as 10-'/''C) can be mentioned.

<Preferred Specific Example of the Invention> Hereinafter, a specific example of a precision device constructed according to the present invention,
That is, an example of a precision cutting device to which the principles of the present invention are applied will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, the illustrated precision cutting device includes a stationary main base 2. As shown in FIG. Mounted on this main base 2 is a support means generally designated by the number 4. Support means 4
The movable support base 6, the movable sub-support base 8, and the support member 1
Contains 0. The support base 6 has a horizontal portion 12 and a vertical portion 14, and is mounted on the main base 2 so as to be movable in the left-right direction and substantially horizontally in FIG. More specifically, one (or a plurality of) guide rails 16 are fixed to the earthen wall of the main base 2 and extend substantially horizontally in the left-right direction in FIG. 12 is slidably mounted along a guide rail 16. A horizontal drive means 18 is also mounted on the upper wall of the main base 2. The drive means 18 includes a male threaded rod 20 extending laterally and substantially horizontally in FIG. 1, and a drive source 22 which may be a pulse motor. The left end of the male threaded rod 20 is rotatably supported by a bearing block 24 fixed on the upper wall of the main base 2, and the right end is supported by a drive source 22 mounted on the earthen wall of the main base 2. is connected to the output shaft of the motor via a speed reduction mechanism 26. A block 27 is fixed within the horizontal portion 12 of the support base 6, and this block 27 is formed with a through female threaded hole (not shown) that extends substantially horizontally in the left-right direction in FIG. The middle portion of the male threaded rod 20 is screwed into the female threaded hole. Therefore, when the drive tA22 is activated and the male threaded rod 20 is rotated, the support base 6 is moved along the guide rail 16 in the left and right direction in FIG. 1 and substantially horizontally.

The sub-support base 8, which may be a substantially rectangular block, is mounted on the vertical portion 14 of the support base 6 so as to be able to move up and down substantially vertically. More specifically, the vertical portion 14 of the support base 6
one (or more) extending substantially vertically on the left side wall of
A guide rail 28 is fixed, and the sub-support base 8 is slidably mounted along the guide rail 28. A vertical drive means 30 is also mounted on the left side wall of the vertical portion 14 of the support base 6. The drive means 30 includes a substantially vertically extending male threaded rod 32 and a drive source 34, which may be a pulse motor.

The lower end of the male threaded rod 32 is connected to the vertical portion 14 of the support base 6.
It is rotatably supported by a bearing block 36 fixed on the left side wall of the support base 6, and its upper end is connected to the output shaft of the drive source 3.4 mounted on the left side wall of the vertical part 14 of the support base 6. In principle, they are connected via a mechanism 38. A vertically extending female threaded hole (not shown) is formed in the sub-support base 8, and the intermediate portion of the male threaded rod 32 is screwed into the female threaded hole. Therefore, when the drive source 34 is activated and the male threaded rod 32 is rotated, the sub-support base 8 is moved up and down substantially vertically along the guide rail 28.

The support member 10 has a cylindrical shape and extends substantially horizontally from the right end fixed to the left side wall of the sub-support base 8 by welding, bolting, etc. to the left in FIG. . A bearing member 40 is fixed to the free end, that is, the left end of the support member 10. And this bearing member 4
0, a rotary shaft 42 is rotatably attached to the bearing member 40 so as to be immovable in the left-right direction in FIG. 1 relative to the bearing member 40. More specifically, in FIG. 1, an annular flange 44 is formed on the rotating shaft 42 that extends horizontally in the left-right direction, and an annular recess shaped like the annular flange 44 is formed in the bearing member 40. 46 is formed, and by housing the annular flange 44 in the annular recess 46, the rotating shaft 42 is prevented from moving in the left-right direction in FIG. 1 with respect to the bearing member 4.0. There is. As the bearing member 40, an air bearing well known to those skilled in the art as a precision bearing may be advantageously used. The left end of the rotating shaft 42 protrudes beyond the bearing member 40, and a thin disk-shaped cutting blade 48 arranged substantially vertically is fixed to the tip thereof. Such a cutting blade 48 may be of a form known per se, containing superabrasive grains such as diamond abrasive grains. Rotating shaft 42
A portion to the right of the annular flange 44 extends within the support member 10 . A driving source 50, which may be an electric motor, is mounted inside the support member 10, and the rotating shaft 42
The right end of is connected to the output shaft of drive #50.

In the illustrated precision cutting device, the entire body is used to detect the amount of movement of the movable support base 6 in the left-right direction in FIG. a first detection means indicated by the number 52, and a second detection means indicated by the number 54 as a whole for detecting the amount of vertical movement of the movable sub-support base 8 with respect to the movable support base 6, and therefore the amount of vertical movement of the cutting blade 48. means are in place. To explain the first detection means 52, a linear scale 58 is disposed on the bottom wall of the main base 2 by a pair of mounting brackets 56 and extends substantially horizontally in the left-right direction in FIG. ing. Both ends of the linear scale 58 are fixed to the mounting bracket 56 via elastic members 60 such as synthetic rubber, so that even if the bottom wall of the main base 2 thermally expands or contracts due to temperature changes, the It is preferable that this is absorbed by the elastic deformation of the elastic member 60 so as not to cause an adverse effect on the linear scale 58. linear scale 5
It is important that 8 itself is made of a material whose absolute value of linear expansion coefficient in the temperature range of -20 to i o o "c is 10XIO-'/"C or less, preferably the above-mentioned special glass. . The linear scale 58 is formed with a large number of detection lines arranged at intervals of, for example, 1 μm and each having a width of 1 μm. When the linear scale 58 is formed from the above-mentioned special glass, the lines to be detected can be formed by depositing metal such as chromium on the special glass by well-known vapor deposition and etching methods (in this case, the lines to be detected can be formed by depositing metal such as chromium on the special glass). It is also advantageous for the so-called exposure mask to be formed from the above-mentioned special glass). on the other hand,
A hanging piece 62 is fixed to the horizontal portion 12 of the support base 6, and projects downward through an elongated opening formed in the earthen wall of the main base 2 and extending in the left-right direction in FIG.
The above-mentioned linear scale 58 is attached to the hanging piece 62.
A photoelectric detector 64 is mounted to detect the detected line. The photoelectric detector 64, which may be of any known form per se, is
A pulse signal is generated in response to the detection of the line to be detected by the linear scale 58, and accordingly, a pulse signal is generated every time the support base 6 moves, for example, by 1 μm along the guide rail 16.

The pulse signal generated by the photoelectric detector 64 is transmitted to the drive source 22.
It is used to control the operation of the support base 6 and, therefore, to control the movement of the support base 6. The second detection means 54 may also have the same configuration as the first detection means 52 described above. A linear scale 68 extending substantially vertically is disposed on the inner surface of the right side wall of the vertical portion 14 of the support base 6 by a pair of mounting brackets 66 . As in the case of the first detection means 52 described above, both ends of the linear scale 68 are fixed to the mounting bracket 66 via elastic members 70. It is important that the linear scale 68 itself is made of a material whose absolute value of linear expansion coefficient in the temperature range of -20 to 100°C is 10 x 10-'/'c or less, preferably the above-mentioned special glass. be. For example, the linear scale 68 has a diameter of 1 μm.
A large number of lines to be detected are arranged at intervals of 1 μm and have a width of 1 μm. On the other hand, a protrusion piece 72 is fixed to the sub-support base 8 and protrudes to the right through a vertically extending elongated opening formed on the left side wall of the vertical portion 14 of the support base 6. The protruding piece 72 has the linear scale 6
A photoelectric detector 74 is installed to detect eight lines to be detected.

Photoelectric detector 64 in the first detection means 52 described above
Similarly, the photoelectric detector 74 is connected to the linear scale 6
A pulse signal is generated in response to the detection of the detected line 8. Therefore, a pulse signal is generated every time the sub-support base 8 moves up or down, for example, by 1 μm along the station rail 28. The pulse signal generated by the photoelectric detector 74 is used to control the operation of the drive source 34 and, therefore, to control the vertical movement of the sub-support base 8.

The illustrated precision cutting device further includes retaining means indicated generally by the numeral 76. This holding means 76
8 and a suction chuck 80. The sliding table 78 is mounted on the main base 2 so as to be movable in a direction substantially perpendicular to the plane of the paper in FIG. For more details, see Main base 2
Two guide rails 82 are fixed on the top and extend in a direction substantially perpendicular to the paper plane in FIG. Slide table 78
is slidably mounted along such guide rail 82. A slide drive means 84 is also mounted on the main base 2. The driving means 84 includes a male threaded rod (not shown) rotatably mounted on the main base 2 and extending in a direction substantially perpendicular to the paper plane in FIG. 1, and a driving source 86 which may be a pulse motor. Contains. The slide table 78 includes a block (not shown) in which a female through hole is formed that extends in a direction substantially perpendicular to the plane of the drawing in FIG.
is fixed, and the intermediate portion of the male threaded rod is screwed into the male threaded hole. The output shaft of the drive a86 is connected to the male threaded rod via a speed reduction mechanism (not shown). Thus, when the drive source 86 is actuated to rotate the male threaded rod, the slide 78 is moved along the guide rail 82. The suction chuck 80 is mounted on the slide table 78 so as to be rotatable about a central axis that extends substantially vertically. And slide 7
8 is also equipped with a drive source 88, which may be a pulse motor, for rotating the suction chamber 7 and 8o. The suction chuck 80 itself has a plurality of suction grooves open on its substantially horizontal upper surface, or at least a portion of the upper surface is formed of a porous material, and is selectively connected to a vacuum source (not shown). It is convenient that the structure is in a form that can communicate with each other and attract and hold a workpiece such as a semiconductor wafer W placed on the upper surface thereof. The illustrated precision cutting device further includes various drive sources 22, 34° 50.8 as described above.
6. and 88, control means 90 (FIG. 2), which may be a microprocessor, are provided.

The operation of the precision cutting device as described above will be explained below using cutting of a semiconductor wafer W as an example.

As shown in FIG. 3, on the surface of the wafer W, there are a plurality of cutting lines arranged in a grid pattern, that is, a first set of cutting lines CLx extending parallel to each other at predetermined intervals Px. and a plurality of second sets of cutting lines CLy extending parallel to each other at a predetermined interval py. The first set of cutting lines CLx and the second set of cutting lines CLy are perpendicular to each other. A required circuit pattern is applied to each of the plurality of rectangular areas RA defined by the cutting lines CLx and CLy.

Continuing the explanation with reference to FIG. 1 together with FIG. 3, the wafer W to be cut as described above is placed on the suction chuck 8 of the holding means 76 by an appropriate mounting mechanism (not shown).
0, and is held by suction on the suction chamber 80. Initial positioning is then performed. In this initial positioning, one of the first set of cutting lines CLx and the second set of cutting lines CLy existing on the surface of the wafer W, for example, the first set of cutting lines CLx is set to the first set of cutting lines CLx.
In the figure, one of the first set of cutting lines CLx (for example, the outermost cutting line) extends in a direction perpendicular to the plane of the paper, and the position in the left-right direction in FIG. The positions in the left and right directions in FIG. 1 are aligned with sufficient precision. Such initial positioning is performed by detecting the positions of the cutting lines CLx and CLy present on the surface of the wafer W with respect to the cutting blade 48 by means of an optical detection device (not shown), which is known per se, and based on such detection. The control means 90 controls the drive source 8
8 to rotate the suction chuck 80 by a required angle, and then actuate the drive source 22 again to rotate the support means 4.
This can be accomplished by moving the support base 6 and therefore the cutting blade 48 by a predetermined amount in the left and right direction in FIG. The amount of movement of the support base 6 in the left and right direction is the first
is detected by the detection means 52 and supplied to the control means 9o, and the movement of the support base 6 is thus carried out with sufficient precision. If desired, a detection means (not shown) for detecting the amount of rotation of the suction chuck 8o can be provided. Such detection means can be composed of an angle scale fixed to the sliding table 78 and a photoelectric detector fixed to the suction chuck 80. Linear scales 58 and 68 in the first and second detection means 52 and 54 described above
Similarly, angular scales that can be made of a material with a coefficient of linear expansion of 10 x 10"7/°C or less in the temperature range -20 to 100°C may be arranged at intervals of, for example, 0.1 degree. A large number of detected lines having a width of 0.1 degrees are formed, and the detector generates a pulse signal in response to the detection of such detected lines, and therefore generates a pulse signal every time the suction chuck 80 rotates by 0.1 degree. and supplies such a pulse signal to the control means 90.

After said initial positioning, the drive source 34 is actuated and the secondary support base 8 of the support means 4 and thus the cutting blade 48 is activated.
can be processed to a predetermined working position. The amount of vertical movement of the sub-support base 8 is detected by the second detection means 54, so that the vertical movement of the sub-support base 8 is performed with sufficient precision.

Next, the drive source 50 is activated to rotate the rotary shaft 42, and thus the cutting blade 48, for example, counterclockwise as viewed from the left in FIG. Then, the drive #86 is actuated and the slide 78 of the holding means 76 is activated.
Therefore, the suction chuck 80 and the wafer W held by the suction chuck 80 are moved backward in a direction perpendicular to the plane of the paper in FIG. Thus, the rotating cutting blade 48 acts on the wafer W to cut it along one of the first set of cutting lines CLx. When such cutting is completed, the drive source 86 is stopped and the movement of the slide 7 is stopped. Next, the drive source 34 is activated to raise the sub-support base 8 of the support means 4 to a predetermined position, and thus the cutting blade 48 cuts the wafer W.
It is raised to a non-operating position where it does not interfere with the Thereafter, the drive source 86 is activated to move the slide table 78, and thus the suction chuck 8° and the wafer W suctioned thereto.
In FIG. 1, it is moved forward in a direction perpendicular to the plane of the paper and back to its original position. Then, the drive i#22 is actuated to move the support base 6 of the support means 4, and therefore the cutting blade 48, in the left-right direction in FIG. They are sent on a so-called discount basis. The values of the intervals Px and py are determined in advance by the control means 9.
0 and stored in the storage means 92 (FIG. 2) built in the control means 90. Thereafter, the cutting process as described above is performed again, and the wafer W is cut along the next one of the first set of cutting lines CLx.

When the wafer W is cut along all of the first set of cutting lines CLx as described above, the drive source 88 is activated to rotate the suction chuck 80 and the wafer W held thereon by 90 degrees. Thus, the second set of cutting lines CLy present on the surface of the wafer W are made to extend in a direction perpendicular to the paper plane in FIG. Further, the drive m22 is activated and the support base 6
Therefore, the cutting blade 48 is moved by a predetermined amount in the left-right direction in FIG. 1, and thus the position of one of the second set of cutting lines CLy in the left-right direction in FIG. are aligned in the left-right direction. After that, the first set of cutting lines C
Similarly to the case of Lx, the second set of cutting lines CLy
The wafer W is cut along.

<Example> Cutting into a silicon wafer was carried out as follows using a precision cutting device as shown in FIG. 1.

(1) For the purpose of reducing the generation of errors in indexing due to thermal expansion of the support member 10, the drive source 50
(2) Then, the silicon wafer W was cut in the manner described above. The silicon wafer W used had a diameter of 5 inches and a thickness of 500 μm. In such a wafer W, there are 24 cutting lines CLx in the first set, and the interval Px
is 5, the width of the cutting line CLx itself is 40 μm,
The second set of cutting lines CLy also has 24 lines, and the interval py is 5.
The width of the cutting line CLy itself was 40 μm. The cutting blade 48 used was made of diamond abrasive grain and had a thickness of 18 μm. The cutting depth was set at 250 μm.

(3) After cutting 60 wafers W after starting cutting the wafers W (3 hours and 10 minutes after starting cutting the wafers W), the first sampling sea urchin, -
A first sampling cut was performed along the first set of cutting lines CLx of SWI. In such sampling cutting, the dummy wafer 8 is actually cut once by the cutting blade 48, and the cutting position on the dummy wafer is observed by an optical detection means, and thus the actual position of the cutting blade 48 in the left-right direction in FIG. confirmed. Based on this confirmation, the initial positioning of the first sampling wafer SWI is performed, that is, in the left-right direction in FIG. was aligned with the cutting blade 48 with sufficient precision. The index feeding of the cutting blade 48 in cutting the first sampling wafer SW1 was performed 23 times every 511 times based on the detection by the first detection means 52. The linear scale 58 in the first detection means 52 is made of crystallized glass sold by Nippon Electric Glass Co., Ltd. under the trade name "Neoceram GC-7/N-0", and has a temperature range of -20 to 100°C. The coefficient of linear expansion was 0.6XIO-7/''C.

Actual cutting positions and cutting lines CLx for the 1st to 24th cutting in the first sampling wafer SWI
The deviation from each center line was measured using a microscope (300x magnification). The results were as shown by the solid line in the diagram of Figure 4-A. It is displayed in the 4th interval.

(4) Next, after cutting 176 wafers W in the same manner as in (2) above (8 hours and 45 minutes after starting cutting of wafer/XW), in the same manner as in (3) above, Then, a second sampling cutting of the second sampling wafer SW2 was performed.

Actual cutting positions and cutting lines CLx for the first to 24th cutting on the second sampling wafer SW2
The results of measuring the deviation from each center line in the same manner as in (3) above are as shown by the solid line in Figure 4-B.
- <Comparative Example> For comparison, the linear scale 58 in the first detection means 52 was made of soda zinc glass and was heated at -20 to 100°C.
The coefficient of linear expansion in the temperature range is approximately 8 x 10-7/
The first sampling cut and the second sampling cut were performed in exactly the same manner as in the above example, except that a linear scale in degrees Celsius was replaced. Then, when the deviation between the actual cutting position and the center line of each of the cutting lines CLx in the first sampling wafer SWI and the second sampling wafer SW2 was measured, it was found that
It was as shown by the broken line in Figure A and Figure 4-B.

Comparatively considering the solid line showing the results of the example and the broken line showing the results of the comparative example in Figures 4-A and 4-B,
According to the present invention, by using a linear scale 58 made of a material with a linear expansion coefficient of less than 10XIO-'/°C in the temperature range of -20 to 100°C, it is possible to eliminate the need for incorporating an expensive temperature rate control system. It is clear that the errors in the output are significantly reduced.

[Brief explanation of drawings]

FIG. 1 is a side view, partially in cross section, of an example of a precision cutting device constructed according to the present invention. 2 is a simplified block diagram showing control means of the precision cutting device of FIG. 1; FIG. FIG. 3 is a plan view showing the surface of a semiconductor wafer cut by the precision cutting device of FIG. 1; FIG. 4-A and FIG. 4-B are diagrams showing indexing errors in the example and the comparative example. 4...Support means 6...Movable support base 8...Movable sub-support base 10...Support member 42...Rotary shaft 48...Cutting blade (operating element) 52...No. 1 detection means 54...Second detection means 58 and 68...Linear scale 76...Holding means 78...Sliding table 80...Suction chuck W...Semiconductor wafer (object) Patent Applicant Disco Co., Ltd. Agent Patent Attorney Takashi Ono Pure Patent Attorney Tadaaki Kishimoto Figure 2 qO Figure 3 Procedural Amendment August 13, 1986 Commissioner of the Patent Office Black 1) Toshio Akira 1, Display of the case 1986 Patent Application No. 98211 2 Name scale of the invention and precision device including the same (corrected today) 3 Person making the amendment Relationship to the case Patent applicant address 2-14 Higashikojitani, Ota-ku, Tokyo Number 3 Name DISCO Co., Ltd. 40 Agent ◎105 Address 1-1-21 Nishi-Shinbashi, Minato-ku, Tokyo; -1-5
-1--Japan Sake Brewery Hall 4th floorTelephone 03(591)7239
;' Name (7517) Patent attorney Hisashi Ono Junnie, -5, Date of amendment order Showa year, month, day (shipment date)
Voluntary action 6. Number of inventions increased by amendment 17. Column for title of invention, scope of claims and detailed explanation of invention in the specification to be amended 8. Contents of amendment CI) Column for title of invention Amendment (11) The description in the title of the invention column of the specification is corrected as follows: r scale and precision device including the same. (II) Amendment to the claims column (1) Patent in the description The statement in the claims column is corrected as follows: 1. Main The claim comprises a holding means for holding an object, a supporting means for supporting an actuating element, and a detecting means, and the holding means comprises: At least one of the support means is movable in a predetermined direction, and the detection means includes a scale having a large number of lines to be detected and a detector for detecting the lines to be detected on the scale; In a precision device for detecting the amount of movement of one of the means and the supporting means in the predetermined direction, the scale of the detecting means has an absolute value of linear expansion coefficient of 1 in the temperature range of -20 to 100°C.
A precision device characterized in that it is made of a material with a diameter of 0 x 10-7/"C or less. A precision device according to claim 1, wherein the scale of the detection means is made of special glass. (II) Amendment to the Detailed Description of the Invention Column <1) In lines 6 to 8 of page 2 of the specification, the phrase ``The present invention relates to...'' was replaced with the following: Correct as shown. The present invention relates to a scale capable of reducing errors caused by temperature changes in a precision device, and a precision device including such a scale. J (2) From the 4th line from the bottom of the 4th page to the 3rd line of the 5th page, the statement ``The present invention is...'' is corrected as follows. The present invention has been made in view of the above facts, and its main purpose is to reduce the above-mentioned errors in precision equipment such as the precision cutting equipment without the need to incorporate an expensive temperature control system. . ” (3) On page 8, lines 1 to 13, “Thus,
... will be provided. '' should be corrected as follows: ``Thus, according to the present invention, the absolute value of the coefficient of linear expansion in the temperature range of -20 to 100''C is 10 x 10
There is provided a scale for precision equipment, characterized in that it is made of a material of -77"c or less. According to the present invention, a holding means for holding an object and an operating element are provided. It comprises a support means for supporting and a detection means, at least one of the holding means and the support means is movable in a predetermined direction, and the detection means includes a scale having a large number of lines to be detected and a detection means of the scale. In a precision device that includes a detector for detecting the detection line and detects the amount of movement of one of the holding means and the support means in the predetermined direction, the scale of the detection means is −20 to A precision device is provided, characterized in that it is made of a material whose absolute value of linear expansion coefficient in a temperature range of 100° C. is 10×10 −′/”C or less. j or more

Claims (1)

[Claims] 1. A holding means for holding an object, a support means for supporting an actuation element, and a detection means, and at least one of the holding means and the support means is arranged in a predetermined direction. The detection means includes a scale having a large number of lines to be detected and a detector for detecting the lines to be detected on the scale, and the detection means includes a scale having a large number of lines to be detected, and a detector for detecting the lines to be detected on the scale, and In a precision device that detects the amount of movement in a direction, the scale of the detection means is formed from a material whose absolute value of linear expansion coefficient in the temperature range of -20 to 100°C is 10 x 10^-^7/°C or less. A precision device characterized by: 2. The precision device according to claim 1, wherein the scale of the detection means is made of special glass.