JPS625333B2 - - Google Patents

Info

Publication number
JPS625333B2
JPS625333B2 JP54065047A JP6504779A JPS625333B2 JP S625333 B2 JPS625333 B2 JP S625333B2 JP 54065047 A JP54065047 A JP 54065047A JP 6504779 A JP6504779 A JP 6504779A JP S625333 B2 JPS625333 B2 JP S625333B2
Authority
JP
Japan
Prior art keywords
slit
window
pattern
scanning
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54065047A
Other languages
Japanese (ja)
Other versions
JPS55157230A (en
Inventor
Mitsuyoshi Koizumi
Nobuyuki Akyama
Yoshimasa Ooshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6504779A priority Critical patent/JPS55157230A/en
Publication of JPS55157230A publication Critical patent/JPS55157230A/en
Publication of JPS625333B2 publication Critical patent/JPS625333B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Description

【発明の詳細な説明】 本発明は縮小投影式マスクアライナなどに用い
られるパターン位置検出装置に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pattern position detection device used in a reduction projection type mask aligner or the like.

例えば従来の縮小投影式マスクアライナ等のパ
ターン位置検出装置は第1図に示すように構成さ
れている。即ちレチクル3の回路パターン3c
は、予め前の工程で露光してパターン形成されて
いるウエハ1のペレツト1a上の回路パターンと
正確に位置合わせした後水銀灯28、干渉フイル
タ27及びコンデンサレンズ25,26からなる
露光光源31から照射された露光光をコンデンサ
レンズ5により照射して投影レンズ4によつて縮
小投影されてウエハ1のペレツト1a上に焼付す
る必要がある。なお29は露光系である。このた
め、レチクル3上の位置合わせパターン3bとペ
レツト1a上の位置合わせパターン1bの位置ず
れを検出系30を用いて自動的に検出し、このず
れ量だけウエハステージ2を補正する方法を用い
る。
For example, a conventional pattern position detection device such as a reduction projection type mask aligner is configured as shown in FIG. That is, the circuit pattern 3c of the reticle 3
is precisely aligned with the circuit pattern on the pellet 1a of the wafer 1, which has been exposed and patterned in the previous step, and then irradiated with the exposure light source 31 consisting of a mercury lamp 28, an interference filter 27, and condenser lenses 25 and 26. It is necessary to irradiate the exposed light through a condenser lens 5, project it in a reduced size through a projection lens 4, and print it onto the pellet 1a of the wafer 1. Note that 29 is an exposure system. For this reason, a method is used in which the positional deviation between the alignment pattern 3b on the reticle 3 and the alignment pattern 1b on the pellet 1a is automatically detected using the detection system 30, and the wafer stage 2 is corrected by the amount of this deviation.

レチクル3は予めレチクルマーク3aを用いて
絶対変換となる鏡筒に位置合わせする。ウエハ照
明フアイバ15より射出された単色光は半透過鏡
10、対物レンズ6、ミラー7、合わせパターン
3bの透明部(窓)を通過し、投影レンズ4を通
過し、ウエハ合わせパターン1bで反射し、再び
投影レンズ4、ミラー7、対物レンズ6、リレー
レンズ11、及びミラー12を経て、ハ字型スリ
ツト22a及び22b、並びにコンデンサレンズ
23を経て、光電変換素子24に達する。
The reticle 3 is previously aligned with the lens barrel for absolute conversion using the reticle mark 3a. The monochromatic light emitted from the wafer illumination fiber 15 passes through the semi-transmissive mirror 10, the objective lens 6, the mirror 7, the transparent part (window) of the alignment pattern 3b, passes through the projection lens 4, and is reflected by the wafer alignment pattern 1b. , passes through the projection lens 4, mirror 7, objective lens 6, relay lens 11, and mirror 12 again, passes through the V-shaped slits 22a and 22b, and the condenser lens 23, and reaches the photoelectric conversion element 24.

またレチクル照明フアイバー14から射出した
単色光はコンデンサレンズ13、ミラー9、及び
ミラー8を経てレチクル合わせパターン3bで反
射し、ミラー7、対物レンズ6を経る。この照明
により第2図のようにレチクル合わせパターン3
bのハ字型窓の周辺(クローム蒸着部より成る)
は明るくなり、ハ字型窓の透明部に結像している
ウエハ合わせパターン1bの周辺部と明瞭に区別
が出来る。
Further, the monochromatic light emitted from the reticle illumination fiber 14 passes through the condenser lens 13, the mirror 9, and the mirror 8, is reflected by the reticle alignment pattern 3b, and passes through the mirror 7 and the objective lens 6. With this illumination, the reticle alignment pattern 3 is created as shown in Figure 2.
Around the V-shaped window in b (consisting of chrome deposited part)
becomes bright and can be clearly distinguished from the peripheral part of the wafer alignment pattern 1b, which is imaged on the transparent part of the V-shaped window.

スリツト走査部30aは、ベアリングガイド1
8により案内される走査板22、走査板22に固
定された光電式スケール(スリツトの走査量を検
出する検出手段)19、光電式スケール19の照
明に用いるランプ20、及びレンズ21、走査板
22上のハ字型スリツト22a,22b、走査板
22を駆動するガルバ16、並びにテコ17より
成る。
The slit scanning section 30a is connected to the bearing guide 1.
8, a photoelectric scale (detection means for detecting the scanning amount of the slit) 19 fixed to the scanning plate 22, a lamp 20 and a lens 21 used for illuminating the photoelectric scale 19, and a scanning plate 22. It consists of upper V-shaped slits 22a and 22b, a galvan 16 for driving the scanning plate 22, and a lever 17.

合わせパターン1bと3bの重畳像は対物レン
ズ6、リレーレンズ11により走査板22の位置
に結像するので、スリツト22a,22bを第2
図Aに示す状態から第2図B、第2図C、第2図
D、第2図EへX方向に連続的に移動走査するこ
とにより光電変換素子24の検出信号32は、第
2図Fに示すように、合わせパターン3bの窓の
端部とウエハパターン1bの位置を明暗信号によ
り検知する。
Since the superimposed image of the alignment patterns 1b and 3b is focused on the scanning plate 22 by the objective lens 6 and the relay lens 11, the slits 22a and 22b are
By continuously moving and scanning in the X direction from the state shown in FIG. 2B, FIG. 2C, FIG. 2D, and FIG. 2E from the state shown in FIG. As shown in F, the position of the edge of the window of the alignment pattern 3b and the wafer pattern 1b is detected by the brightness signal.

次に第3図にもとづいてレチクルパターン3b
とウエハパターン1bの位置ずれを抽出する方法
について説明する。即ち前述のレチクル照明によ
りレチクルパターン3bの窓の端部C,D,A,
Bは明るくなり、ウエハパターン1b周辺部と区
別される。C,D,A,Bの位置はこの検出信号
32の微分値の最大点(偏曲点)として求められ
る。またウエハパターン1bの左右のパターン中
心位置Wr,Weは各々の6μm線幅の段差パター
ン1b周辺部の信号の対称性の最も良い位置とし
て求められる。右側の窓3bの中心位置C+D/2を 計算し、△Xr=C+D/2−Wrを計算すればこれが右 側のパターンの位置ずれ量となる。同様に左側で
は△Xe=A+B/2−Weとなる。これよりx、y方 向のパターン1b,3bのずれ量△x,△yは以
下の式となる。
Next, based on FIG. 3, reticle pattern 3b is
A method for extracting the positional deviation of the wafer pattern 1b will be explained. That is, by the above-mentioned reticle illumination, the edges C, D, A of the window of the reticle pattern 3b,
B becomes brighter and can be distinguished from the peripheral area of wafer pattern 1b. The positions of C, D, A, and B are determined as the maximum points (deviation points) of the differential value of this detection signal 32. Further, the left and right pattern center positions Wr and We of the wafer pattern 1b are determined as the positions where the symmetry of the signals at the periphery of each step pattern 1b having a line width of 6 μm is the best. If the center position C+D/2 of the right window 3b is calculated and ΔXr=C+D/2−Wr is calculated, this becomes the positional shift amount of the right pattern. Similarly, on the left side, ΔXe=A+B/2−We. From this, the deviation amounts Δx and Δy of the patterns 1b and 3b in the x and y directions are expressed by the following equations.

△x=△Xr+△Xe/2、△y=△Xr−△Xe/
2 ここで第2図A〜Eに示すように、一方のスリ
ツト22aがパターン3b,1bを走査する時に
他方のスリツト22aがレチクル3bのクローム
蒸着部の明るい部分を走査するので、光電変換素
子24は両スリツト22aからの光が加えられ検
出される。一般に光電子増倍管などの光電変換素
子24は光レベルが強くなるとノイズが多くなる
特性を示すため、得られる検出信号は他方のスリ
ツト22aからの余分な光のためS/N比が著し
く低下し、パターン1b,3bの検出精度を低下
させる欠点を有する。また第4図に示すように合
わせパターン3bを線状パターン〓とした場合、
レチクル照明に影響されないけれども、合わせパ
ターン3bの周辺は透明であるため、ウエハパタ
ーン1bの周辺に異物35があるとスリツト22
a,22bが走査移動する時にスリツト22a,
22bからの明るさが不連続となり、第5図に示
すように光電変換素子24から出力される検出信
号に乱れを生じさせ、パターン1bの中心Wr,
Weの検出精度を著しく低下させる欠点を有す
る。
△x=△Xr+△Xe/2, △y=△Xr−△Xe/
2 As shown in FIGS. 2A to 2E, when one slit 22a scans the patterns 3b and 1b, the other slit 22a scans the bright part of the chrome-deposited part of the reticle 3b, so that the photoelectric conversion element 24 The light from both slits 22a is added and detected. In general, the photoelectric conversion element 24 such as a photomultiplier tube exhibits a characteristic that noise increases as the light level increases, so the S/N ratio of the obtained detection signal is significantly reduced due to the excess light from the other slit 22a. , has the disadvantage of lowering the detection accuracy of patterns 1b and 3b. Moreover, when the alignment pattern 3b is a linear pattern as shown in FIG.
Although not affected by reticle illumination, since the area around the alignment pattern 3b is transparent, if there is a foreign object 35 around the wafer pattern 1b, the slit 22
When the slits 22a and 22b scan and move, the slits 22a and 22b
The brightness from 22b becomes discontinuous, causing disturbance in the detection signal output from the photoelectric conversion element 24 as shown in FIG.
This method has the disadvantage of significantly reducing We detection accuracy.

本発明の目的は上記従来技術の欠点を無くし、
S/N比の良い検出信号を得て高精度の位置検出
ができるようにしたパターン位置検出装置を提供
するにある。
The purpose of the present invention is to eliminate the drawbacks of the above-mentioned prior art,
It is an object of the present invention to provide a pattern position detection device which can obtain a detection signal with a good S/N ratio and perform highly accurate position detection.

即ち本発明はパターンの両面にしや光板を設
け、一方のスリツトがパターンを走査中に、他方
のスリツトはしや光板上を走査するようにして、
他方のスリツトからの余分な光を遮断して光電変
換素子から得られる検出信号のS/N比を著しく
改善して高精度にパターンの位置を検出するよう
に構成したことを特徴とするものである。
That is, in the present invention, the slits are provided with light plates on both sides of the pattern, and while one slit is scanning the pattern, the other slit is scanning over the edges and the light plate.
It is characterized by being configured to block excess light from the other slit and significantly improve the S/N ratio of the detection signal obtained from the photoelectric conversion element, thereby detecting the position of the pattern with high precision. be.

以下本発明を図に示す実施例にもとづいて具体
的に説明する。第6図は本発明のパターン位置検
出装置の一実施例を示した構成図である。即ち3
3は、走査板22に形成されたハ字型スリツト2
2a、及び22bの配置に相応しい大きさのV字
形切欠き34を形成した遮光板で、スリツト走査
部30aの走査板22の上方に固定して設置され
ている。(上方からみた状態は第7図のようにな
る。)その他は第1図と同じように構成されてい
る。然るにガルバ16を作動させてテコ17によ
り走査板22を往復移動させて走査させると、光
電変換素子24から検出される映像信号は第8図
に示す様に、出力レベルは約半分に減少すると共
にD−A区間では遮光板33により遮光されて低
レベルに変化するがS/N比は著しく向上する。
特に第2図Fに示す従来の映像信号と比較してみ
るとその効果の顕著性は明らかである。また遮光
板33を設置すると、第4図に示すように異物3
5があつてもこの異物35の光像を覆うため、こ
の影響をなくすことができ映像信号に乱れを生じ
させることも防止できる。
The present invention will be specifically described below based on embodiments shown in the drawings. FIG. 6 is a block diagram showing an embodiment of the pattern position detection device of the present invention. That is, 3
3 is a V-shaped slit 2 formed in the scanning plate 22;
This light shielding plate has a V-shaped cutout 34 of a size suitable for the arrangement of the slit scanning portion 30a and the light shielding plate 22b, and is fixedly installed above the scanning plate 22 of the slit scanning unit 30a. (The state seen from above is as shown in FIG. 7.) The rest of the structure is the same as in FIG. 1. However, when the galvan 16 is activated and the scanning plate 22 is reciprocated and scanned by the lever 17, the output level of the video signal detected from the photoelectric conversion element 24 is reduced to about half as shown in FIG. In the D-A section, the light is blocked by the light shielding plate 33 and changes to a low level, but the S/N ratio is significantly improved.
In particular, when compared with the conventional video signal shown in FIG. 2F, the remarkableness of this effect is clear. Furthermore, when the light shielding plate 33 is installed, foreign objects 3 are removed as shown in FIG.
5, the optical image of this foreign object 35 is covered, so this influence can be eliminated and disturbances in the video signal can also be prevented.

上記実施例では遮光板33を走査板22の上方
に固定設置したがレチクル3上の位置合わせパタ
ーン3bからコンデンサレンズ23を結ぶ光軸上
のどこに設置してもかまわない。
In the above embodiment, the light shielding plate 33 is fixedly installed above the scanning plate 22, but it may be installed anywhere on the optical axis connecting the alignment pattern 3b on the reticle 3 to the condenser lens 23.

以上説明したように本発明によればS/N比向
上がはかれると共に異物に影響されないこととな
り、検出精度0.1μm(ウエハ面上換算)を得る
ことが可能となつた。
As explained above, according to the present invention, the S/N ratio is improved and the detection accuracy is not affected by foreign matter, making it possible to obtain a detection accuracy of 0.1 μm (converted on the wafer surface).

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の例えば縮小投影式マスクアライ
ナ等に用いられているパターン位置検出装置を示
した概略構成図、第2図A〜Eは第1図に示す装
置においてパターンとスリツトとの関係を示した
図、第2図Fは第1図に示す装置において光電変
換素子が検出する映像信号波形を示した図、第3
図は第1図に示す装置においてパターンの位置を
検出する方法を説明するための図、第4図は第1
図に示す装置においてレチクルの位置合せパター
ンとして線状パターンを用い、異物が存在する場
合を示した図、第5図は第4図に示すパターンを
走査して光電変換素子が検出する映像信号波形を
示した図、第6図は本発明に係るパターン位置検
出装置の一実施例を示した概略構成図、第7図は
第6図に示す遮光板の上方より見た平面図、第8
図は第6図及び第7図に示す装置において光電変
換系が検出する映像信号波形を示した図である。 符号の説明、1b……パターン、3b……パタ
ーン、19……光電式スケール、22……走査
板、22a,22b……ハ字型スリツト、24…
…光電変換素子、33……遮光板。
FIG. 1 is a schematic configuration diagram showing a conventional pattern position detection device used in a reduction projection mask aligner, etc., and FIGS. 2A to 2E show the relationship between patterns and slits in the device shown in FIG. Figure 2F is a diagram showing the video signal waveform detected by the photoelectric conversion element in the device shown in Figure 1;
The figure is a diagram for explaining the method of detecting the position of a pattern in the apparatus shown in Figure 1, and Figure 4 is a diagram for explaining the method for detecting the position of a pattern in the
A diagram showing a case where a linear pattern is used as a reticle alignment pattern in the apparatus shown in the figure, and a foreign object is present. Figure 5 is a video signal waveform detected by a photoelectric conversion element by scanning the pattern shown in Figure 4. FIG. 6 is a schematic configuration diagram showing an embodiment of the pattern position detection device according to the present invention, FIG. 7 is a plan view of the light shielding plate shown in FIG.
The figure shows a video signal waveform detected by the photoelectric conversion system in the apparatus shown in FIGS. 6 and 7. Explanation of symbols, 1b...Pattern, 3b...Pattern, 19...Photoelectric scale, 22...Scanning plate, 22a, 22b...V-shaped slit, 24...
...Photoelectric conversion element, 33... Light shielding plate.

Claims (1)

【特許請求の範囲】[Claims] 1 交叉する方向に向いた少なくとも1対の線状
パターンの像を通すべく上記方向と同一方向を向
いて一対の窓状スリツトを形成し、且つ該窓状ス
リツトが配列された一方向に往復走査するスリツ
トを設け、該スリツトの走査量を検出する検出手
段を設け、上記スリツトを往復走査し、上記一方
の線状パターンの像を上記一方の窓状スリツトが
通す際、他方の窓状スリツトを通過する光像を遮
蔽すべく、上記窓状スリツトの両走査端に位置固
定された遮光板を設け、上記スリツトを往復走査
して上記遮光板によつて遮蔽されない各窓状スリ
ツトを通つた一対の線状パターンの像を集光する
コンデンサレンズを設け、該コンデンサレンズに
より集光された像を受光して映像信号に変換する
一つの光電変換素子を設け、該光電変換素子から
得られる映像信号と上記検出手段から検出される
スリツトの走査量とから上記パターンの位置を検
出することを特徴とするパターン位置検出装置。
1 A pair of window-like slits are formed facing in the same direction as the above-mentioned direction so that images of at least one pair of linear patterns facing in intersecting directions pass through, and reciprocating scanning is performed in one direction in which the window-like slits are arranged. A detection means is provided for detecting the scanning amount of the slit, and the slit is scanned back and forth, and when the image of the one linear pattern is passed through the window-like slit, the other window-like slit is In order to block the passing light image, fixed position shielding plates are provided at both scanning ends of the window-like slit, and a pair of light shielding plates are provided at both scanning ends of the window-like slit, and a pair of light-shielding plates are scanned back and forth through the slit to pass through each window-like slit that is not blocked by the light shielding plate. A condenser lens is provided to condense an image of a linear pattern, and a photoelectric conversion element is provided to receive the image condensed by the condenser lens and convert it into a video signal, and a video signal obtained from the photoelectric conversion element is provided. and a scanning amount of the slit detected by the detection means to detect the position of the pattern.
JP6504779A 1979-05-28 1979-05-28 Pattern position detector Granted JPS55157230A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6504779A JPS55157230A (en) 1979-05-28 1979-05-28 Pattern position detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6504779A JPS55157230A (en) 1979-05-28 1979-05-28 Pattern position detector

Publications (2)

Publication Number Publication Date
JPS55157230A JPS55157230A (en) 1980-12-06
JPS625333B2 true JPS625333B2 (en) 1987-02-04

Family

ID=13275649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6504779A Granted JPS55157230A (en) 1979-05-28 1979-05-28 Pattern position detector

Country Status (1)

Country Link
JP (1) JPS55157230A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57138134A (en) * 1981-02-20 1982-08-26 Nippon Kogaku Kk <Nikon> Positioning device
JPS59172724A (en) * 1983-03-22 1984-09-29 Canon Inc Alignment and equipment for the same
JPH05234845A (en) * 1991-05-08 1993-09-10 Hitachi Ltd Reduction-type projection aligner

Also Published As

Publication number Publication date
JPS55157230A (en) 1980-12-06

Similar Documents

Publication Publication Date Title
US5218193A (en) Double-focus measurement apparatus utilizing chromatic aberration by having first and second bodies illuminated respectively by a single wavelength ray and a ray having a plurality of wavelengths
US4870452A (en) Projection exposure apparatus
KR950007343B1 (en) Reverse dark field alignment systems for scanning lithographic aligner
JPH0140491B2 (en)
JPS593791B2 (en) Object image recognition method
JPH02114154A (en) Reticle inspection and apparatus therefor
JPH0445512A (en) Optical device for projector
US4614432A (en) Pattern detector
JPH0441483B2 (en)
JPS625333B2 (en)
JPS6315739B2 (en)
JPH04146437A (en) Method and device for inspecting mask for phase shift
JP3106544B2 (en) Position detection device
JP3410013B2 (en) Defect or foreign matter inspection method and apparatus
JPH07240367A (en) Projection aligner
JPH0525167B2 (en)
JP3163669B2 (en) Detection apparatus, exposure apparatus, and exposure method
JPH0612752B2 (en) Projection type alignment method and apparatus
JP3327627B2 (en) Original exposure plate and projection exposure apparatus using the same
JPH0344242B2 (en)
JPH01259244A (en) Foreign matter detection system
JPH05198475A (en) Projection aligner
JP3218475B2 (en) Exposure method and exposure apparatus
JPS63153821A (en) Alignment device
JPS6232612A (en) Alignment mark