JPS6250160A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS6250160A JPS6250160A JP60192216A JP19221685A JPS6250160A JP S6250160 A JPS6250160 A JP S6250160A JP 60192216 A JP60192216 A JP 60192216A JP 19221685 A JP19221685 A JP 19221685A JP S6250160 A JPS6250160 A JP S6250160A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- glaze layer
- thermal head
- thermal
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、厚膜形サーマルヘッドに関し、特に、駆動
電力の低減を図った構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thick film thermal head, and particularly to a structure that reduces driving power.
従来の厚膜形サーマルヘッドにおいては第３図に示すよ
うに、厚さ約ＩＨのアルミナセラミックなどの絶縁性基
板（１）の上面に、厚さ５０μｍ程度のグレーズ層（２
）を形成し、その面上に、無機金ベーストをヌクリーン
印刷法により厚さ約３μｍの金薄膜を形成したのち、フ
ォトエツチング法により所定パターンの電極導体（８ａ
）、 （８ｂ）を形成し、これらの電極導体Ｃ３ａ）、
（８ｂ）上に抵抗体ペーストを用いて印刷し、焼成し
て厚さ約１０μｍの抵抗体（４）を形成する。In a conventional thick-film thermal head, as shown in Fig. 3, a glaze layer (2 2
), and on its surface, a thin gold film with a thickness of about 3 μm was formed using an inorganic gold base using the Nuclean printing method, and then a predetermined pattern of electrode conductors (8a
), (8b) and these electrode conductors C3a),
A resistor paste is printed on (8b) and fired to form a resistor (4) with a thickness of about 10 μm.
さらに、抵抗体（４）を覆ってガラスペーストを塗布し
、焼成し、厚さ８μｍ程度の保護層を形成し電極導体（
ａａ）、 （ｓｂ）間に電圧を印加して抵抗体（４）に
記録電流を通電し、抵抗体（４）に発生するジューμ熱
が熱伝導により保護層（５）が昇温し、これに当接する
感熱紙を加熱し、発色させて印字するように構成されて
いる。Furthermore, a glass paste is applied covering the resistor (4) and fired to form a protective layer with a thickness of about 8 μm, and the electrode conductor (
A voltage is applied between aa) and (sb) to pass a recording current through the resistor (4), and the heat generated in the resistor (4) raises the temperature of the protective layer (5) due to thermal conduction. It is configured to heat the thermal paper that comes into contact with it, color it, and print.
サーマルヘッドの保護層（５ンの表面温度θは、抵抗体
（４）に発生する熱量Ｑと、抵抗体（４）、保護層（５
）、グレーズ層（２）の熱抵抗Ｒｔｈ と、電極導体
（８ａ）。The surface temperature θ of the protective layer (5) of the thermal head is determined by the amount of heat Q generated in the resistor (4), the resistor (4), and the protective layer (5).
), the thermal resistance Rth of the glaze layer (2), and the electrode conductor (8a).
（８ｂ）をとおして逃げる熱量とで定まり、その表面温
度の変化特性は、第４図に示すようになる。(8b), and the change characteristics of the surface temperature are as shown in FIG.
図中、θ０は最高温度で、温度上昇曲線および温度下降
曲線は、それぞれ次式の■、■であられされる。In the figure, θ0 is the maximum temperature, and the temperature increase curve and temperature decrease curve are expressed by the following equations (1) and (2), respectively.
ｔ２
θ＝θ ０００
０１．■Ｃ−Ｒｔｈ
図中、ｔｌ は通電開始時点からの時間、 ｔ２
は最高温度θ０に達した時刻ｔｏからの時間で１式中の
Ｃ−Ｒｔｈ −ビは、潤度上昇および下降特性を決定
し、抵抗体（４）、保護層（５）、およびグレーズ層（
２）は、熱容量が小さく、熱抵抗Ｒｔｈ が大きいこ
とが望ましい。t2 θ=θ 000
01. ■C-Rth In the figure, tl is the time from the start of energization, t2
is the time from time to when the maximum temperature θ0 is reached, and C-Rth-bi in formula 1 determines the moisture increase and decrease characteristics, and the resistance element (4), the protective layer (5), and the glaze layer (
For 2), it is desirable that the heat capacity is small and the thermal resistance Rth is large.
第５図は上記■、■式のθ、 Ｑ、 Ｒｔｈ、（３の関
係を示す図で、縦軸に愚答ｉｃ、横軸に熱抵抗Ｒｔｂ
をとり、？が一定の場合を実線で、また。Figure 5 is a diagram showing the relationship between θ, Q, Rth, and
Take? The solid line indicates the case where is constant.
θが一定としたときに必要な＃！％ｆｆ１Ｑを破線で示
しておシ、？、Ｑは共に横軸に近いほど値が小さい。Required # when θ is constant! %ff1Q is shown with a broken line? , Q have smaller values closer to the horizontal axis.
従来のサーマルヘッドの印字部分は、第５図中に黒点で
示したよりな愚答ｆｆ１Ｏと熱抵抗Ｒｔｈ とを有し
ているが、駆動電力の小電力化を図るうえで、さらＫｐ
ｐ４容量Ｃが低く、かつ、Ｓ抵抗Ｒｔｈの大きいサーマ
ルヘッドの実現が望まれていた。The printing part of the conventional thermal head has a higher thermal resistance ff1O and a thermal resistance Rth as shown by the black dots in FIG.
It has been desired to realize a thermal head with a low p4 capacitance C and a large S resistance Rth.
この発明はかかる要請の実現を目的としてなされたもの
で、熱容量Ｃが小さく、かつ、熱抵抗Ｒｔｈ が大き
く、シたがって、駆動電力が小さくてすむサーマルヘッ
ドを得ることを目的とする。The present invention has been made to meet these demands, and aims to provide a thermal head that has a small heat capacity C and a large thermal resistance Rth, and therefore requires less driving power.
この発明は、抵抗体もしくはグレーズ層のうち少なくと
も一方を多孔質体で形成したものである。In this invention, at least one of the resistor and the glaze layer is formed of a porous material.
抵抗体もしくはグレーズ層を多孔質体で形成す・ると、
サーマルヘッドの印字部分の熱容量Ｃが小さくなるとと
もに、その熱抵抗Ｒｔｈ が大となシ。When the resistor or glaze layer is formed from a porous material,
As the thermal capacity C of the printing part of the thermal head becomes smaller, its thermal resistance Rth becomes larger.
Ｃ−Ｒｔｈ＝’２が小さくなシ、これにともなって、一
定温度θに加熱するのに要する熱エネルギＱも小さくな
る。As C-Rth='2 becomes smaller, the thermal energy Q required for heating to a constant temperature θ also becomes smaller.
第１図はこの発明の一実施例の一部拡大断面図で、（４
ａ）は微小な気泡を含む多孔質に形成された抵抗体であ
る。FIG. 1 is a partially enlarged cross-sectional view of an embodiment of the present invention.
A) is a porous resistor containing minute air bubbles.
このような抵抗体（４ａ）は、例えば、適量のトリクレ
ンを混入し念抵抗ペーストをグレ″−ズ層（２）上に印
刷し、焼成することによ＃）形成することができる。Such a resistor (4a) can be formed, for example, by mixing an appropriate amount of trichloride, printing a resistive paste on the glaze layer (2), and firing the paste.
この実施例のサーマルヘッドの熱容量Ｃおよび熱抵抗Ｒ
ｔｈ は、第５図中に白点で示したようになυ、抵抗
体（４ａ）の熱容量Ｃが小さく、かつ。Thermal capacity C and thermal resistance R of the thermal head in this example
th is υ as shown by the white dot in FIG. 5, and the heat capacity C of the resistor (4a) is small.
熱抵抗孔ｔｈ が大きいので、速やかに温度が上昇し
、これに伴って保護層（５）も昇温するので、゛駆動電
力の低減が図れる。Since the thermal resistance hole th is large, the temperature rises quickly, and the temperature of the protective layer (5) also rises accordingly, so that the driving power can be reduced.
第２図はこの発明の他の実施例の一部拡大断面図で、
（２ａ）は微小な気泡を含む多孔質に形成されたグレー
ズ層である。FIG. 2 is a partially enlarged sectional view of another embodiment of the invention.
(2a) is a porous glaze layer containing minute air bubbles.
このようなグレーズ層（２ａ）は１例えば、多孔質ガラ
スを形成するガラスペーストを、絶縁性基板（１）の上
面に塗布し、焼成することで形成できる。Such a glaze layer (2a) can be formed, for example, by applying a glass paste forming porous glass to the upper surface of the insulating substrate (1) and baking it.
この実施例のサーマルヘッドは、グレーズ層（２ａ）の
断熱性が大きくなるので、サーマルヘッドの印字部分、
即ち抵抗体（４）、保護層（５）、７に極導体（８ａ）
、（８ｂ） ｆ：含む部分の熱容量Ｃが小さくなシ、ま
た。熱抵抗孔ｔｈ が大さくなったのと同じ効果を奏
し、駆動電力の低減を実現することができる。In the thermal head of this embodiment, the thermal insulation of the glaze layer (2a) is large, so the printed part of the thermal head,
That is, the resistor (4), the protective layer (5), and the polar conductor (8a) at 7.
, (8b) f: The heat capacity C of the containing part is small. This has the same effect as when the thermal resistance hole th is made larger, and a reduction in driving power can be realized.
なお、上記実施例では、抵抗体（４ａ）もしくはグレー
ズ層（２ａ） ’ｅ多孔質化した例を示し念が。It should be noted that in the above embodiments, examples are shown in which the resistor (4a) or the glaze layer (2a) is made porous.
抵抗体およびグレーズ層の双方を多孔質化してもよい。Both the resistor and the glaze layer may be made porous.
この発明は、抵抗体もしくはグレーズ層のうち少なくと
も一方を多孔質体に形成したサーマルヘッドであるから
、印字部分の熱容量Ｃを小さく。Since this invention is a thermal head in which at least one of the resistor and the glaze layer is made of a porous material, the heat capacity C of the printed portion is small.
かつ、熱抵抗Ｒｔｈ ’に大きく構成できるので、駆
動電力の低減が図れる効果が得られる。In addition, since the thermal resistance Rth' can be configured to be large, the effect of reducing driving power can be obtained.
第１図はこの発明の一部拡大断面図、第２図はこの発明
の他の実施例の一部拡大断面図、第３図は従来の厚膜形
サーマルヘッドの一部拡大断面図。
第４図は保護層の表面温度の上昇特性と下降特性を示す
図、第５図はサーマルヘッドの印字部分の熱容量Ｃと熱
抵抗Ｒｔｈ の分布を示す図である。
（１）・・・絶縁性基板、 （２） ｐ （２ａ）・・
・グレーズ層、（４）。
（４ａ）・・・抵抗体。
なお１図中、同一符号はそれぞれ同一、または相当部分
を示す。FIG. 1 is a partially enlarged sectional view of the present invention, FIG. 2 is a partially enlarged sectional view of another embodiment of the invention, and FIG. 3 is a partially enlarged sectional view of a conventional thick film thermal head. FIG. 4 is a diagram showing the rise and fall characteristics of the surface temperature of the protective layer, and FIG. 5 is a diagram showing the distribution of heat capacity C and thermal resistance Rth of the printing portion of the thermal head. (1)...Insulating substrate, (2) p (2a)...
- Glaze layer, (4). (4a)...Resistor. Note that in FIG. 1, the same reference numerals indicate the same or corresponding parts.
Claims (1)
に、抵抗体とこの抵抗体に電気的に接続して形成されて
いる電極導体とを有してなるサーマルヘッドにおいて、
上記抵抗体もしくはグレーズ層のうち少なくとも一方を
多孔質体で形成したことを特徴とするサーマルヘッド。(1) A thermal head comprising a resistor and an electrode conductor formed electrically connected to the resistor on a glaze layer formed on the upper surface of an insulating substrate,
A thermal head characterized in that at least one of the resistor and the glaze layer is made of a porous material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60192216A JPS6250160A (en) | 1985-08-29 | 1985-08-29 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60192216A JPS6250160A (en) | 1985-08-29 | 1985-08-29 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6250160A true JPS6250160A (en) | 1987-03-04 |
Family
ID=16287591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60192216A Pending JPS6250160A (en) | 1985-08-29 | 1985-08-29 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6250160A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0232864A (en) * | 1988-07-22 | 1990-02-02 | Matsushita Electric Ind Co Ltd | Thermal head |
-
1985
- 1985-08-29 JP JP60192216A patent/JPS6250160A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0232864A (en) * | 1988-07-22 | 1990-02-02 | Matsushita Electric Ind Co Ltd | Thermal head |
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