JPS6248911B2 - - Google Patents
Info
- Publication number
- JPS6248911B2 JPS6248911B2 JP55071167A JP7116780A JPS6248911B2 JP S6248911 B2 JPS6248911 B2 JP S6248911B2 JP 55071167 A JP55071167 A JP 55071167A JP 7116780 A JP7116780 A JP 7116780A JP S6248911 B2 JPS6248911 B2 JP S6248911B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- metal ring
- oxide film
- metal
- inner diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 45
- 239000002184 metal Substances 0.000 claims description 43
- 238000007789 sealing Methods 0.000 claims description 19
- 239000006060 molten glass Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- 239000003082 abrasive agent Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Joining Of Glass To Other Materials (AREA)
- Light Receiving Elements (AREA)
Description
【発明の詳細な説明】
本発明は金属環の内径部にガラスを気密に封着
する金属対ガラス封着体の製造方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a metal-to-glass sealed body in which glass is hermetically sealed to the inner diameter of a metal ring.
例えば、光半導体用キヤツプは第１図に示すよ
うにFeやコバール等の金属を切削加工した金属
環１の内周面ａに透明なガラス２を封着した構造
を有し、そしてこのキヤツプはフオトトランジス
タやフオトダイオード、Cdsなどの光半導体ペレ
ツト３をマウントしたステム４上に気密封止され
る。このようなキヤツプに於けるガラス２には外
部からの光が内部へ、或は光半導体ペレツト３で
発光した光が外部へと透過するため、ガラス２の
光透過率が光半導体装置の特性を大きく左右す
る。 For example, as shown in FIG. 1, an optical semiconductor cap has a structure in which a transparent glass 2 is sealed to the inner peripheral surface a of a metal ring 1 made by cutting a metal such as Fe or Kovar. It is hermetically sealed on a stem 4 on which an optical semiconductor pellet 3 such as a phototransistor, photodiode, or CDS is mounted. In such a cap, the light from the outside passes through the glass 2 inside the cap, or the light emitted by the optical semiconductor pellet 3 passes through the glass 2 to the outside, so the light transmittance of the glass 2 determines the characteristics of the optical semiconductor device. greatly influences.
ところで、上記キヤツプのような金属対ガラス
封着体は従来では次の各工程で製造していた。ま
ず第２図に示すように、封着治具５の上面に形成
した封着穴６に金属環１を嵌挿する。この金属環
１は溶融ガラスとのなじみ性を良くするために予
じめ全表面に酸化膜７が被着形成され、又封着治
具５は溶融ガラスが接着しないグラフアイトで形
成されている。又、封着穴６は金属環１の外径d1
と略同一の内径の穴で、そのフラツトな底面ｂ上
に金属環１が載置される。次に第３図に示すよう
に、金属環１の内径部８にその内径d2と略同一の
外径で、内径部８の容積と略同一の体積を有する
透明なガラス円板９を嵌挿し、封着穴６の底面ｂ
上に載置する。而してから、全体を加熱炉等に入
れて、ガラス円板９を加熱溶融させる。すると溶
融ガラスは金属環１の内周面ａの酸化膜７′とな
じんで接着し、溶融ガラスの下面は封着穴６の底
面ｂに接してフラツトに形成され、溶融ガラスの
上面は自由表面に仕上がつて、第４図に示すよう
に金属環内径部８にガラス２が封着される。 Incidentally, a metal-to-glass sealed body such as the above-mentioned cap has conventionally been manufactured through the following steps. First, as shown in FIG. 2, the metal ring 1 is inserted into the sealing hole 6 formed on the upper surface of the sealing jig 5. An oxide film 7 is preliminarily formed on the entire surface of the metal ring 1 to improve compatibility with the molten glass, and the sealing jig 5 is made of graphite to which the molten glass does not adhere. . Also, the sealing hole 6 has an outer diameter d 1 of the metal ring 1.
The metal ring 1 is placed on the flat bottom surface b of the hole, which has an inner diameter that is approximately the same as that of the hole. Next, as shown in FIG. 3, a transparent glass disk 9 having an outer diameter that is approximately the same as the inner diameter d 2 and a volume that is approximately the same as the volume of the inner diameter portion 8 is fitted onto the inner diameter portion 8 of the metal ring 1. Bottom surface b of insertion and sealing hole 6
Place it on top. After that, the whole is placed in a heating furnace or the like, and the glass disk 9 is heated and melted. Then, the molten glass blends with and adheres to the oxide film 7' on the inner peripheral surface a of the metal ring 1, the lower surface of the molten glass is formed flat in contact with the bottom surface b of the sealing hole 6, and the upper surface of the molten glass is formed as a free surface. After finishing, the glass 2 is sealed to the inner diameter portion 8 of the metal ring as shown in FIG.
ところがこのような製造方法には次の問題点が
あつた。まず、ガラス２の上面は自由表面として
形成されるために平滑であり、従つてここを通過
する光は乱反射されることなく一定方向に通過す
るが、ガラス２の下面は封着穴６の底面ｂに接し
て仕上げられるために治具当り面となる。ところ
が、封着治具５は一般に切削加工で形成され、こ
の時にどうしても表面に切削による細かい溝など
が形成されて微視的に凹凸面となり、これがため
にガラス２の下面も凹凸面となつていた。このよ
うにガラス２の下面が微視的にせよ凹凸面となる
と、ここを通る光が凹凸面で乱反射して所定方向
の光量が減少し、ガラス２の全体としての光透過
率が低下する要因となつていた。又、上記製造時
に使用するガラス円板９は、例えば長尺なガラス
棒を定寸法ずつに切断して形成されるが、光半導
体用キヤツプのようにミリ単位の小さなものの場
合はガラス円板９が非常に小型化して、その形成
や取扱いが難しかつた。 However, this manufacturing method has the following problems. First, the upper surface of the glass 2 is smooth because it is formed as a free surface, and therefore the light passing through it passes in a fixed direction without being diffusely reflected, but the lower surface of the glass 2 is the bottom surface of the sealing hole 6. Since it is finished in contact with b, it becomes the jig contact surface. However, the sealing jig 5 is generally formed by cutting, and at this time, fine grooves and the like are inevitably formed on the surface by cutting, resulting in a microscopically uneven surface, and as a result, the lower surface of the glass 2 also becomes an uneven surface. Ta. If the bottom surface of the glass 2 is microscopically uneven in this way, the light that passes through it will be diffusely reflected by the uneven surface, reducing the amount of light in a given direction, which is a factor that reduces the overall light transmittance of the glass 2. It was becoming. Further, the glass disk 9 used in the above manufacturing process is formed, for example, by cutting a long glass rod into pieces of a fixed size, but in the case of a small item on the millimeter scale such as an optical semiconductor cap, the glass disk 9 is has become extremely small, making it difficult to form and handle.
本発明は上記従来の問題点に鑑み、これを解決
したもので、作業性が良く、而も封着ガラスの上
下表面を自由表面に仕上げる金属対ガラス封着体
の製造方法を提供する。以下、本発明を第５図乃
至第８図に示す製造過程に従つて順次説明する。 The present invention has been made in view of the above-mentioned conventional problems, and provides a method for manufacturing a metal-to-glass sealed body, which has good workability and can finish the upper and lower surfaces of the sealed glass as free surfaces. Hereinafter, the present invention will be sequentially explained according to the manufacturing process shown in FIGS. 5 to 8.
本発明は製造に際し、第５図に示すような金属
環１０とガラス円板１１、及び封着治具１２を用
意する。この金属環１０は内周面ｃにだけ酸化膜
１３が被着形成され、他の表面には金属環１０の
形成材料を露出させる。例えば金属環１０をFe
で形成すると、内周面ｃにはFe3O4やFe2O3の酸
化膜１３が形成されてガラスとのなじみが良くな
り、他の表面はFeの地肌のままでガラスとのな
じみが悪くなる。又、この金属環１０の製造は例
えば次の順序で行う。まずリング状に金属環１０
を形成しから、その全表面に酸化膜を形成する。
次に全面酸化された金属環１０を複数個一括して
回転ドラム内に研磨材と共に入れる。この研磨材
は金属環１０の内径D2より大きな外径の球状体
を用いる。そして、回転ドラムを回転させて金属
環１０と研磨材とを一緒にして転動させると、金
属環１０の内周面ｃを除く表面に研磨材が当り、
内周面ｃを除く表面の酸化膜が除去されて、第５
図に示す金属環１０が一括して複数個得られる。 When manufacturing the present invention, a metal ring 10, a glass disk 11, and a sealing jig 12 as shown in FIG. 5 are prepared. This metal ring 10 has an oxide film 13 deposited only on the inner peripheral surface c, and the material for forming the metal ring 10 is exposed on the other surfaces. For example, the metal ring 10 is Fe
When formed, an oxide film 13 of Fe 3 O 4 or Fe 2 O 3 is formed on the inner circumferential surface c, which improves compatibility with the glass, while the other surfaces remain as bare Fe and become compatible with the glass. Deteriorate. Further, the production of the metal ring 10 is performed, for example, in the following order. First, make a ring-shaped metal ring 10
After that, an oxide film is formed on the entire surface.
Next, a plurality of metal rings 10, which have been completely oxidized, are placed in a rotating drum together with an abrasive material. As this abrasive material, a spherical body having an outer diameter larger than the inner diameter D 2 of the metal ring 10 is used. Then, when the rotating drum is rotated and the metal ring 10 and the abrasive material are rolled together, the abrasive material hits the surface of the metal ring 10 except for the inner circumferential surface c.
The oxide film on the surface except for the inner peripheral surface c is removed, and the fifth
A plurality of metal rings 10 shown in the figure are obtained at once.
又、第５図のガラス円板１１は金属環１０の外
径D1と略同一の外径D3で、金属環１０の内径部
１４の容積と略同一の体積を有する透明なガラス
円板を用いる。又、封着治具１２は上面に金属環
１０を嵌着する封着穴１５を有するグラフアイト
製のもので、封着穴１５の深さは金属環１０とガ
ラス円板１１の厚さの合計とほぼ同一にしてあ
り、又、封着穴１５のフラツトな底面ｄの中央部
には金属環１０の内径D2より若干大きな内径の
逃げ穴１６が形成されている。 Further, the glass disk 11 in FIG. 5 is a transparent glass disk having an outer diameter D 3 that is approximately the same as the outer diameter D 1 of the metal ring 10 and a volume that is approximately the same as the volume of the inner diameter portion 14 of the metal ring 10. Use. The sealing jig 12 is made of graphite and has a sealing hole 15 on its upper surface into which the metal ring 10 is fitted, and the depth of the sealing hole 15 is equal to the thickness of the metal ring 10 and the glass disk 11. In addition, an escape hole 16 having an inner diameter slightly larger than the inner diameter D2 of the metal ring 10 is formed in the center of the flat bottom surface d of the sealing hole 15.
次に上記封着治具１２を用いた金属環１０への
ガラス封着動作を説明する。まず、第６図に示す
ように、封着穴１５に金属環１０を嵌挿し、更に
金属環１０上にガラス円板１１を嵌める。而し
て、全体を加熱炉等に入れてガラス円板１１を融
点まで加熱する。するとガラス円板１１は金属環
１０上で溶融するが、金属環１０の上面はFe等
の素地であるために溶融ガラスがなじまず、従つ
てまず第７図に示すように溶融ガラス１７はその
粘性と表面張力でもつて金属環１０の内径部１４
上端部分上に溜まつてから、ガラスとのなじみ性
の良い酸化膜１３のある内径部１４へ流入する。
そして、溶融ガラス１７は内径部１４の酸化膜１
３に接着し、この時溶融ガラス１７の上面は従来
同様に自由表面となる。一方、溶融ガラス１７が
金属環１０の下面となじまず、更に内径部１４の
下方に逃げ穴１６があるため、溶融ガラス１７の
下面は酸化膜１３の下端より表面張力と粘性でも
つて自由表面に形成される。そして、溶融ガラス
１７が冷却すると第８図に示すように、金属環内
径部１４に上下面が自由表面のガラス１８が封着
される。このガラス１８は光半導体用キヤツプの
ように金属環１０の内径D2が比較的小さい場合
は、第８図に示すようにガラス下面が内径部１４
側に少し入つた凹形に形成され、又内径D2が比
較的大きい場合は、溶融ガラス１７の粘性や表面
張力にもよるがガラス１８の下面は逃げ穴１６の
空間へ膨出した凸形となる。 Next, the operation of sealing glass to the metal ring 10 using the sealing jig 12 will be described. First, as shown in FIG. 6, the metal ring 10 is fitted into the sealing hole 15, and then the glass disk 11 is fitted onto the metal ring 10. The whole is then placed in a heating furnace or the like and the glass disk 11 is heated to its melting point. Then, the glass disk 11 melts on the metal ring 10, but since the upper surface of the metal ring 10 is made of Fe or the like, the molten glass does not blend in with it. Due to viscosity and surface tension, the inner diameter portion 14 of the metal ring 10
After accumulating on the upper end portion, it flows into the inner diameter portion 14 where there is an oxide film 13 that has good compatibility with glass.
Then, the molten glass 17 is coated with the oxide film 1 on the inner diameter portion 14.
At this time, the upper surface of the molten glass 17 becomes a free surface as in the conventional case. On the other hand, since the molten glass 17 does not fit in with the lower surface of the metal ring 10 and there is an escape hole 16 below the inner diameter part 14, the lower surface of the molten glass 17 is moved closer to the free surface by surface tension and viscosity than the lower end of the oxide film 13. It is formed. Then, when the molten glass 17 cools down, the glass 18 whose upper and lower surfaces are free surfaces is sealed to the inner diameter portion 14 of the metal ring, as shown in FIG. When the inner diameter D 2 of the metal ring 10 is relatively small, as in the case of an optical semiconductor cap, the lower surface of the glass 18 is connected to the inner diameter portion 14 as shown in FIG.
If the inner diameter D2 is relatively large, the lower surface of the glass 18 will have a convex shape that bulges into the space of the relief hole 16, depending on the viscosity and surface tension of the molten glass 17. becomes.
尚、本発明は光半導体用キヤツプの金属対ガラ
ス封着体の製造方法に限らない。 Note that the present invention is not limited to the method of manufacturing a metal-to-glass sealed body of an optical semiconductor cap.
以上説明したように、本発明によれば封着され
たガラスの上下面が自由表面の平滑面となるの
で、ガラスの光透過率が向上し、特に光半導体用
キヤツプの製造に適用した場合に光半導体装置の
応答特性等が改善される。又、製造時に用いるガ
ラス円板は金属環の外径程度の大きさでいいか
ら、ガラス円板が比較的大きくなつて、その形成
や取扱いが容易になり、作業性が向上する。 As explained above, according to the present invention, the upper and lower surfaces of the sealed glass become free and smooth surfaces, so the light transmittance of the glass is improved, and this is particularly useful when applied to the manufacture of caps for optical semiconductors. The response characteristics and the like of the optical semiconductor device are improved. Furthermore, since the glass disk used during manufacturing can be as large as the outer diameter of the metal ring, the glass disk can be relatively large, making it easier to form and handle, and improving workability.
第１図は光半導体用キヤツプの一例を示す断面
図、第２図乃至第４図は第１図キヤツプ（金属対
ガラス封着体）の従来の製造方法を説明する各工
程での断面図、第５図乃至第８図は本発明による
製造方法の一例を説明する各工程での断面図であ
る。
１０……金属環、１１……ガラス円板、１２…
…封着治具、１３……酸化膜、１４……内径部、
１７……溶融ガラス、１８……ガラス。
FIG. 1 is a cross-sectional view showing an example of an optical semiconductor cap, and FIGS. 2 to 4 are cross-sectional views at each step illustrating the conventional manufacturing method of the cap (metal-to-glass sealed body) shown in FIG. FIGS. 5 to 8 are cross-sectional views at each step for explaining an example of the manufacturing method according to the present invention. 10...metal ring, 11...glass disk, 12...
... Sealing jig, 13 ... Oxide film, 14 ... Inner diameter part,
17...molten glass, 18...glass.
Claims (1)
と、 (b) 前記酸化膜を形成した多数の金属環をバレル
研磨して、内周面にのみ酸化膜を残して残余の
酸化膜を除去する工程と、 (c) 上記金属環を、その外径と略同一の内径を有
しその厚さより深くかつ底部に金属環の内径よ
りも大きい逃げ穴を有する封着治具の封着穴内
に配置し、この金属環の上に金属環の外径と略
同一の外径を有するガラス板を載置する工程
と、 (d) このガラス板を加熱溶融して金属環内径部に
流入させて、上下面を溶融ガラスの表面張力で
自由表面にして封着する工程とを含むことを特
徴とする金属対ガラス封着体の製造方法。[Claims] 1. (a) A step of forming an oxide film on the entire surface of a metal ring; (b) Barrel polishing a large number of metal rings on which the oxide film has been formed, so that an oxide film is formed only on the inner peripheral surface. (c) removing the remaining oxide film while leaving the metal ring; (d) placing a glass plate in the sealing hole of the sealing jig and having an outer diameter substantially the same as the outer diameter of the metal ring on top of the metal ring; (d) heating and melting the glass plate; 1. A method for producing a metal-to-glass sealed body, comprising the step of: causing the glass to flow into the inner diameter part of the metal ring, and sealing the upper and lower surfaces of the molten glass by using the surface tension of the molten glass as free surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7116780A JPS56167369A (en) | 1980-05-27 | 1980-05-27 | Manufacture of sealing body of metal and glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7116780A JPS56167369A (en) | 1980-05-27 | 1980-05-27 | Manufacture of sealing body of metal and glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56167369A JPS56167369A (en) | 1981-12-23 |
| JPS6248911B2 true JPS6248911B2 (en) | 1987-10-16 |
Family
ID=13452814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7116780A Granted JPS56167369A (en) | 1980-05-27 | 1980-05-27 | Manufacture of sealing body of metal and glass |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56167369A (en) |
-
1980
- 1980-05-27 JP JP7116780A patent/JPS56167369A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56167369A (en) | 1981-12-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5813501B2 (en) | Manufacturing method for meniscus lenses for glass-coated eyeglasses | |
| US4971423A (en) | Gradient-index-type optical device | |
| JP2577055B2 (en) | Glass mold | |
| JPS6248911B2 (en) | ||
| US2744034A (en) | Method of flashing glass articles | |
| JPH021779B2 (en) | ||
| US2112659A (en) | Method of making lenses | |
| US2342609A (en) | Manufacture of glass headers for electron tubes and the like | |
| JPS62297225A (en) | Glass for pressed lens and production of pressed lens | |
| JPH0146453B2 (en) | ||
| JPS6236980B2 (en) | ||
| JPH0692654A (en) | Method for molding glass lens | |
| JPH0712940B2 (en) | Glass lens molding method | |
| JP2636010B2 (en) | Glass material for molding and method for producing the same | |
| JPS5941309B2 (en) | Lens cap manufacturing method | |
| JPH01232639A (en) | Manufacture of stem for cathode-ray tube | |
| JPH05279062A (en) | Method for molding glass lens | |
| JPH0692650A (en) | Production of optical glass lens | |
| JPH01115842A (en) | Formed glass lens | |
| JPH0542372B2 (en) | ||
| JPS6220136B2 (en) | ||
| JPH0360780B2 (en) | ||
| JP3219460B2 (en) | Optical element mold and method of manufacturing the same | |
| JPS59227745A (en) | Production of optical fiber | |
| JPS5948771B2 (en) | Optical fiber manufacturing method |